200920539 九、發明說明： 【發明所屬之技術領域3 發明領域 本發明係有關於一種附設在用以切削半導體晶圓等之 5 被加工物之切削裝置等之加工裝置，並且用以處理加工時 所供給之加工液之廢液之加工廢液處理裝置。 【先前技術;3 發明背景 半導體元件製造程序中，係在為大略圓板形狀之半導 ίο 體晶圓的表面，藉由配列成格子狀被稱為溝道之分割預定 線，規劃出複數之領域，並於該規劃出之領域形成1C、LSI 等元件。接著，沿著溝道切斷半導體晶圓，藉此分割成形 成有元件之領域，製造各個半導體元件。又，在藍寶石基 板之表面上積層有氮化鉀系化合物半導體之光元件晶圓， 15 也沿著溝道割斷，藉此分割成各個發光二極體、雷射二極 體等光元件，並廣泛利用於電氣機器。 沿著上述之半導體晶圓或光元件晶圓等之溝道之切 斷，一般係藉由稱為切塊機之切削裝置進行。該切削裝置 具有：用以保持半導體晶圓等之被加工物之夾頭台；具有 20 用以切削保持於該夾頭台之被加工物之切削刀片之切削機 構；及將加工水供給到切削刀片之加工水供給機構，藉由 該加工水供給機構將切削水供給到旋轉之切削刀片，以冷 卻切削刀片，並且將加工水供給到切削刀片之被加工物切 削部，實施切削作業。 5 200920539 如上所述，在切削時於供給之加工液中會混入因切削 矽或氮化鉀系化合物半導體所產生之切削屑。由於混入有 由該半導體素材構成之切削屑之加工廢液會汙染環境，因 此使用廢液處理裝置除去切削屑後，會再利用或予以廢 5 棄。（參照如專利文獻1) 【專利文獻1】日本專利公開公報特開第2004-230527 號 【發明内容3 發明概要 10 發明欲解決之課題 而且，雖然廢液處理裝置配設有用以分離切削屑之過 濾器，但要確實分離切削屑則必須使用網眼較細之過濾 器。可確實分離切削屑之網眼較細之過濾器價錢較高，未 必能符合經濟效益。 15 本發明係有鑒於上述事實而作成者，其主要之技術課 題係提供一種即使為網眼較粗之過濾器，亦可確實分離切 削屑等之加工屑之廢液處理裝置。 為解決上述主要之技術課題，根據本發明，本發明之 加工廢液處理裝置，係用以處理在加工裝置進行加工時， 20 因加工產生之加工屑混入供給之加工液之加工廢液者，包 含有：用以收容加工廢液之廢液槽；用以供應收容於該廢 液槽之加工廢液之泵；及用以過濾由該泵所供應之加工廢 液之過濾器，其中該過濾器具有：形成筒狀之濾紙；用以 覆蓋該筒狀濾紙之外周，並且在側面具有複數開口之筒 200920539 體；用以封閉該筒狀濾紙之下端之底板；及用以封閉該筒 狀濾紙之上端，並且具有導入由該泵所供應之加工廢液之 廢液導入口之頂板，又，於該筒狀濾紙内投入有微粒子粉 體。 5 前述微粒子粉體係由粒徑為0.5〜2.0//m之矽所構成。 根據本發明，由於微粒子粉體投入至構成過濾器之筒 狀濾紙内，因此該微粒子粉體會附著於筒狀濾紙之内面， 提高過濾效率，故可確實地分離混入至加工廢液之加工 屑。因此，可使用網眼較粗之便宜濾、紙。 10 【實施方式】 較佳實施例之詳細說明 以下參照添附圖式詳細說明依據本發明構成之加工廢 液處理裝置之較佳實施型態。 第1圖係顯示依據本發明所構成之加工廢液處理裝置 15 之要部立體圖，第2圖係顯示第1圖所示之加工廢液處理裝 置之要部分解立體圖。 圖示之實施型態之加工廢液處理裝置具有：用以收容 加工廢液之廢液槽2 ;用以供應收容於該廢液槽2之加工廢 液之泵3 ;用以過濾由該泵3所供應之加工廢液之第1過濾器 20 4a及第2過濾器4b。 廢液槽2在端壁具有廢液流入口 21，該廢液流入口 21 連接於裝設在未圖示之切削裝置等之加工裝置之加工廢液 送出機構。於該廢液槽2之上壁配設有用以供應加工廢液之 泵3。如此構成之廢液槽2配設於支持基台5的上面。 7 200920539 第1過濾器4a及第2過濾器4b分別具有：形成筒狀之慮 紙41、覆蓋該濾紙41之外周之筒體42、封閉筒狀濾紙41之 下端之底板43、及封閉筒狀濾紙41之上端之頂板44。筒狀 濾紙41構成為複數摺疊形成放射狀’可増大過濾面積。再 5 者’筒狀濾'紙41係使用例如粒徑在〇·3〜0.4" m以下之粒子 可通過之網眼且較便宜之濾紙。覆蓋該筒狀濾紙41外周之 筒體42於側面形成有複數開口421。又，封閉上述筒狀濾紙 41之上端之頂板44於中央部設有廢液導入口 44卜如此構成 之第1過濾器4a及第2過濾器4b中’於筒狀濾紙41内投入由 10 粒徑0.5〜2.0//m之矽構成之微粒子粉體40。如此構成之第i ,過濾器4a及第2過濾器4b配設於過濾器架6上，且該過濾器 架6係配置於配設在支持基台5之廢液槽2之上側。 過濾器架6具有：形成矩形之底壁61 ;由該底壁61之兩 側緣豎立設置之側壁62、63 ;及由底壁61之兩端緣登立設 15 置之端壁64、65，且由4支支持枉66所支持，並且配置於配 設在前述支持基台5之廢液槽2之上側。過濾器架6藉由側壁 62、63及端壁64、65而形成用以收容經前述第1過濾器4a及 第2過滤器42分離出加工屑之過滤完成加工液之加工液貯 留槽60。而且，在構成過濾器架6之底壁61設有用以排出貯 2〇 留在加工液貯留槽60之過慮完成加工液之排出口 611。再 者，該排出口 611連接於裝設在未圖示之加工裝置之加工液 供給機構或廢棄機構。又，構成過濾器架6之底壁61上面配 設有用以支持前述第1過濾器4 a及第2過濾器4 b之第1支持 台67a及第2支持台67b。於該第1支持台67a及第2支持台67b 200920539 上載置有前述第1過濾器4a及第2過濾器4b。 其次’參照第3圖說明用以將收容於前述廢液槽2之加 工廢液供應至前述第1過濾器4a及第2過濾器4b之加工廢液 供應機構。 5 第3圖所示之加工廢液供應機構7具有：用以供應收容 於别述廢液槽2之加工廢液之泵3 ;連接於該泵3之配管71 ; 用以連接該配管71與第1過濾器4a之廢液導入口 441及第2 過渡器4b之廢液導入口 441之配管71a、71b ;及配設於該配 管71與配管71a及71b之間之電磁切換閥72。該電磁切換閥 10 72在切除勢能(OFF)之狀態下切斷配管71與配管71a及配管 71b的連通，並且當賦與其中一電磁線圈72a勢能(〇N)時， 則連通配管71與配管71a，當賦與另一電磁線圈72b勢能(ON) 時，則連通配管71與配管71b。再者，配管71a及配管71b配 設有用以檢測供應到第1過濾器4a及第2過濾器4b之加工廢 15液之壓力之第1壓力檢測機構73a及第2壓力檢測機構73b。 該第1壓力檢測機構73a及第2壓力檢測機構73b將該檢測信 號送到後述之控制機構。 參照第3圖繼續說明，圖示之實施型態之加工廢液處理 裝置具有：將壓縮空氣供給到前述第1過濾器4a及第2過濾 2〇器4b之壓縮空氣供給機構8。壓縮空氣供給機構8具有：壓 縮空氣源81 ;連接該壓縮空氣源81與前述加工廢液供給機 構7之配管71a及配管71b之配管82a及配管82b ;及分別配設 於該配管82a及配管82b之第1比例電磁式減壓閥83a及第2 比例電磁式減壓閥83b。 9 200920539 圖示之實施型態中之加工廢液處理裝置具有控制 機礼制機構9係輸人來自前述壓力檢測機構73a、73b 之壓力信號，並將控制信號輸出到前述泵3、電磁切換閥 72、第1比例電磁式減壓閥83a及第2比例電磁式減壓閥 5請。該控制機構9載置於前述支持基台5之上面。 圖示之實施型態中之加工廢液處理裝置係如以上所構 成，以下就其作用加以說明。 在處理收容於廢液槽2之加工廢液時，控制機構9首先 使泵3作動，並且賦與電磁切換閥72之其中一電磁線圈72a 10勢能（0N)。結果，由泵3所供應之加工廢液經過配管71、電 磁切換閥72、配管71a'及廢液導入口 441導入至第1過濾器 4a。導入至第丨過濾器4a之加工廢液透過筒狀濾紙41而過 遽，並且通過在覆蓋筒狀濾紙41之外周之筒體42之側面所 形成之複數開口 421，流出至過濾器架6之加工液貯留槽 15 60。