JP2007529091A - 集束イオンビームシステム用磁気増幅式誘導結合プラズマ源 - Google Patents
集束イオンビームシステム用磁気増幅式誘導結合プラズマ源 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/24—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
- H01J37/241—High voltage power supply or regulation circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0815—Methods of ionisation
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Abstract
Description
ここで、dcは色ディスクの径であり、CCは光学系の色収差係数、αiはターゲットに集束スポットを形成するときのビームの半角収束である。E0は、抽出光学素子によってイオンが加速されるときのエネルギーである。ΔEは、アンテナからの静電結合のため、プラズマ電位に生じた変動によって広がったエネルギーであり、これは、プラズマのプレシース(pre−sheath)領域の電位勾配によって定まる、ソース源からのイオンの基本軸方向のエネルギーの広がりに加算される。好ましくないことに、RF源によって生じた変動は、実質的にビームの焦点に影響を及ぼす。少なくともこの一部の理由のため、RF源は、FIBシステムとともに使用することができないと考えられる。
ここでβmaxは、抽出光学素子から誘導される収差がゼロであると仮定したときのビーム輝度であり、Jiは、プラズマから抽出されたエネルギー密度、E0は、抽出光学素子でイオンが加速されるときに到達するエネルギー、E⊥は、平均熱イオンエネルギーである。電流密度が増大すると、ビーム輝度は向上し、平均熱イオンエネルギーが減少する。
で表され、ここで(ni)は、プラズマイオン密度、(Te)は、プラズマ内の平均電子エネルギー、(q)は、電荷の基本単位、(kB)は、ボルツマン定数、(Mi)は、プラズマ内のイオンの平均質量である。プラズマイオン密度が増加し、プラズマ内の平均電子エネルギーが増大すると、電流密度が増大することは明らかである。従って、前述の値では、最適なαiとして、〜7.5mradが得られ、20keVでの像側の輝度は、〜7×103Acm−2sr−1となり、ソース源の輝度は、〜1.5×104Acm−2sr−1となる。
Claims (20)
- 集束イオンビームを形成する方法であって、
プラズマにエネルギーを誘導結合するアンテナに、RF出力を印加して、アンテナの近傍でプラズマをイオン化させるステップと、
プラズマ電位の変動を抑制するため、前記アンテナを通る電気的な位相シフトを調整するインピーダンス整合回路を提供するステップと、
前記アンテナ近傍の抽出領域から、イオン化ビームを抽出するステップと、
前記領域から抽出されたイオン化ビームに、集束機構を提供するステップと、
を有する方法。 - さらに、ビームの抽出領域の近傍に、磁石を提供するステップを有することを特徴とする請求項1に記載の方法。
- 前記磁石は、固定環状磁石であることを特徴とする請求項2に記載の方法。
- 前記磁石は、200から1000ガウスの間の磁場を形成することを特徴とする請求項2に記載の方法。
- 前記回路は、プラズマに伝達される出力量を変化するように調整することが可能であることを特徴とする請求項1に記載の方法。
- 前記回路は、前記アンテナへの電圧位相を変化するように調整することが可能であることを特徴とする請求項1に記載の方法。
- 前記コイルは、前記アンテナの軸が抽出ビームの伝播する軸方向と実質的に一致するように設置されていることを特徴とする請求項1に記載の方法。
- 前記アンテナは、ソース源出口開口と直接隣接する領域でのプラズマ電位の変動を最小化するように設置されていることを特徴とする請求項1に記載の方法。
- プラズマ領域を覆う容器と、
プラズマをイオン化させるRF電気源によって励起されるアンテナと、
イオン化プラズマ内でのRF振動を実質的に抑制するため、前記アンテナを前記電気源に結合する回路と、
イオン化プラズマからビームを抽出する抽出機構と、
前記ビームを集束させる集束機構と、
を有する集束イオンビームシステム。 - さらに、プラズマ内で生じる熱を拡散する手段を有することを特徴とする請求項9に記載のシステム。
- 前記アンテナは、単一回または複数回巻き回された螺旋コイルを有し、該コイルは、該コイルに隣接する領域において、プラズマ内に高いイオン密度を生じさせるように配向されていることを特徴とする請求項9に記載のシステム。
- 前記集束機構は、ミル処理および成膜処理のため、ビームを集束させることを特徴とする請求項9に記載のシステム。
- プラズマ内の高いイオン密度によって、プラズマ電位に実質的な変動が生じずに、さらに抽出イオンの軸方向のエネルギーが広がらずに、高いビーム電流が形成されることを特徴とする請求項9に記載のシステム。
- イオン化可能な非金属プラズマガスを含むプラズマ管であって、該プラズマ管の端部にソース源開口を備えるプラズマ管と、
該プラズマ管の周囲に設置された螺旋アンテナと、
該アンテナを含むネットワーク内の回路と、
前記ソース源開口を通るプラズマからビームを抽出することが可能な抽出器と、
ビームを集束させる集束手段と、
を有する、ミル処理および成膜処理用の集束イオンビームシステム。 - さらに、前記ソース源開口に隣接して設置された磁石を有することを特徴とする請求項14に記載のシステム。
- 前記集束機構は、10keVの抽出ビームエネルギーで、2000A/cm2/srを超える高輝度のビームを形成することを特徴とする請求項14に記載のシステム。
- 当該システムは、3eV未満のエネルギーの広がりを示すことを特徴とする請求項14に記載のシステム。
- 当該システムは、4eV未満のエネルギーの広がりを示すことを特徴とする請求項14に記載のシステム。
