JP2009095941A - Machining waste liquid processing device - Google Patents

Machining waste liquid processing device Download PDF

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JP2009095941A
JP2009095941A JP2007270493A JP2007270493A JP2009095941A JP 2009095941 A JP2009095941 A JP 2009095941A JP 2007270493 A JP2007270493 A JP 2007270493A JP 2007270493 A JP2007270493 A JP 2007270493A JP 2009095941 A JP2009095941 A JP 2009095941A
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waste liquid
machining
processing
filter
filter paper
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Takeshi Furonaka
武 風呂中
Miki Yoshida
幹 吉田
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2007270493A priority Critical patent/JP2009095941A/en
Priority to TW097131912A priority patent/TWI422457B/en
Priority to SG200806866-0A priority patent/SG152129A1/en
Priority to KR1020080093116A priority patent/KR20090039606A/en
Priority to CN2008101685922A priority patent/CN101412194B/en
Priority to DE102008042817.5A priority patent/DE102008042817B4/en
Publication of JP2009095941A publication Critical patent/JP2009095941A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B23Q11/1069—Filtration systems specially adapted for cutting liquids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Filtration Of Liquid (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a waste liquid processing device capable of surely separating machining chips such as cut chips even by a filter having a comparatively coarse mesh. <P>SOLUTION: This machining waste liquid processing device performs processing of the machining waste liquid mixed with machining chips generated by machining in machining liquid supplied when performing machining in a machining device. The machining waste liquid processing device is provided with a waste liquid tank 2 for storing machining waste liquid, a pump 3 for feeding the machining waste liquid stored in the waste liquid tank 2, and filters 4a and 4b for filtering the machining waste liquid fed by the pump 3. Each of the filters 4a and 4b is constituted of filter paper 41 formed into a cylindrical shape, a cylindrical body 42 covering an outer periphery of the cylindrical filter 41 and provided with a plurality of openings on a side surface, a bottom plate 43 closing a lower end of the filter paper 41, and a top plate 44 closing an upper end of the filter paper 41 and provided with a waste liquid introduction port 441 for introducing the machining waste liquid fed by the pump 3. Particle powder 40 is projected into the filter paper 41. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、半導体ウエーハ等の被加工物を切削する切削装置等の加工装置に付設され、加工時に供給される加工液の廃液を処理する加工廃液液処理装置に関する。   The present invention relates to a processing waste liquid processing apparatus that is attached to a processing apparatus such as a cutting apparatus that cuts a workpiece such as a semiconductor wafer and processes a waste liquid of a processing liquid supplied during processing.

半導体デバイス製造工程においては、略円板形状である半導体ウエーハの表面に格子状に配列されたストリートと呼ばれる分割予定ラインによって複数の領域が区画され、この区画された領域にＩＣ、ＬＳＩ等のデバイスを形成する。そして、半導体ウエーハをストリートに沿って切断することによりデバイスが形成された領域を分割して個々の半導体デバイスを製造している。また、サファイヤ基板の表面に窒化ガリウム系化合物半導体等が積層された光デバイスウエーハもストリートに沿って切断することにより個々の発光ダイオード、レーザーダイオード等の光デバイスに分割され、電気機器に広く利用されている。   In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor devices. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into individual optical devices such as light emitting diodes and laser diodes by cutting along the streets, and are widely used in electrical equipment. ing.

上述した半導体ウエーハや光デバイスウエーハ等のストリートに沿った切断は、通常、ダイサーと呼ばれる切削装置によって行われている。この切削装置は、半導体ウエーハ等の被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削するための切削ブレードを備えた切削手段と、切削ブレードに加工水を供給する加工水供給手段を具備し、該加工水供給手段によって切削水を回転する切削ブレードに供給することにより切削ブレードを冷却するとともに、切削ブレードによる被加工物の切削部に加工水を供給しつつ切削作業を実施する。   Cutting along the streets of the above-described semiconductor wafer, optical device wafer or the like is usually performed by a cutting device called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a semiconductor wafer, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and supplying processing water to the cutting blade. A cutting water supply means for cooling the cutting blade by supplying the cutting water to the cutting blade that rotates, and supplying the cutting water to the cutting portion of the workpiece by the cutting blade. Carry out cutting work.