此時’投入到第1過濾器4a内之矽所構成之微粒子粉體 4〇附著於筒狀濾紙41之内面，並提高過遽性能，因此可確 實地分離混入於加工廢液之加工屑。因此，< 不使用網眼 較細的高價濾紙，而可確實地分離加工屬。如上所述，流 出至過濾器架6之加工液貯留槽60之過滤後加工液，由排出 20 口 611藉由裝設在未圖示之加工裝置之加工液供給機構而 再循環，或者經由廢棄機構而廢棄。 再者，如上所述’將加工廢液導入第1過慮器4a時’控 制機構9對壓縮空氣供給機構8之第1比例電磁式減壓閥83a 職與勢能（ON) ’炎且控制施加電签使流出壓力為如1 ·5氣 200920539 壓。該結果是壓縮空氣源81之壓縮空氣藉由第1比例電磁式 減壓閥83a而減減壓成1.5氣壓，並且經由配管71b及廢液導 入口 441而導入至第1比例電磁式減壓閥乜。因此，導入至 第1過濾器4a之加工廢液產生1.5氣壓之作用。結果，投入至 5 第1過濾器如内之矽構成之微粒子粉體40會確實地附著於 筒狀遽紙41之内面，因此維持過濾效率。 如以上所述，當實施第1過濾器4a之加工廢液處理，第 1過濾器4a之筒狀濾紙41之内側會堆積加工屑。當筒狀濾紙 41之内側堆積加工屑時，加工液會變得難以通過筒狀濾紙 ° Μ，失去過濾器功能。如此，當筒狀濾紙41内側堆積加工 屑時，筒狀濾紙41内之壓力會上昇。而且，當筒狀濾紙41 内之壓力成為如2氣壓時，輸入由前述第丨壓力檢測機構73a 輪出之壓力信號之控制機構9會對電磁切換閥72之另一電 磁線圈72b賦與勢能(on)。因此，切斷配管71與配管71a之 15連通，連通配管71、配管71b。結果，由泵3供應之加工廢 液經由配管71、電磁切換閥72、配管71b及廢液導入口 441 導^至第2過遽器4b。又，控制機構9對壓縮空氣供給機構8 之第2比例電磁式減壓閥83b賦與勢能(〇N)，並且控制施加 壓力使流出壓力成為如15氣壓。結果，由栗3所供應之加 工廢液藉由第2過渡器4b而與第1過濾、器4a同樣處理。 另一方面’控制機構9控制施加電壓使壓縮空氣供給機 構8之第1比例電磁式減壓閥8 3之流出壓力為例如3氣壓。結 V邊於第1過據器如之闾狀滤紙41之内側之加工廢液會 強制過遽’通過形成於覆蓋筒狀濾紙41之外周之筒體42之 200920539 側面之複數開口 421，使之流出至過濾器架6之加工液貯流 槽60。而且，若控制施加電壓使第1比例電磁式減壓閥83a 之流出壓力成為如3氣壓後，經過預定時間，控制機構9會 對第1比例電磁式減壓閥83a解除勢能（OFF)。如此，若排出 5 滯留於第1過濾器4a之筒狀濾紙41之内側之加工廢液後，則 將該過濾器廢棄而與新過濾器交換。在這期間加工廢液的 處理係如上所述由第2過濾器4b實施，因此不需要中斷加工 裝置之作業。 10 【圖式簡單說明】 第1圖係本發明中依據本發明構成之加工廢液處理之 要部立體圖。 第2圖係分解顯示第1圖所示之加工廢液處理裝置之要 部之立體圖。 15 第3圖係顯示本發明中依據本發明構成之加工廢液處 理之構成方塊圖。 【主要元件符號說明】 2…廢液槽 21.. .廢液流入口 3.. .果 4a...第1過濾器 4b···第2過濾器 41.. .筒狀濾紙 42.. .筒體 421…開口 43.. .底板 44.. .頂板 40...微粒子粉體 441...廢液導入口 12 200920539 5...支持基台 72..電磁切換閥 6...過濾器架 72a，72b...電磁線圈 60...加工液貯留槽 73a...第1壓力檢測機構 61...底壁 73b...第2壓力檢測機構 611...排出口 8...壓縮空氣供給機構 62,63...側壁 81...壓縮空氣源 64,65...端壁 82a, 82b··.配管 66…支持柱 83a...第1比例電磁式減壓閥 67a…第1支持台 83b...第2比例電磁式減壓閥 67b…第2支持台 7…加工廢液供應機構 71，71+ 71b...配管 9...控制機構 13200920539 IX. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to a processing apparatus attached to a cutting apparatus or the like for cutting a workpiece of a semiconductor wafer or the like, and is used for processing. A processing waste liquid processing device for the waste liquid of the processing liquid supplied. [Prior Art; 3 BACKGROUND OF THE INVENTION In the semiconductor device manufacturing process, the surface of a semiconductor wafer having a substantially circular plate shape is planned to be a plurality of lines arranged in a lattice shape called a channel. In the field, components such as 1C and LSI are formed in the planned area. Next, the semiconductor wafer is cut along the channel, thereby dividing into a field in which components are formed, and each semiconductor element is manufactured. Further, an optical element wafer in which a potassium nitride-based compound semiconductor is laminated on the surface of the sapphire substrate, 15 is also cut along the channel, and is divided into optical elements such as respective light-emitting diodes and laser diodes. Widely used in electrical machines. The cutting along the above-described semiconductor wafer or optical element wafer or the like is generally performed by a cutting device called a dicer. The cutting device includes: a chuck table for holding a workpiece such as a semiconductor wafer; a cutting mechanism having a cutting insert for cutting a workpiece held by the chuck table; and supplying the processing water to the cutting The machining water supply mechanism of the blade supplies the cutting water to the rotating cutting insert by the machining water supply mechanism to cool the cutting insert, and supplies the machining water to the workpiece cutting portion of the cutting insert to perform the cutting operation. 