- さらに、RF源をプラズマに結合する変圧器を有することを特徴とする請求項14に記載のシステム。
- 前記変圧器の二次側は、中心がタップ処理され、回路を介してアースに接続されていることを特徴とする請求項19に記載のシステム。
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US54614204P | 2004-02-20 | 2004-02-20 | |
US60/546,142 | 2004-02-20 | ||
US10/988,745 | 2004-11-13 | ||
US10/988,745 US7241361B2 (en) | 2004-02-20 | 2004-11-13 | Magnetically enhanced, inductively coupled plasma source for a focused ion beam system |
PCT/US2005/005643 WO2005081940A2 (en) | 2004-02-20 | 2005-02-18 | Magnetically enhanced, inductively coupled plasma source for a focused ion beam system |
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JP2007529091A true JP2007529091A (ja) | 2007-10-18 |
JP5172154B2 JP5172154B2 (ja) | 2013-03-27 |
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US (5) | US7241361B2 (ja) |
EP (1) | EP1725697A4 (ja) |
JP (1) | JP5172154B2 (ja) |
WO (1) | WO2005081940A2 (ja) |
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JP2013542563A (ja) * | 2010-09-30 | 2013-11-21 | エフ・イ−・アイ・カンパニー | 誘導結合プラズマ・イオン源用のコンパクトなrfアンテナ |
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---|---|---|---|---|
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WO2014201292A1 (en) * | 2013-06-12 | 2014-12-18 | General Plasma, Inc. | Anode layer slit ion source |
US10580623B2 (en) | 2013-11-19 | 2020-03-03 | Applied Materials, Inc. | Plasma processing using multiple radio frequency power feeds for improved uniformity |
WO2016094353A1 (en) * | 2014-12-08 | 2016-06-16 | University Of Houston System | Systems and methods for rapidly fabricating nanopatterns in a parallel fashion over large areas |
US9595424B2 (en) * | 2015-03-02 | 2017-03-14 | Lam Research Corporation | Impedance matching circuit for operation with a kilohertz RF generator and a megahertz RF generator to control plasma processes |
US9761414B2 (en) * | 2015-10-08 | 2017-09-12 | Lam Research Corporation | Uniformity control circuit for use within an impedance matching circuit |
US10103008B2 (en) | 2016-01-12 | 2018-10-16 | Fei Company | Charged particle beam-induced etching |
US9899181B1 (en) | 2017-01-12 | 2018-02-20 | Fei Company | Collision ionization ion source |
US9941094B1 (en) | 2017-02-01 | 2018-04-10 | Fei Company | Innovative source assembly for ion beam production |
EP3648550B1 (en) | 2017-06-27 | 2021-06-02 | Canon Anelva Corporation | Plasma treatment device |
WO2019004192A1 (ja) | 2017-06-27 | 2019-01-03 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
KR102257134B1 (ko) | 2017-06-27 | 2021-05-26 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치 |
PL3648551T3 (pl) | 2017-06-27 | 2021-12-06 | Canon Anelva Corporation | Urządzenie do obróbki plazmowej |