上述したように切削時に供給された加工液にはシリコンや窒化ガリウム系化合物半導体を切削することによって発生する切削屑が混入される。この半導体素材からなる切削屑が混入された加工廃液は環境を汚染することから、廃液処理装置を用いて切削屑を除去した後に、再利用したり廃棄している。（例えば、特許文献１参照。）
特開２００４−２３０５２７号公報 As described above, cutting waste generated by cutting silicon or a gallium nitride compound semiconductor is mixed in the machining fluid supplied at the time of cutting. Since the processing waste liquid mixed with the cutting waste made of this semiconductor material contaminates the environment, it is reused or discarded after the cutting waste is removed using the waste liquid treatment device. (For example, refer to Patent Document 1.)
Japanese Patent Laid-Open No. 2004-230527

而して、廃液処理装置には切削屑を分離するための濾過フィルターが配設されているが、切削屑を確実に分離するためにはメッシュの細かいフィルターを用いる必要がある。切削屑を確実に分離することができるメッシュの細かいフィルターは高価であり、経済的に必ずしも満足し得るものではない。   Thus, the waste liquid treatment apparatus is provided with a filtration filter for separating the cutting waste, but it is necessary to use a fine mesh filter in order to reliably separate the cutting waste. A fine mesh filter that can reliably separate cutting waste is expensive and not always economically satisfactory.

本発明は上記事実に鑑みてなされたものであり、その主たる技術課題は、比較的メッシュの粗いフィルターであっても切削屑等の加工屑を確実に分離することができる廃液処理総理を提供することにある。   The present invention has been made in view of the above-mentioned facts, and its main technical problem is to provide a waste liquid processing prime minister capable of reliably separating machining waste such as cutting waste even with a filter having a relatively coarse mesh. There is.

上記主たる技術課題を解決するため、本発明によれば、加工装置の加工の際に供給する加工液に加工によって発生した加工屑が混入された加工廃液を処理する加工廃液処理装置において、
加工廃液を収容する廃液タンクと、該廃液タンクに収容された加工廃液を送給するポンプと、該ポンプによって送給された加工廃液を濾過するフィルターとを具備し、
該フィルターは、筒状に形成された濾紙と、該筒状の濾紙の外周を覆い側面に複数の開口を備えた筒体と、該筒状の濾紙の下端を閉塞する底板と、該筒状の濾紙の上端を閉塞するとともに該ポンプによって送給された加工廃液を導入する廃液導入口を備えた天板とからなり、該筒状の濾紙内に微粒子粉体が投入されている、
ことを特徴とする加工廃液処理装置が提供される。 In order to solve the main technical problem, according to the present invention, in the processing waste liquid treatment apparatus for processing the processing waste liquid mixed with the processing waste generated by the processing into the processing liquid supplied in the processing of the processing apparatus,
A waste liquid tank for storing the processing waste liquid, a pump for feeding the processing waste liquid stored in the waste liquid tank, and a filter for filtering the processing waste liquid fed by the pump,
The filter includes a filter paper formed in a cylindrical shape, a cylindrical body that covers the outer periphery of the cylindrical filter paper and has a plurality of openings on a side surface, a bottom plate that closes a lower end of the cylindrical filter paper, and the cylindrical shape A top plate provided with a waste liquid inlet for closing the upper end of the filter paper and introducing the processing waste liquid fed by the pump, and fine particle powder is put into the cylindrical filter paper,
A processing waste liquid treatment apparatus is provided.

上記微粒子粉体は、粒径が０．５〜２．０μmのシリカからなる。   The fine particle powder is made of silica having a particle size of 0.5 to 2.0 μm.

