JP2007531289A5 - - Google Patents

Download PDF

Info

Publication number
JP2007531289A5
JP2007531289A5 JP2007505283A JP2007505283A JP2007531289A5 JP 2007531289 A5 JP2007531289 A5 JP 2007531289A5 JP 2007505283 A JP2007505283 A JP 2007505283A JP 2007505283 A JP2007505283 A JP 2007505283A JP 2007531289 A5 JP2007531289 A5 JP 2007531289A5
Authority
JP
Japan
Prior art keywords
gas mixture
oxygen
fluorocarbon
surface deposit
activated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007505283A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007531289A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2005/010693 external-priority patent/WO2005090638A2/en
Publication of JP2007531289A publication Critical patent/JP2007531289A/ja
Publication of JP2007531289A5 publication Critical patent/JP2007531289A5/ja
Withdrawn legal-status Critical Current

Links

JP2007505283A 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法 Withdrawn JP2007531289A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55622704P 2004-03-24 2004-03-24
US64044404P 2004-12-30 2004-12-30
US64083304P 2004-12-30 2004-12-30
PCT/US2005/010693 WO2005090638A2 (en) 2004-03-24 2005-03-24 Remote chamber methods for removing surface deposits

Publications (2)

Publication Number Publication Date
JP2007531289A JP2007531289A (ja) 2007-11-01
JP2007531289A5 true JP2007531289A5 (enrdf_load_stackoverflow) 2008-03-21

Family

ID=34965582

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2007505282A Pending JP2007531288A (ja) 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法
JP2007505283A Withdrawn JP2007531289A (ja) 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法
JP2007505281A Withdrawn JP2007530792A (ja) 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2007505282A Pending JP2007531288A (ja) 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2007505281A Withdrawn JP2007530792A (ja) 2004-03-24 2005-03-24 表面堆積物を除去するための遠隔チャンバ方法

Country Status (6)

Country Link
EP (3) EP1733072A2 (enrdf_load_stackoverflow)
JP (3) JP2007531288A (enrdf_load_stackoverflow)
KR (3) KR20070037434A (enrdf_load_stackoverflow)
BR (3) BRPI0508204A (enrdf_load_stackoverflow)
TW (3) TWI281715B (enrdf_load_stackoverflow)
WO (3) WO2005098086A2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697467A1 (en) * 1994-07-21 1996-02-21 Applied Materials, Inc. Method and apparatus for cleaning a deposition chamber
US7581549B2 (en) * 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
RU2008108010A (ru) * 2005-08-02 2009-09-10 Массачусетс Инститьют Оф Текнолоджи (Us) Способ применения фторида серы для удаления поверхностных отложений
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
EP2934775B1 (en) * 2012-12-18 2021-03-17 Seastar Chemicals Inc. Process and method for in-situ dry cleaning of thin film deposition reactors and thin film layers
JP6202423B2 (ja) * 2013-03-05 2017-09-27 パナソニックIpマネジメント株式会社 プラズマクリーニング方法およびプラズマクリーニング装置
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
SG10201906117XA (en) * 2013-12-30 2019-08-27 Chemours Co Fc Llc Chamber cleaning and semiconductor etching gases
WO2020137528A1 (ja) * 2018-12-25 2020-07-02 昭和電工株式会社 付着物除去方法及び成膜方法
US11854773B2 (en) 2020-03-31 2023-12-26 Applied Materials, Inc. Remote plasma cleaning of chambers for electronics manufacturing systems
EP3954804A1 (de) * 2020-08-14 2022-02-16 Siltronic AG Vorrichtung und verfahren zum abscheiden einer schicht aus halbleitermaterial auf einer substratscheibe
CN116145106B (zh) * 2023-02-21 2024-12-24 苏州鼎芯光电科技有限公司 一种用于半导体镀膜工艺腔室的清洁方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
JP2002280376A (ja) * 2001-03-22 2002-09-27 Research Institute Of Innovative Technology For The Earth Cvd装置のクリーニング方法およびそのためのクリーニング装置

Similar Documents

Publication Publication Date Title
KR102476934B1 (ko) 챔버 세정 및 반도체 식각 기체
US20060144820A1 (en) Remote chamber methods for removing surface deposits
US10892143B2 (en) Technique to prevent aluminum fluoride build up on the heater
US20090068844A1 (en) Etching Process
JP2007531289A5 (enrdf_load_stackoverflow)
KR100725078B1 (ko) 포로젠-함유 물질의 증착에 후속하는 cvd 챔버 세정
JP2009503270A (ja) 表面沈着物を除去するためのnf3の使用方法
TWI827787B (zh) 藉由氣體脈衝之矽氧化物相對於矽氮化物之選擇性電漿蝕刻
EP1764848A2 (en) Method for removing organic electroluminescent residues from a substrate
KR20190003979A (ko) 실리콘의 화학적 에칭을 위한 방법들
JP2009503271A (ja) Cvd/pecvd−プラズマチャンバーの内部から表面沈着物を除去するためのフッ化硫黄を使用する遠隔チャンバー方法
TWI281715B (en) Remote chamber methods for removing surface deposits
US20050258137A1 (en) Remote chamber methods for removing surface deposits
KR102275996B1 (ko) 하이드로플루오로올레핀 식각 가스 혼합물
TW202220052A (zh) 基材處理方法
US20060144819A1 (en) Remote chamber methods for removing surface deposits
KR102021413B1 (ko) 반도체 제조 공정용 건식 세정 가스 및 이를 사용하는 세정 방법
JPH053177A (ja) ドライエツチング方法
HK1119209A (en) Remote chamber methods for removing surface deposits
EP2879165A1 (en) Etching Process
KR20080041308A (ko) 저유전체막 증착장비의 세정 장치 및 방법