US10573495B2 (en) | 2017-10-09 | 2020-02-25 | Denton Vacuum, LLC | Self-neutralized radio frequency plasma ion source |
KR102439024B1 (ko) * | 2018-06-26 | 2022-09-02 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치, 플라스마 처리 방법, 프로그램, 및 메모리 매체 |
CN110846633A (zh) * | 2019-11-13 | 2020-02-28 | 中国工程物理研究院材料研究所 | 激光状态方程实验用阻抗匹配靶的聚焦离子束制备方法 |
US11621147B2 (en) | 2020-01-24 | 2023-04-04 | Corning Incorporated | Systems and methods for optimizing RF plasma power coupling |
US12061159B2 (en) | 2022-04-25 | 2024-08-13 | Fei Company | Particle-induced x-ray emission (PIXE) using hydrogen and multi-species focused ion beams |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06176728A (ja) * | 1992-12-02 | 1994-06-24 | Nissin Electric Co Ltd | 低エネルギ−イオンビ−ム発生装置 |
JPH11162697A (ja) * | 1997-11-28 | 1999-06-18 | Mc Electronics Kk | プラズマ生成用の螺旋共振装置 |
JPH11312473A (ja) * | 1998-04-28 | 1999-11-09 | Hitachi Ltd | 荷電粒子源および荷電粒子ビーム装置並びに不良解析方法および半導体デバイスの製造方法 |
JP2000501568A (ja) * | 1995-12-04 | 2000-02-08 | エム・シー・エレクトロニクス株式会社 | 発生させたプラズマ間の容量電流における位相部と逆位相部が平衡する誘導構造によって励起される高周波プラズマ処理方法 |
JP2000133497A (ja) * | 1998-10-29 | 2000-05-12 | Toshiba Corp | 高周波放電型プラズマ発生装置 |
JP2002508883A (ja) * | 1997-07-05 | 2002-03-19 | サーフィス テクノロジー システムズ ピーエルシー | プラズマ加工装置 |
US20030218430A1 (en) * | 2002-05-22 | 2003-11-27 | Ka-Ngo Leung | Ion source with external RF antenna |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4625440Y1 (ja) | 1967-09-22 | 1971-09-01 | ||
US4362632A (en) * | 1974-08-02 | 1982-12-07 | Lfe Corporation | Gas discharge apparatus |
JPS5856332A (ja) * | 1981-09-30 | 1983-04-04 | Hitachi Ltd | マスクの欠陥修正方法 |
US4859908A (en) * | 1986-09-24 | 1989-08-22 | Matsushita Electric Industrial Co., Ltd. | Plasma processing apparatus for large area ion irradiation |
JPH01132033A (ja) | 1987-11-17 | 1989-05-24 | Hitachi Ltd | イオン源及び薄膜形成装置 |
EP0339554A3 (de) | 1988-04-26 | 1989-12-20 | Hauzer Holding B.V. | Hochfrequenz-Ionenstrahlquelle |
JPH071686B2 (ja) * | 1988-09-22 | 1995-01-11 | 株式会社日立製作所 | イオンマイクロアナライザ |
DE4018954A1 (de) * | 1989-06-15 | 1991-01-03 | Mitsubishi Electric Corp | Trockenaetzgeraet |
JPH03272549A (ja) * | 1990-03-20 | 1991-12-04 | Shimadzu Corp | 高周波イオン源 |
US5089441A (en) * | 1990-04-16 | 1992-02-18 | Texas Instruments Incorporated | Low-temperature in-situ dry cleaning process for semiconductor wafers |
JPH06176725A (ja) | 1992-12-04 | 1994-06-24 | Nissin Electric Co Ltd | イオン源 |
US5433812A (en) * | 1993-01-19 | 1995-07-18 | International Business Machines Corporation | Apparatus for enhanced inductive coupling to plasmas with reduced sputter contamination |
JPH07312201A (ja) | 1994-05-17 | 1995-11-28 | Nissin Electric Co Ltd | イオンド−ピング装置におけるイオンビ−ム運転方法 |