本発明によれば、フィルターを構成する筒状の濾紙内に微粒子粉体が投入されているので、この微粒子粉体が筒状の濾紙の内面に付着し濾過効率が向上するため、加工廃液に混入している加工屑を確実に分離することができる。従って、メッシュの比較的粗い安価な濾紙を使用することが可能となる。   According to the present invention, since the fine particle powder is put in the cylindrical filter paper constituting the filter, the fine particle powder adheres to the inner surface of the cylindrical filter paper and the filtration efficiency is improved. The mixed processing waste can be reliably separated. Therefore, an inexpensive filter paper having a relatively coarse mesh can be used.

以下、本発明に従って構成された加工廃液処理装置の好適な実施形態について、添付図面を参照して詳細に説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a processing waste liquid treatment apparatus configured according to the present invention will be described in detail with reference to the accompanying drawings.

図１には本発明に従って構成された加工廃液処理装置の要部斜視図が示されており、図２には図１に示す加工廃液処理装置の要部分解斜視図が示されている。
図示の実施形態における加工廃液処理装置は、加工廃液を収容する廃液タンク２と、該廃液タンク２に収容された加工廃液を送給するポンプ３と、該ポンプ３によって送給された加工廃液を濾過するための第１のフィルター４aおよび第２のフィルター４bを具備している。 FIG. 1 is a perspective view showing a main part of a processing waste liquid treatment apparatus constructed according to the present invention, and FIG. 2 is an exploded perspective view showing a main part of the processing waste liquid processing apparatus shown in FIG.
The processing waste liquid treatment apparatus in the illustrated embodiment includes a waste liquid tank 2 for storing a processing waste liquid, a pump 3 for supplying the processing waste liquid stored in the waste liquid tank 2, and a processing waste liquid supplied by the pump 3. A first filter 4a and a second filter 4b for filtering are provided.

廃液タンク２は、端壁に廃液流入口２１を備えており、該廃液流入口２１が図示しない切削装置等の加工装置に装備される加工廃液送出手段に接続される。この廃液タンク２の上壁に加工廃液を送給するポンプ３が配設されている。このように構成された廃液タンク２は、支持基台５の上面に配設される。   The waste liquid tank 2 is provided with a waste liquid inlet 21 on an end wall, and the waste liquid inlet 21 is connected to a processing waste liquid sending means provided in a processing apparatus such as a cutting apparatus (not shown). A pump 3 that feeds processing waste liquid is disposed on the upper wall of the waste liquid tank 2. The waste liquid tank 2 configured in this manner is disposed on the upper surface of the support base 5.

第１のフィルター４aおよび第２のフィルター４bは、それぞれ筒状に形成された濾紙４１と、該濾紙４１の外周を覆う筒体４２と、筒状の濾紙４１の下端を閉塞する底板４３と、筒状の濾紙４１の上端を閉塞する天板４４とからなっている。筒状の濾紙４１は、放射状に複数折り畳まれて形成され、濾過面積が増大するように構成されている。なお、筒状の濾紙４１は、例えば粒径が０．３〜０．４μm以下の粒子は通過することができるメッシュの比較的安価な濾紙が用いられている。この筒状の濾紙４１の外周を覆う筒体４２は、側面に複数の開口４２１が形成されている。また、上記筒状の濾紙４１の上端を閉塞する天板４４には、中央部に廃液導入口４４１が設けられている。このように構成された第１のフィルター４aおよび第２のフィルター４bには、筒状の濾紙４１内に粒径が０．５〜２．０μmのシリカからなる微粒子粉体４０が投入されている。このように構成された第１のフィルター４aおよび第２のフィルター４bは、支持基台５に配設された廃液タンク２の上側に配置されたフィルターラック６に配設される。   Each of the first filter 4a and the second filter 4b includes a filter paper 41 formed in a cylindrical shape, a cylindrical body 42 that covers the outer periphery of the filter paper 41, a bottom plate 43 that closes the lower end of the cylindrical filter paper 41, The top plate 44 closes the upper end of the cylindrical filter paper 41. The tubular filter paper 41 is formed by being radially folded and configured to increase the filtration area. As the cylindrical filter paper 41, for example, a relatively inexpensive filter paper having a mesh capable of passing particles having a particle size of 0.3 to 0.4 μm or less is used. The cylindrical body 42 covering the outer periphery of the cylindrical filter paper 41 has a plurality of openings 421 formed on the side surface. The top plate 44 that closes the upper end of the cylindrical filter paper 41 is provided with a waste liquid inlet 441 at the center. In the first filter 4 a and the second filter 4 b configured as described above, a fine particle powder 40 made of silica having a particle diameter of 0.5 to 2.0 μm is put in a cylindrical filter paper 41. . The first filter 4 a and the second filter 4 b configured as described above are disposed in the filter rack 6 disposed on the upper side of the waste liquid tank 2 disposed on the support base 5.