5 200920539 As described above, chips generated by cutting cesium or potassium nitride-based compound semiconductors are mixed in the supplied machining liquid during cutting. Since the processing waste liquid in which the chips composed of the semiconductor material are mixed contaminates the environment, the waste liquid processing device is used to remove the chips, and is reused or discarded. [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-230527 [Invention Summary] Summary of Invention 10 Problems to be Solved by the Invention Further, although the waste liquid processing apparatus is provided with separation for cutting chips Filter, but to make sure the separation of the chips, you must use a filter with a fine mesh. A filter with a fine mesh that can reliably separate the chips is expensive and does not necessarily meet economic benefits. The present invention has been made in view of the above-described facts, and the main technical problem thereof is to provide a waste liquid processing apparatus which can surely separate machining chips such as cutting chips even if the filter is thick. In order to solve the above-mentioned main technical problems, according to the present invention, the processing waste liquid processing apparatus of the present invention is for processing a processing waste liquid in which a machining waste generated by processing is mixed into a supply processing liquid when processing is performed in a processing apparatus. The invention comprises: a waste liquid tank for containing the processing waste liquid; a pump for supplying the processing waste liquid contained in the waste liquid tank; and a filter for filtering the processing waste liquid supplied by the pump, wherein the filtering The utility model has: a filter paper forming a cylindrical shape; a tube 200920539 body for covering the outer circumference of the cylindrical filter paper, and having a plurality of openings on the side; a bottom plate for closing the lower end of the cylindrical filter paper; and a closed filter paper for closing the cylindrical filter paper; The upper end has a top plate for introducing the waste liquid introduction port of the processing waste liquid supplied from the pump, and fine particle powder is introduced into the cylindrical filter paper. 5 The microparticle powder system is composed of a crucible having a particle diameter of 0.5 to 2.0/m. According to the present invention, since the fine particle powder is introduced into the cylindrical filter paper constituting the filter, the fine particle powder adheres to the inner surface of the cylindrical filter paper, and the filtration efficiency is improved, so that the processing chips mixed into the processing waste liquid can be surely separated. Therefore, it is possible to use an inexpensive filter or paper having a relatively large mesh. [Embodiment] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a processing waste liquid processing apparatus constructed in accordance with the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a perspective view showing a principal part of a processing waste liquid processing apparatus 15 constructed in accordance with