JPH07335163A (ja) | 1994-06-13 | 1995-12-22 | Nissin Electric Co Ltd | イオンビーム発生方法およびその装置 |
JP3272549B2 (ja) | 1994-09-29 | 2002-04-08 | 三菱重工業株式会社 | 製紙プラントの水分制御装置 |
US5614711A (en) * | 1995-05-04 | 1997-03-25 | Indiana University Foundation | Time-of-flight mass spectrometer |
US5573595A (en) | 1995-09-29 | 1996-11-12 | Lam Research Corporation | Methods and apparatus for generating plasma |
US6017221A (en) | 1995-12-04 | 2000-01-25 | Flamm; Daniel L. | Process depending on plasma discharges sustained by inductive coupling |
US5686796A (en) * | 1995-12-20 | 1997-11-11 | International Business Machines Corporation | Ion implantation helicon plasma source with magnetic dipoles |
TW403959B (en) * | 1996-11-27 | 2000-09-01 | Hitachi Ltd | Plasma treatment device |
US5868651A (en) * | 1997-12-22 | 1999-02-09 | Washington; Leonard A. | Multi-function exercise device |
US5945677A (en) * | 1998-04-10 | 1999-08-31 | The Regents Of The University Of California | Focused ion beam system |
KR100856451B1 (ko) * | 2000-04-25 | 2008-09-04 | 도쿄엘렉트론가부시키가이샤 | 소재의 플라즈마 세정장치 및 방법 |
US6517469B1 (en) * | 2000-11-14 | 2003-02-11 | Mix Promotion, Inc. | Exercising device for conditioning the body |
KR100444189B1 (ko) * | 2001-03-19 | 2004-08-18 | 주성엔지니어링(주) | 유도결합 플라즈마 소스의 임피던스 정합 회로 |
US6768120B2 (en) * | 2001-08-31 | 2004-07-27 | The Regents Of The University Of California | Focused electron and ion beam systems |
US6752747B2 (en) * | 2002-01-17 | 2004-06-22 | Ya-Chu Hsiao | Multi-directional swivel body builder |
US7298091B2 (en) * | 2002-02-01 | 2007-11-20 | The Regents Of The University Of California | Matching network for RF plasma source |
US7084407B2 (en) * | 2002-02-13 | 2006-08-01 | The Regents Of The University Of California | Ion beam extractor with counterbore |
US7176469B2 (en) * | 2002-05-22 | 2007-02-13 | The Regents Of The University Of California | Negative ion source with external RF antenna |
US8679307B2 (en) * | 2002-08-02 | 2014-03-25 | E.A. Fischione Instruments, Inc. | Method and apparatus for preparing specimens for microscopy |
US20050051273A1 (en) * | 2003-09-04 | 2005-03-10 | Kenji Maeda | Plasma processing apparatus |
EP1683163B1 (en) | 2003-10-17 | 2012-02-22 | Fei Company | Charged particle extraction device and method |
US7791047B2 (en) * | 2003-12-12 | 2010-09-07 | Semequip, Inc. | Method and apparatus for extracting ions from an ion source for use in ion implantation |
US7241361B2 (en) * | 2004-02-20 | 2007-07-10 | Fei Company | Magnetically enhanced, inductively coupled plasma source for a focused ion beam system |
WO2008094297A2 (en) | 2006-07-14 | 2008-08-07 | Fei Company | A multi-source plasma focused ion beam system |