フィルターラック６は、矩形状に形成された底壁６１と、該底壁６１の両側縁から立設された側壁６２、６３と、底壁６１の両端縁から立設された端壁６４、６５とからなっており、４本の支持柱６６によって支持され、上記支持基台５に配設された廃液タンク２の上側に配置されている。フィルターラック６は、底壁６１と側壁６２、６３および端壁６４、６５によって上記第１のフィルター４aおよび第２のフィルター４bによって加工屑が分離された濾過済み加工液を収容する加工液貯留槽６０を形成している。そして、フィルターラック６を構成する底壁６１には、加工液貯留槽６０に貯留された濾過済み加工液を排出する排出口６１１が設けられている。なお、この排出口６１１は、図示しない加工装置に装備された加工液供給手段または廃棄手段に接続されている。また、フィルターラック６を構成する底壁６１の上面には、上記第１のフィルター４aおよび第２のフィルター４bを支持するための第１の支持台６７aおよび第２の支持台６７bが配設されている。この第１の支持台６７aおよび第２の支持台６７b上に上記第１のフィルター４aおよび第２のフィルター４bが載置される。   The filter rack 6 includes a rectangular bottom wall 61, side walls 62 and 63 erected from both side edges of the bottom wall 61, and end walls 64 and 65 erected from both ends of the bottom wall 61. It is supported by four support columns 66 and is disposed above the waste liquid tank 2 disposed on the support base 5. The filter rack 6 is a processing liquid storage tank that stores the filtered processing liquid from which the processing waste is separated by the first filter 4a and the second filter 4b by the bottom wall 61, the side walls 62 and 63, and the end walls 64 and 65. 60 is formed. The bottom wall 61 constituting the filter rack 6 is provided with a discharge port 611 for discharging the filtered machining liquid stored in the machining liquid storage tank 60. The discharge port 611 is connected to a machining liquid supply unit or a disposal unit equipped in a machining apparatus (not shown). A first support base 67a and a second support base 67b for supporting the first filter 4a and the second filter 4b are disposed on the upper surface of the bottom wall 61 constituting the filter rack 6. ing. The first filter 4a and the second filter 4b are placed on the first support base 67a and the second support base 67b.