the present invention, and Fig. 2 is a perspective view showing a main part of the processing waste liquid processing apparatus shown in Fig. 1. The processing waste liquid processing apparatus of the embodiment shown has: a waste liquid tank 2 for containing the processing waste liquid; a pump 3 for supplying the processing waste liquid contained in the waste liquid tank 2; for filtering by the pump The first filter 20 4a and the second filter 4b of the processing waste liquid supplied by 3. The waste liquid tank 2 has a waste liquid inlet 21 at the end wall, and the waste liquid inlet 21 is connected to a processing waste liquid discharging mechanism installed in a processing apparatus such as a cutting device (not shown). A pump 3 for supplying the processing waste liquid is disposed on the upper wall of the waste liquid tank 2. The waste liquid tank 2 thus configured is disposed on the upper surface of the support base 5. 7 200920539 The first filter 4a and the second filter 4b each have a cylindrical paper 41, a cylindrical body 42 covering the outer periphery of the filter paper 41, a bottom plate 43 closing the lower end of the cylindrical filter paper 41, and a closed cylindrical shape. The top plate 44 of the upper end of the filter paper 41. The tubular filter paper 41 is configured such that a plurality of folds form a radial shape to enlarge the filter area. Further, the 'cylindrical filter' paper 41 is a filter paper which is, for example, a mesh having a particle diameter of 〇·3 to 0.4 " m or less which can pass through the mesh and is relatively inexpensive. The cylindrical body 42 covering the outer circumference of the cylindrical filter paper 41 is formed with a plurality of openings 421 on the side surfaces. Further, the top plate 44 that closes the upper end of the cylindrical filter paper 41 is provided with a waste liquid introduction port 44 at the center portion. In the first filter 4a and the second filter 4b configured as described above, '10 pieces are placed in the cylindrical filter paper 41. The fine particle powder 40 composed of a crucible having a diameter of 0.5 to 2.0 / / m. In the first configuration, the filter 4a and the second filter 4b are disposed on the filter holder 6, and the filter holder 6 is disposed on the upper side of the waste liquid tank 2 disposed on the support base 5. The filter holder 6 has: a bottom wall 61 forming a rectangle; side walls 62 and 63 which are erected from both side edges of the bottom wall 61; and end walls 64 and 65 which are erected by two end edges of the bottom wall 61. It is supported by four support ports 66 and is disposed on the upper side of the waste liquid tank 2 disposed on the support base 5. The filter holder 6 is formed with a side wall 62, 63 and end walls 64, 65 to form a machining liquid storage tank 60 for accommodating the filter-finished machining liquid from which the machining waste is separated by the first filter 4a and the second filter 42. Further, the bottom wall 61 constituting the filter holder 6 is provided with a discharge port 611 for discharging the storage liquid remaining in the machining liquid storage tank 60. Further, the discharge port 611 is connected to a machining liquid supply mechanism or a disposal mechanism installed in a processing device (not shown). Further, the bottom wall 61 