JP4625440B2 (ja) | 2006-11-30 | 2011-02-02 | 和正 山本 | 環体及びこれを備える吊具 |
-
2004
- 2004-11-13 US US10/988,745 patent/US7241361B2/en active Active
-
2005
- 2005-02-18 EP EP05713954A patent/EP1725697A4/en not_active Ceased
- 2005-02-18 WO PCT/US2005/005643 patent/WO2005081940A2/en not_active Application Discontinuation
- 2005-02-18 JP JP2006554300A patent/JP5172154B2/ja active Active
-
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- 2007-07-02 US US11/825,136 patent/US7670455B2/en active Active
-
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- 2010-02-11 US US12/704,123 patent/US8168957B2/en active Active
-
2012
- 2012-04-02 US US13/437,518 patent/US8829468B2/en active Active
-
2014
- 2014-09-09 US US14/481,642 patent/US9640367B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06176728A (ja) * | 1992-12-02 | 1994-06-24 | Nissin Electric Co Ltd | 低エネルギ−イオンビ−ム発生装置 |
JP2000501568A (ja) * | 1995-12-04 | 2000-02-08 | エム・シー・エレクトロニクス株式会社 | 発生させたプラズマ間の容量電流における位相部と逆位相部が平衡する誘導構造によって励起される高周波プラズマ処理方法 |
JP2002508883A (ja) * | 1997-07-05 | 2002-03-19 | サーフィス テクノロジー システムズ ピーエルシー | プラズマ加工装置 |
JPH11162697A (ja) * | 1997-11-28 | 1999-06-18 | Mc Electronics Kk | プラズマ生成用の螺旋共振装置 |
JPH11312473A (ja) * | 1998-04-28 | 1999-11-09 | Hitachi Ltd | 荷電粒子源および荷電粒子ビーム装置並びに不良解析方法および半導体デバイスの製造方法 |
JP2000133497A (ja) * | 1998-10-29 | 2000-05-12 | Toshiba Corp | 高周波放電型プラズマ発生装置 |
US20030218430A1 (en) * | 2002-05-22 | 2003-11-27 | Ka-Ngo Leung | Ion source with external RF antenna |
Non-Patent Citations (1)
Title |
---|
JPN7012001137; JIANG X ET AL: '"Mini rf-driven ion sources for focused ion beam systems"' REVIEW OF SCIENTIFIC INSTRUMENTS VOLUME 74, NUMBER 4, 20030401, pages 2288-2292, American Institute of Physics * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011204672A (ja) * | 2010-02-16 | 2011-10-13 | Fei Co | 誘導結合プラズマ・イオン源用のプラズマ点火装置 |
JP2013542563A (ja) * | 2010-09-30 | 2013-11-21 | エフ・イ−・アイ・カンパニー | 誘導結合プラズマ・イオン源用のコンパクトなrfアンテナ |
JP2013089594A (ja) * | 2011-10-19 | 2013-05-13 | Fei Co | 誘導結合プラズマ源用の内部分割ファラデー・シールド |
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EP1725697A2 (en) | 2006-11-29 |
US8168957B2 (en) | 2012-05-01 |
US7241361B2 (en) | 2007-07-10 |
JP5172154B2 (ja) | 2013-03-27 |
US9640367B2 (en) | 2017-05-02 |
WO2005081940A2 (en) | 2005-09-09 |
US20120319000A1 (en) | 2012-12-20 |
EP1725697A4 (en) | 2009-11-25 |
US20080017319A1 (en) | 2008-01-24 |
US20050183667A1 (en) | 2005-08-25 |
US20150130348A1 (en) | 2015-05-14 |
US8829468B2 (en) | 2014-09-09 |
US20100294648A1 (en) | 2010-11-25 |
WO2005081940A3 (en) | 2007-07-12 |
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