次に、上述した廃液タンク２に収容された加工廃液を上記第１のフィルター４aおよび第２のフィルター４bに送給するための加工廃液送給手段について、図３を参照して説明する。
図３に示す加工廃液送給手段７は、上記廃液タンク２に収容された加工廃液を送給するポンプ３と、該ポンプ３に接続された配管７１と、該配管７１と第１のフィルター４aの廃液導入口４４１および第２のフィルター４bの廃液導入口４４１とを接続する配管７１aおよび７１bと、該配管７１と配管７１aおよび７１bとの間に配設された電磁切り換え弁７２を具備している。この電磁切り換え弁７２は、除勢(OFF)している状態では配管７１と配管７１aおよび７１bとの連通を遮断しており、一方の電磁コイル７２aを附勢(ON)すると配管７１と配管７１a が連通し、他方の電磁コイル７２bを附勢(ON)すると配管７１と配管７１bが連通するようになっている。なお、配管７１aおよび配管７１bには、第１のフィルター４aおよび第２のフィルター４bに送給される加工廃液の圧力を検出する第１の圧力検出手段７３aおよび第２の圧力検出手段７３bが配設されている。この第１の圧力検出手段７３aおよび第２の圧力検出手段７３bは、その検出信号を後述する制御手段に送る。 Next, a processing waste liquid feeding means for feeding the processing waste liquid stored in the above-described waste liquid tank 2 to the first filter 4a and the second filter 4b will be described with reference to FIG.
The processing waste liquid feeding means 7 shown in FIG. 3 has a pump 3 for feeding the processing waste liquid stored in the waste liquid tank 2, a pipe 71 connected to the pump 3, the pipe 71 and the first filter 4a. Piping 71a and 71b connecting the waste liquid inlet 441 and the waste liquid inlet 441 of the second filter 4b, and an electromagnetic switching valve 72 disposed between the pipe 71 and the pipes 71a and 71b. Yes. The electromagnetic switching valve 72 shuts off the communication between the pipe 71 and the pipes 71a and 71b in the deenergized (OFF) state, and when one electromagnetic coil 72a is energized (ON), the pipe 71 and the pipe 71a. When the other electromagnetic coil 72b is energized (ON), the pipe 71 and the pipe 71b communicate with each other. The piping 71a and the piping 71b are provided with a first pressure detecting means 73a and a second pressure detecting means 73b for detecting the pressure of the processing waste liquid supplied to the first filter 4a and the second filter 4b. It is installed. The first pressure detection means 73a and the second pressure detection means 73b send the detection signals to the control means described later.

図３を参照して説明を続けると、図示の実施形態における加工廃液処理装置は、上記第１のフィルター４aおよび第２のフィルター４bに圧縮空気を供給する圧縮空気供給手段８を具備している。圧縮空気供給手段８は、圧縮空気源８１と、該圧縮空気源８１と上記加工廃液送給手段７の配管７１aおよび配管７１bと接続する配管８２aおよび配管８２bと、該配管８２aおよび配管８２bにそれぞれ配設された第１の比例電磁式リリーフ弁８３aおよび第２の比例電磁式リリーフ弁８３bとからなっている。   Continuing with reference to FIG. 3, the processing waste liquid treatment apparatus in the illustrated embodiment includes compressed air supply means 8 for supplying compressed air to the first filter 4 a and the second filter 4 b. . The compressed air supply means 8 includes a compressed air source 81, a pipe 82a and a pipe 82b connected to the compressed air source 81 and the pipe 71a and the pipe 71b of the processing waste liquid feeding means 7, and the pipe 82a and the pipe 82b, respectively. The first proportional electromagnetic relief valve 83a and the second proportional electromagnetic relief valve 83b are provided.

また、図示の実施形態における加工廃液処理装置は、上記圧力検出手段７３a、７３bからの圧力信号を入力し、上記ポンプ３、電磁切り換え弁７２、第１の比例電磁式リリーフ弁８３aおよび第２の比例電磁式リリーフ弁８３bに制御信号を出力する制御手段９を具備している。この制御手段９は、上記支持基台５の上面に載置される。   Further, the processing waste liquid treatment apparatus in the illustrated embodiment receives pressure signals from the pressure detection means 73a and 73b, and the pump 3, the electromagnetic switching valve 72, the first proportional electromagnetic relief valve 83a and the second The control means 9 which outputs a control signal to the proportional electromagnetic relief valve 83b is provided. The control means 9 is placed on the upper surface of the support base 5.

