JP2008016676A - プローブカード自動交換機構及び検査装置 - Google Patents

プローブカード自動交換機構及び検査装置 Download PDF

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Publication number
JP2008016676A
JP2008016676A JP2006187071A JP2006187071A JP2008016676A JP 2008016676 A JP2008016676 A JP 2008016676A JP 2006187071 A JP2006187071 A JP 2006187071A JP 2006187071 A JP2006187071 A JP 2006187071A JP 2008016676 A JP2008016676 A JP 2008016676A
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Japan
Prior art keywords
card
probe card
holder
rotating
plate
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JP2006187071A
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Japanese (ja)
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JP2008016676A5 (enExample
Inventor
Katsuo Yasuda
勝男 安田
Hikari Masuda
光 増田
Norihide Yamaguchi
憲栄 山口
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Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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Priority to JP2006187071A priority Critical patent/JP2008016676A/ja
Publication of JP2008016676A publication Critical patent/JP2008016676A/ja
Publication of JP2008016676A5 publication Critical patent/JP2008016676A5/ja
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006187071A 2006-07-06 2006-07-06 プローブカード自動交換機構及び検査装置 Pending JP2008016676A (ja)

Priority Applications (1)

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JP2006187071A JP2008016676A (ja) 2006-07-06 2006-07-06 プローブカード自動交換機構及び検査装置

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JP2006187071A JP2008016676A (ja) 2006-07-06 2006-07-06 プローブカード自動交換機構及び検査装置

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JP2008016676A true JP2008016676A (ja) 2008-01-24
JP2008016676A5 JP2008016676A5 (enExample) 2009-04-23

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JP2006187071A Pending JP2008016676A (ja) 2006-07-06 2006-07-06 プローブカード自動交換機構及び検査装置

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200390A (ja) * 2008-02-25 2009-09-03 Kyodo:Kk プローブカード移載装置
JP2010223790A (ja) * 2009-03-24 2010-10-07 Kyodo:Kk プローブカード検査方法及び装置
KR101218440B1 (ko) * 2008-09-26 2013-01-18 도쿄엘렉트론가부시키가이샤 프로브 장치
US8689360B2 (en) 2011-10-26 2014-04-01 Samsung Electronics Co., Ltd. Probe head scanning probe microscope including the same
KR101545844B1 (ko) 2014-03-31 2015-08-20 주식회사 디이엔티 프로브 유닛 교체장치
KR20180057351A (ko) * 2016-11-22 2018-05-30 세메스 주식회사 프로브 스테이션
CN112735990A (zh) * 2021-01-27 2021-04-30 广西科林半导体有限公司 一种晶圆自动检测机
US11018038B2 (en) 2018-10-05 2021-05-25 Samsung Electronics Co., Ltd. Apparatus for sawing a semiconductor package
CN117855134A (zh) * 2024-03-04 2024-04-09 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 顶针自动切换装置
JP2024178376A (ja) * 2022-01-17 2024-12-24 株式会社東京精密 ウェハテストシステム及びプローバ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH029145A (ja) * 1988-06-27 1990-01-12 Tokyo Electron Ltd プローブ装置
JP2000150596A (ja) * 1998-11-10 2000-05-30 Tokyo Seimitsu Co Ltd プローバ
JP2001024039A (ja) * 1999-07-09 2001-01-26 Tokyo Electron Ltd プローブカード搬送機構

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH029145A (ja) * 1988-06-27 1990-01-12 Tokyo Electron Ltd プローブ装置
JP2000150596A (ja) * 1998-11-10 2000-05-30 Tokyo Seimitsu Co Ltd プローバ
JP2001024039A (ja) * 1999-07-09 2001-01-26 Tokyo Electron Ltd プローブカード搬送機構

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200390A (ja) * 2008-02-25 2009-09-03 Kyodo:Kk プローブカード移載装置
KR101218440B1 (ko) * 2008-09-26 2013-01-18 도쿄엘렉트론가부시키가이샤 프로브 장치
JP2010223790A (ja) * 2009-03-24 2010-10-07 Kyodo:Kk プローブカード検査方法及び装置
US8689360B2 (en) 2011-10-26 2014-04-01 Samsung Electronics Co., Ltd. Probe head scanning probe microscope including the same
KR101545844B1 (ko) 2014-03-31 2015-08-20 주식회사 디이엔티 프로브 유닛 교체장치
KR20180057351A (ko) * 2016-11-22 2018-05-30 세메스 주식회사 프로브 스테이션
KR102654604B1 (ko) * 2016-11-22 2024-04-03 세메스 주식회사 프로브 스테이션
US11018038B2 (en) 2018-10-05 2021-05-25 Samsung Electronics Co., Ltd. Apparatus for sawing a semiconductor package
CN112735990A (zh) * 2021-01-27 2021-04-30 广西科林半导体有限公司 一种晶圆自动检测机
JP2024178376A (ja) * 2022-01-17 2024-12-24 株式会社東京精密 ウェハテストシステム及びプローバ
CN117855134A (zh) * 2024-03-04 2024-04-09 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 顶针自动切换装置

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