constituting the filter holder 6 is provided with a first support base 67a and a second support base 67b for supporting the first filter 4a and the second filter 4b. The first filter 4a and the second filter 4b are placed on the first support base 67a and the second support base 67b 200920539. Next, the processing waste liquid supply mechanism for supplying the processing waste liquid accommodated in the waste liquid tank 2 to the first filter 4a and the second filter 4b will be described with reference to Fig. 3 . 5 The processing waste liquid supply mechanism 7 shown in Fig. 3 has a pump 3 for supplying the processing waste liquid accommodated in the waste liquid tank 2, and a piping 71 connected to the pump 3, for connecting the piping 71 and The waste liquid introduction port 441 of the first filter 4a and the piping 71a, 71b of the waste liquid introduction port 441 of the second transition piece 4b; and the electromagnetic switching valve 72 disposed between the pipe 71 and the pipes 71a and 71b. The electromagnetic switching valve 10 72 cuts the communication between the pipe 71 and the pipe 71a and the pipe 71b in a state where the potential energy is cut off, and when the potential energy (〇N) of one of the electromagnetic coils 72a is given, the communication pipe 71 and the pipe 71a are connected. When the potential energy (ON) of the other electromagnetic coil 72b is given, the pipe 71 and the pipe 71b are communicated. Further, the pipe 71a and the pipe 71b are provided with a first pressure detecting mechanism 73a and a second pressure detecting mechanism 73b for detecting the pressure of the processing waste liquid 15 supplied to the first filter 4a and the second filter 4b. The first pressure detecting means 73a and the second pressure detecting means 73b send the detection signal to a control means to be described later. Referring to Fig. 3, the processing waste liquid processing apparatus of the embodiment shown in the drawings has a compressed air supply mechanism 8 that supplies compressed air to the first filter 4a and the second filter unit 4b. The compressed air supply unit 8 includes a compressed air source 81, a pipe 81a and a pipe 82b that connect the compressed air source 81 to the piping 71a of the processing waste liquid supply mechanism 7 and the piping 71b, and are disposed in the piping 82a and the piping 82b, respectively. The first proportional electromagnetic pressure reducing valve 83a and the second proportional electromagnetic pressure reducing valve 83b. 9 200920539 The processing waste liquid processing apparatus in the illustrated embodiment has a control machine mechanism 9 that inputs pressure signals from the pressure detecting mechanisms 73a and 73b, and outputs control signals to the pump 3 and the electromagnetic switching valve. 72. The first proportional electromagnetic pressure reducing valve 83a and the second proportional electromagnetic pressure reducing valve 5 are required. The control mechanism 9 is placed on top of the aforementioned support base 5. The processing waste liquid processing apparatus in the embodiment shown in the figure is constructed as described above, and its operation will be described below. When processing the processing waste liquid contained in the waste liquid tank 2, the control mechanism 9 first activates the pump 3 and imparts a