図示の実施形態における加工廃液処理装置は以上のように構成されており、以下その作用について説明する。
廃液タンク２に収容された加工廃液を処理するに際しては、制御手段９は先ずポンプ３を作動するとともに、電磁切り換え弁７２の一方の電磁コイル７２aを附勢(ON)する。この結果、ポンプ３によって送給された加工廃液は、配管７１、電磁切り換え弁７２、配管７１aおよび廃液導入口４４１を介して第１のフィルター４aに導入される。第１のフィルター４aに導入された加工廃液は、筒状の濾紙４１によって濾過され、筒状の濾紙４１の外周を覆う筒体４２の側面に形成された複数の開口４２１を通してフィルターラック６の加工液貯留槽６０に流出する。このとき、第１のフィルター４a内に投入されているシリカからなる微粒子粉体４０が筒状の濾紙４１の内面に付着し濾過性能が向上するため、加工廃液に混入している加工屑を確実に分離することができる。従って、メッシュの細かい高価な濾紙を使用することなく加工屑を確実に分離することができる。上述したようにフィルターラック６の加工液貯留槽６０に流出した濾過された加工液は、排出口６１１から図示しない加工装置に装備された加工液供給手段によって再循環されるか、廃棄手段を介して廃棄される。 The processing waste liquid treatment apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When processing the machining waste liquid stored in the waste liquid tank 2, the control means 9 first operates the pump 3 and energizes (turns on) one electromagnetic coil 72 a of the electromagnetic switching valve 72. As a result, the processing waste liquid fed by the pump 3 is introduced into the first filter 4a via the pipe 71, the electromagnetic switching valve 72, the pipe 71a, and the waste liquid inlet 441. The processing waste liquid introduced into the first filter 4 a is filtered by the cylindrical filter paper 41, and the filter rack 6 is processed through a plurality of openings 421 formed on the side surface of the cylindrical body 42 covering the outer periphery of the cylindrical filter paper 41. It flows out to the liquid storage tank 60. At this time, since the fine particle powder 40 made of silica put in the first filter 4a adheres to the inner surface of the cylindrical filter paper 41 and the filtration performance is improved, the processing waste mixed in the processing waste liquid is surely removed. Can be separated. Therefore, the processing waste can be reliably separated without using an expensive filter paper with a fine mesh. As described above, the filtered machining fluid that has flowed out into the machining fluid storage tank 60 of the filter rack 6 is recirculated from the discharge port 611 by a machining fluid supply means provided in a machining apparatus (not shown) or via a disposal means. Discarded.

なお、上述したように第１のフィルター４aに加工廃液を導入する際には、制御手段９は圧縮空気供給手段８の第１の比例電磁式リリーフ弁８３aを附勢(ON)するとともに、流出圧力が例えば１．５気圧になるように印加電圧を制御する。この結果、圧縮空気源８１の圧縮空気が第１の比例電磁式リリーフ弁８３aによって１．５気圧に減圧され、配管７１bおよび廃液導入口４４１を介して第１のフィルター４aに導入される。従って、第１のフィルター４aに導入され加工廃液には１．５気圧の圧力が作用することになる。この結果、第１のフィルター４a内に投入されているシリカからなる微粒子粉体４０は、筒状の濾紙４１の内面に確実に付着するので、濾過効率が維持される。   As described above, when the processing waste liquid is introduced into the first filter 4a, the control means 9 energizes (ON) the first proportional electromagnetic relief valve 83a of the compressed air supply means 8 and flows it out. The applied voltage is controlled so that the pressure becomes 1.5 atm, for example. As a result, the compressed air from the compressed air source 81 is depressurized to 1.5 atm by the first proportional electromagnetic relief valve 83a, and is introduced into the first filter 4a through the pipe 71b and the waste liquid inlet 441. Accordingly, a pressure of 1.5 atm acts on the processing waste liquid introduced into the first filter 4a. As a result, the fine particle powder 40 made of silica put into the first filter 4a is reliably attached to the inner surface of the cylindrical filter paper 41, so that the filtration efficiency is maintained.

