JP2007529103A - キャリアの移動性と画像の青感度を改善するひずみシリコン層を有するピクセル - Google Patents
キャリアの移動性と画像の青感度を改善するひずみシリコン層を有するピクセル Download PDFInfo
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- JP2007529103A JP2007529103A JP2006518702A JP2006518702A JP2007529103A JP 2007529103 A JP2007529103 A JP 2007529103A JP 2006518702 A JP2006518702 A JP 2006518702A JP 2006518702 A JP2006518702 A JP 2006518702A JP 2007529103 A JP2007529103 A JP 2007529103A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 88
- 239000010703 silicon Substances 0.000 title claims abstract description 87
- 230000035945 sensitivity Effects 0.000 title description 4
- 238000012546 transfer Methods 0.000 claims abstract description 25
- 238000003384 imaging method Methods 0.000 claims abstract description 15
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 52
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 21
- 229910052732 germanium Inorganic materials 0.000 claims description 16
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 15
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000000231 atomic layer deposition Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 78
- 238000009792 diffusion process Methods 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000003860 storage Methods 0.000 description 6
- 241000220317 Rosa Species 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 206010047571 Visual impairment Diseases 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 241000220010 Rhode Species 0.000 description 1
- 229910003811 SiGeC Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
- H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
-
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
-
- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/14652—Multispectral infrared imagers, having a stacked pixel-element structure, e.g. npn, npnpn or MQW structures
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/11—Devices sensitive to infrared, visible or ultraviolet radiation characterised by two potential barriers or surface barriers, e.g. bipolar phototransistor
Abstract
Description
122 p+領域
124 n型領域
126 転送トランジスタ
127 ソースフォロワトランジスタ
128 リセットトランジスタ
129 行選択トランジスタ
130 ソース/ドレイン領域
131 列ライン
150 フォトダイオード
155 シャロートレンチアイソレーション領域
160 基板(p型基板)
161 ウェル(p型ウェル)
170 ひずみシリコン層
200 ピクセルセル
Claims (48)
- 少なくとも1つのピクセルセルであって:
上位部分にひずみシリコン層を含む半導体基板と;
前記半導体基板の上位領域に形成された電荷生成のためのフォトセンサと;
を含む、ピクセルセル。 - 前記ひずみシリコン層が約500Åから約1000Åの厚みを有する、請求項1に記載のピクセルセル。
- 前記ひずみシリコン層が、シリコン−ゲルマニウムベース層の上に形成された最上位シリコン層を含む、請求項1に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGe(1−X)を含む、請求項3に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGeYCZを含み、X+Y+Z=1である、請求項3に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がゲルマニウム濃度の異なる複数のシリコン−ゲルマニウム層を含む、請求項3に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層が約30%から約40%のゲルマニウム濃度を有する、請求項3に記載のピクセルセル。
- 前記ひずみ層を包含する前記基板の領域に形成されたリセットトランジスタ、ソースフォロワトランジスタ、及び行選択トランジスタをさらに含む、請求項1に記載のピクセルセル。
- 前記ひずみシリコン層を包含する前記基板の領域に形成された転送トランジスタをさらに含む、請求項8に記載のピクセルセル。
- 少なくとも1つのピクセルセルであって:
上位部分にひずみシリコン層を含む半導体基板と;
前記半導体基板の上位領域に形成された電荷生成のためのフォトセンサと;
前記半導体基板の前記上位部分に付随して形成されたリセットトランジスタと;
前記半導体基板の前記上位部分に付随して形成されたソースフォロワトランジスタと;
前記半導体基板の前記上位部分に付随して形成された行選択トランジスタと;
を含む、ピクセルセル。 - 前記ひずみシリコン層が約500Åから約1000Åの厚みを有する、請求項10に記載のピクセルセル。
- 前記ひずみシリコン層がシリコン−ゲルマニウムベース層の上に形成された最上位シリコン層を含む、請求項10に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGe(1−X)を含む、請求項12に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGeYCZを含み、X+Y+Z=1である、請求項12に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がゲルマニウム濃度の異なる複数のシリコン−ゲルマニウム層を含む、請求項12に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層が約30%から約40%のゲルマニウム濃度を有する、請求項12に記載のピクセルセル。