potential energy (0N) to one of the electromagnetic coils 72a 10 of the electromagnetic switching valve 72. As a result, the processing waste liquid supplied from the pump 3 is introduced into the first filter 4a via the pipe 71, the electromagnetic switching valve 72, the pipe 71a', and the waste liquid introduction port 441. The processing waste liquid introduced into the second filter 4a passes through the tubular filter paper 41, and flows out to the filter holder 6 through a plurality of openings 421 formed on the side surface of the cylindrical body 42 covering the outer circumference of the cylindrical filter paper 41. Processing fluid storage tank 15 60. At this time, the fine particle powder 4〇 composed of the crucible that has been placed in the first filter 4a adheres to the inner surface of the tubular filter paper 41, and the over-permeability is improved. Therefore, the machining waste mixed in the processing waste liquid can be surely separated. Therefore, < does not use a high-priced filter paper having a fine mesh, and can reliably separate the processing genus. As described above, the filtered working fluid that has flowed out to the machining liquid storage tank 60 of the filter holder 6 is recirculated by the discharge port 20 611 by the machining liquid supply mechanism installed in the processing device (not shown), or is discarded. Discarded by the organization. Further, as described above, when the processing waste liquid is introduced into the first filter 4a, the control unit 9 applies the electric power to the first proportional electromagnetic pressure reducing valve 83a of the compressed air supply mechanism 8 and the control. The signing pressure is such as 1 · 5 gas 200920539 pressure. As a result, the compressed air of the compressed air source 81 is reduced to 1.5 atm by the first proportional electromagnetic pressure reducing valve 83a, and introduced into the first proportional electromagnetic pressure reducing valve via the pipe 71b and the waste liquid introduction port 441. Hey. Therefore, the processing waste liquid introduced into the first filter 4a functions as 1.5 atm. As a result, the fine particle powder 40 which is placed in the first filter, such as the inside of the first filter, adheres to the inner surface of the cylindrical paper 41, thereby maintaining the filtration efficiency. As described above, when the processing waste liquid treatment of the first filter 4a is performed, machining chips are accumulated inside the cylindrical filter paper 41 of the first filter 4a. When the machining waste is accumulated on the inside of the cylindrical filter paper 41, the working fluid becomes difficult to pass through the cylindrical filter paper, and the filter function is lost. As described above, when the processing chips are deposited on the inside of the cylindrical filter paper 41, the pressure in the tubular filter paper 41 rises. Further, when the pressure in the cylindrical filter paper 41 becomes 2 atm, the control means 9 that inputs the pressure signal rotated by the second pressure detecting means 73a imparts potential energy to the other electromagnetic coil 72b of the electromagnetic switching valve 72 ( On). Therefore, the cut pipe 71 communicates with the pipe 71a 15, and the pipe 71 and the pipe 71b are communicated. As a result, the processing