以上のようにして、第１のフィルター４aによる加工廃液の処理を実施していると、第１のフィルター４aの筒状の濾紙４１の内側には加工屑が堆積する。筒状の濾紙４１の内側に加工屑が堆積すると、加工液が筒状の濾紙４１を通過しし難くなり、フィルターとしての機能が失われる。このように筒状の濾紙４１の内側に加工屑が堆積すると、筒状の濾紙４１内の圧力が上昇する。そして、筒状の濾紙４１内の圧力が例えば２気圧になると、上記第１の圧力検出手段７３aから出力される圧力信号を入力した制御手段９は、電磁切り換え弁７２の他方の電磁コイル７２bを附勢(ON)する。従って、配管７１と配管７１aの連通が遮断されて、配管７１と配管７１bが連通する。この結果、ポンプ３によって送給された加工廃液は、配管７１、電磁切り換え弁７２、配管７１bおよび廃液導入口４４１を介して第２のフィルター４ｂに導入される。また、制御手段９は、圧縮空気供給手段８の第２の比例電磁式リリーフ弁８３bを附勢(ON)するとともに、流出圧力が例えば１．５気圧になるように印加電圧を制御する。この結果、ポンプ３によって送給された加工廃液は、第２のフィルター４ｂによって上記第１のフィルター４aと同様に処理される。   As described above, when the processing waste liquid is processed by the first filter 4a, processing waste accumulates inside the cylindrical filter paper 41 of the first filter 4a. When processing waste accumulates inside the cylindrical filter paper 41, the processing liquid becomes difficult to pass through the cylindrical filter paper 41, and the function as a filter is lost. When the processing waste accumulates inside the cylindrical filter paper 41 in this way, the pressure in the cylindrical filter paper 41 increases. When the pressure in the cylindrical filter paper 41 becomes, for example, 2 atm, the control means 9 that receives the pressure signal output from the first pressure detection means 73a causes the other electromagnetic coil 72b of the electromagnetic switching valve 72 to move. Energize (ON). Accordingly, the communication between the pipe 71 and the pipe 71a is blocked, and the pipe 71 and the pipe 71b are communicated. As a result, the processing waste liquid fed by the pump 3 is introduced into the second filter 4b via the pipe 71, the electromagnetic switching valve 72, the pipe 71b, and the waste liquid inlet 441. Further, the control means 9 energizes (ON) the second proportional electromagnetic relief valve 83b of the compressed air supply means 8, and controls the applied voltage so that the outflow pressure becomes 1.5 atm, for example. As a result, the processing waste liquid fed by the pump 3 is processed by the second filter 4b in the same manner as the first filter 4a.

一方、制御手段９は、圧縮空気供給手段８の第１の比例電磁式リリーフ弁８３aの流出圧力が例えば３気圧になるように印加電圧を制御する。この結果、第１のフィルター４aの筒状の濾紙４１の内側に滞留している加工廃液が、強制的に濾過されて筒状の濾紙４１の外周を覆う筒体４２の側面に形成された複数の複数の開口４２１を通してフィルターラック６の加工液貯留槽６０に流出せしめられる。そして、第１の比例電磁式リリーフ弁８３aの流出圧力が例えば３気圧になるように印加電圧を制御してから所定時間経過したならば、制御手段９は第１の比例電磁式リリーフ弁８３aを除勢(OFF)する。このようにして、第１のフィルター４aの筒状の濾紙４１の内側に滞留している加工廃液を排出したならば、このフィルターを廃棄し新しいフィルターと交換する。この間に加工廃液の処理は上述したように第２のフィルター４ｂによって実施されるので、加工装置の作業を中断する必要はない。   On the other hand, the control means 9 controls the applied voltage so that the outflow pressure of the first proportional electromagnetic relief valve 83a of the compressed air supply means 8 becomes 3 atm, for example. As a result, the processing waste liquid staying inside the cylindrical filter paper 41 of the first filter 4 a is forcibly filtered and formed on the side surface of the cylindrical body 42 covering the outer periphery of the cylindrical filter paper 41. The plurality of openings 421 are allowed to flow into the machining liquid storage tank 60 of the filter rack 6. Then, if a predetermined time has elapsed after controlling the applied voltage so that the outflow pressure of the first proportional electromagnetic relief valve 83a becomes 3 atm, for example, the control means 9 causes the first proportional electromagnetic relief valve 83a to De-energize (OFF). When the processing waste liquid staying inside the cylindrical filter paper 41 of the first filter 4a is discharged in this way, this filter is discarded and replaced with a new filter. During this time, processing of the processing waste liquid is performed by the second filter 4b as described above, so that it is not necessary to interrupt the processing apparatus.