- 少なくとも1つのピクセルセルであって:
上位部分にひずみシリコン層を含む半導体基板と;
前記半導体基板の上位領域に形成された電荷生成のためのフォトセンサと;
前記半導体基板の前記上位部分に付随して形成されたリセットトランジスタと;
前記半導体基板の前記上位部分に付随して形成されたソースフォロワトランジスタと;
前記半導体基板の前記上位部分に付随して形成された行選択トランジスタと;
前記半導体基板の前記上位部分に付随して形成された転送トランジスタと;
を含む、ピクセルセル。 - 前記ひずみシリコン層が約500Åから約1000Åの厚みを有する、請求項17に記載のピクセルセル。
- 前記ひずみシリコン層がシリコン−ゲルマニウムベース層の上に形成された最上位シリコン層を含む、請求項17に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGe(1−X)を含む、請求項19に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がSiXGeYCZを含み、X+Y+Z=1である、請求項19に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層がゲルマニウム濃度の異なる複数のシリコン−ゲルマニウム層を含む、請求項19に記載のピクセルセル。
- 前記シリコン−ゲルマニウムベース層が約30%から約40%のゲルマニウム濃度を有する、請求項19に記載のピクセルセル。
- 複数のピクセルセルを含むイメージャであって、前記ピクセルセルの内少なくとも1つが:
上位部分にひずみシリコン層を含む半導体基板と;
前記半導体基板の上位領域に形成された電荷生成のためのフォトセンサと;を備える、イメージャ。 - 前記ひずみシリコン層が約500Åから約1000Åの厚みを有する、請求項24に記載のイメージャ。
- 前記ひずみシリコン層がシリコン−ゲルマニウムベース層の上に形成された最上位シリコン層を含む、請求項24に記載のイメージャ。
- 前記シリコン−ゲルマニウムベース層がSiXGe(1−X)を含む、請求項26に記載のイメージャ。
- 前記シリコン−ゲルマニウムベース層がSiXGeYCZを含み、X+Y+Z=1である、請求項26に記載のイメージャ。
- 前記シリコン−ゲルマニウムベース層が約30%から約40%のゲルマニウム濃度を有する、請求項26に記載のイメージャ。
- 前記イメージャがCMOSイメージャである、請求項24に記載のイメージャ。
- 前記少なくとも1つのピクセルセルが、前記ひずみ層を包含する前記基板の領域に形成されたリセットトランジスタ、ソースフォロワトランジスタ、及び行選択トランジスタをさらに含む、請求項24に記載のイメージャ。
- 前記イメージャが、前記ひずみシリコン層を包含する前記基板の領域に形成された転送トランジスタをさらに含む、請求項31に記載のイメージャ。
- 前記フォトセンサがフォトダイオードである、請求項24に記載のイメージャ。
- 前記少なくとも1つのピクセルセルが撮像アレイの一部である、請求項24のイメージャ。
- 処理システムであって:
プロセッサと;
前記プロセッサに結合された撮像デバイスと;
を備え、前記撮像デバイスが複数のピクセルセルを有し、前記ピクセルセルの内少なくとも1つが:
上位部分にひずみシリコン層を含む半導体基板と;
前記半導体基板の上位部分に形成された電荷生成のためのフォトセンサと;
前記基板上に形成された出力トランジスタを少なくとも含む読み取り回路と;
を含む、システム。 - 前記ひずみシリコン層が約500Åから約1000Åの厚みを有する、請求項35に記載のシステム。
- 前記ひずみシリコン層がシリコン−ゲルマニウム層の上に形成された最上位シリコン層を含む、請求項35に記載のシステム。
- 前記シリコン−ゲルマニウムベース層が約30%から約40%のゲルマニウム濃度を有する、請求項37に記載のシステム。
- ピクセルセルを形成する方法であって:
半導体基板を形成するステップと;
ひずみシリコン層を前記半導体基板の上位部分に付随して形成するステップと;
前記半導体基板の前記上位部分に電荷生成のためのフォトセンサを形成するステップと;
を含む、方法。 - 前記ひずみ層を包含する前記基板の領域にリセットトランジスタ、ソースフォロワトランジスタ、及び行選択トランジスタを形成するステップをさらに含む、請求項39に記載の方法。
- 前記ひずみシリコン層を包含する前記基板の領域に転送トランジスタを形成するステップをさらに含む、請求項40に記載の方法。
- 前記ひずみシリコン層を形成するステップを、約500Åから約1000Åの厚みを有するひずみシリコン層を形成するステップによって実行する、請求項39に記載の方法。
- 前記ひずみシリコン層を形成するステップを、シリコン−ゲルマニウムベース層の上に最上位シリコン層を形成するステップによって実行する、請求項39に記載の方法。
- 前記シリコン−ゲルマニウムベース層がSiXGe(1−X)を含む、請求項43に記載の方法。
- 前記シリコン−ゲルマニウムベース層がSiXGeYCZを含み、X+Y+Z=1である、請求項43に記載の方法。
- 前記最上位シリコン層を形成する前記ステップを原子層堆積法(ALD)によって実行する、請求項43に記載の方法。
- 前記最上位シリコン層を形成する前記ステップを化学気相堆積法(CVD)によって実行する、請求項43に記載の方法。
- ひずみシリコン層を形成する前記ステップを、約30%から約40%のゲルマニウム濃度を有するシリコン−ゲルマニウムベース層の上に最上位シリコン層を形成するステップによって実行する、請求項39に記載の方法。
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EP (1) | EP1644980B1 (ja) |
JP (1) | JP2007529103A (ja) |
KR (1) | KR100797278B1 (ja) |
CN (1) | CN100524785C (ja) |
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KR20060028745A (ko) | 2006-03-31 |
CN100524785C (zh) | 2009-08-05 |
US7485904B2 (en) | 2009-02-03 |
US20070057298A1 (en) | 2007-03-15 |
EP1644980B1 (en) | 2011-03-30 |
DE602004032026D1 (de) | 2011-05-12 |
US20190058000A1 (en) | 2019-02-21 |
CN1849708A (zh) | 2006-10-18 |
ATE504085T1 (de) | 2011-04-15 |
US20090146153A1 (en) | 2009-06-11 |
EP1644980A1 (en) | 2006-04-12 |
US9461079B2 (en) | 2016-10-04 |
US20170117319A1 (en) | 2017-04-27 |
US20050006565A1 (en) | 2005-01-13 |
WO2005008782A1 (en) | 2005-01-27 |
KR100797278B1 (ko) | 2008-01-23 |
US10910431B2 (en) | 2021-02-02 |
US10134798B2 (en) | 2018-11-20 |
US7872284B2 (en) | 2011-01-18 |
US7164182B2 (en) | 2007-01-16 |
US20110059573A1 (en) | 2011-03-10 |
US20210242272A1 (en) | 2021-08-05 |
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