waste liquid supplied from the pump 3 is guided to the second damper 4b via the pipe 71, the electromagnetic switching valve 72, the pipe 71b, and the waste liquid introduction port 441. Further, the control means 9 applies the potential energy (?N) to the second proportional electromagnetic pressure reducing valve 83b of the compressed air supply means 8, and controls the applied pressure so that the outflow pressure becomes 15 atmospheres. As a result, the processing waste liquid supplied from the pump 3 is treated in the same manner as the first filter 4a by the second transition unit 4b. On the other hand, the control means 9 controls the applied voltage so that the outflow pressure of the first proportional electromagnetic pressure reducing valve 83 of the compressed air supply means 8 is, for example, 3 atmospheres. The processing waste liquid on the inner side of the first filter such as the braided filter paper 41 is forced to pass through a plurality of openings 421 formed on the side of 200920539 of the cylindrical body 42 covering the outer circumference of the cylindrical filter paper 41. The processing fluid storage tank 60 flows out to the filter holder 6. When the applied voltage is controlled so that the outflow pressure of the first proportional electromagnetic pressure reducing valve 83a becomes 3 atmospheres, the control mechanism 9 releases the potential energy (OFF) to the first proportional electromagnetic pressure reducing valve 83a after a predetermined time elapses. When the processing waste liquid remaining inside the cylindrical filter paper 41 of the first filter 4a is discharged, the filter is discarded and exchanged with the new filter. Since the processing of the processing waste liquid during this period is carried out by the second filter 4b as described above, it is not necessary to interrupt the operation of the processing apparatus. 10 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of essential parts of a processing waste liquid constructed in accordance with the present invention in the present invention. Fig. 2 is a perspective view showing the essential part of the processing waste liquid processing apparatus shown in Fig. 1 in an exploded manner. 15 Fig. 3 is a block diagram showing the construction of the processing waste liquid constructed in accordance with the present invention in the present invention. [Description of main component symbols] 2... Waste tank 21.. Waste liquid inlet 3.. Fruit 4a... 1st filter 4b··· 2nd filter 41.. Tube filter 42.. The cylinder 421...the opening 43..the bottom plate 44..the top plate 40...the fine particle powder 441...the waste liquid introduction port 12 200920539 5...the support base 72.the electromagnetic switching valve 6... Filter holders 72a, 72b, electromagnetic coils 60, processing liquid storage tanks 73a, first pressure detecting means 61, bottom wall 73b, second pressure detecting means 611, discharging ports 8, ...compressed air supply mechanism 62, 63...side wall 81...compressed air source 64,65...end wall 82a, 82b··.pipe 66...support column 83a...first proportional electromagnetic reduction Pressure valve 67a...first support table 83b...second proportional electromagnetic pressure reducing valve 67b...second support table 7...processing waste liquid supply mechanism 71, 71+ 71b...pipe 9...control mechanism 13