本発明に本発明に従って構成された加工廃液処理装置の要部斜視図。The principal part perspective view of the processing waste liquid processing apparatus comprised according to this invention in this invention. 図１に示す加工廃液処理装置の要部を分解して示す斜視図。The perspective view which decomposes | disassembles and shows the principal part of the processing waste liquid processing apparatus shown in FIG. 本発明に本発明に従って構成された加工廃液処理装置の構成ブロック図。The block diagram of the configuration of the processing waste liquid treatment apparatus constructed according to the present invention.

符号の説明Explanation of symbols

２：廃液タンク
２１：廃液流入口
３：ポンプ
４a：第１のフィルター
４b：第２のフィルター
４０：微粒子粉体
４１：筒状の濾紙
４２：筒体
４２１：複数の開口
４３：底板
４４：天板
４４１：廃液導入口
５：支持基台
６：フィルターラック
６０：加工液貯留槽
６６１：排出口
７：加工廃液送給手段
７２：電磁切り換え弁
７３a：第１の圧力検出手段７３a
７３b：第２の圧力検出手段７３b
８：圧縮空気供給手段
８１：圧縮空気源
８３a：第１の比例電磁式リリーフ弁
８３b：第２の比例電磁式リリーフ弁
９：制御手段 2: Waste liquid tank 21: Waste liquid inlet 3: Pump 4a: First filter 4b: Second filter 40: Fine particle powder 41: Cylindrical filter paper 42: Cylindrical body 421: Multiple openings 43: Bottom plate 44: Top Plate 441: Waste liquid introduction port 5: Support base 6: Filter rack 60: Processing liquid storage tank 661: Discharge port 7: Processing waste liquid supply means 72: Electromagnetic switching valve 73a: First pressure detection means 73a
73b: second pressure detecting means 73b
8: Compressed air supply means 81: Compressed air source 83a: First proportional electromagnetic relief valve 83b: Second proportional electromagnetic relief valve 9: Control means

Claims (2)

加工装置の加工の際に供給する加工液に加工によって発生した加工屑が混入された加工廃液を処理する加工廃液処理装置において、
加工廃液を収容する廃液タンクと、該廃液タンクに収容された加工廃液を送給するポンプと、該ポンプによって送給された加工廃液を濾過するフィルターとを具備し、
該フィルターは、筒状に形成された濾紙と、該筒状の濾紙の外周を覆い側面に複数の開口を備えた筒体と、該筒状の濾紙の下端を閉塞する底板と、該筒状の濾紙の上端を閉塞するとともに該ポンプによって送給された加工廃液を導入する廃液導入口を備えた天板とからなり、該筒状の濾紙内に微粒子粉体が投入されている、
ことを特徴とする加工廃液処理装置。 In a processing waste liquid processing apparatus for processing a processing waste liquid in which processing waste generated by processing is mixed with a processing liquid supplied in processing of a processing apparatus,
A waste liquid tank for storing the processing waste liquid, a pump for feeding the processing waste liquid stored in the waste liquid tank, and a filter for filtering the processing waste liquid fed by the pump,
The filter includes a filter paper formed in a cylindrical shape, a cylindrical body that covers the outer periphery of the cylindrical filter paper and has a plurality of openings on a side surface, a bottom plate that closes a lower end of the cylindrical filter paper, and the cylindrical shape A top plate provided with a waste liquid inlet for closing the upper end of the filter paper and introducing the processing waste liquid fed by the pump, and fine particle powder is put into the cylindrical filter paper,
A processing waste liquid treatment apparatus characterized by that. 該微粒子粉体は、粒径が０．５〜２．０μmのシリカからなる、請求項１記載の加工廃液処理装置。   2. The processing waste liquid treatment apparatus according to claim 1, wherein the fine particle powder is made of silica having a particle diameter of 0.5 to 2.0 [mu] m.
JP2007270493A 2007-10-17 2007-10-17 Machining waste liquid processing device Pending JP2009095941A (en)

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SG200806866-0A SG152129A1 (en) 2007-10-17 2008-09-16 Apparatus for treating waste working liquid
KR1020080093116A KR20090039606A (en) 2007-10-17 2008-09-23 Process liquid waste treatment apparatus
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