JP2007528590A - 金/銀/銅の合金の金属フィラーを有する半導体パッケージ - Google Patents
金/銀/銅の合金の金属フィラーを有する半導体パッケージ Download PDFInfo
- Publication number
- JP2007528590A JP2007528590A JP2006533207A JP2006533207A JP2007528590A JP 2007528590 A JP2007528590 A JP 2007528590A JP 2006533207 A JP2006533207 A JP 2006533207A JP 2006533207 A JP2006533207 A JP 2006533207A JP 2007528590 A JP2007528590 A JP 2007528590A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- window frame
- flange
- semiconductor package
- metal filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
本発明は半導体パッケージに関し、さらに詳細にはフランジ、ウィンドウフレームおよびリードのような多様な部品が、金属フィラーを使用して結合されたパッケージに関する。
<従来技術>
複数のリードを実装し絶縁するウィンドウフレームにおける開口部内で、1または2以上の半導体チップがヒートシンクであるフランジ上に実装される半導体パッケージを提供することは、技術的に知られている。チップは、LDMOS(横方向拡散金属酸化物半導体)型およびパッケージ型LDMOSパワートランジスタのパッケージであっても良い。ウィンドウフレームは、半導体パッケージ上にリードを実装し且つヒートシンクであるフランジおよびパッケージの他部分からリードを絶縁する働きをする。ウィンドウフレームは、半導体チップを取り囲む開口部を有している。チップは、ワイヤーボンドによって、そのようなリードに電気的に連結される。
Claims (8)
- 少なくとも2つの部品を含み、当該少なくとも2つの部品間に電位を印加するように構成された電子パッケージであって、前記2つの部品間に配され、前記2つの部品を結合する合金フィラーを有し、前記合金フィラーは金,銀および銅からなることを特徴とする電子パッケージ。
- 前記金,銀および銅は、前記合金フィラー中に原子状態で分散していることを特徴とする請求項1に記載の電子パッケージ。
- 前記合金フィラーは、60Au20Ag20Cuを含むことを特徴とする請求項1に記載の電子パッケージ。
- フランジ,ウィンドウフレーム,少なくとも1つのリードおよび合金フィラーを含む半導体パッケージであって、前記合金フィラーは、前記ウィンドウフレームを前記フランジおよび前記少なくとも1つのリードに結合し、金,銀および銅からなることを特徴とする半導体パッケージ。
- 前記金,銀および銅は、前記合金フィラー中に原子状態で分散していることを特徴とする請求項4に記載の半導体パッケージ。
- 前記合金フィラーは、60Au20Ag20Cuを含むことを特徴とする請求項4に記載の半導体パッケージ。
- 前記フランジと反対側の前記ウィンドウフレームに結合した複数のリードと、前記ウィンドウフレームにおける開口部内の前記フランジ上に実装されるチップと、前記チップ上に実装され、前記複数のリードおよび前記ウィンドウフレームに自身の周辺端部に沿って取り付けられる蓋と、をさらに含むことを特徴とする請求項4に記載の半導体パッケージ。
- 表面を有するヒートシンクであるフランジと、対向する第1の表面と第2の表面との間に開口部を有するウィンドウフレームと、複数のリードと、を含む半導体パッケージであって、前記ウィンドウフレームの第1の表面は、合金フィラーによって前記フランジの表面に結合しており、前記複数のリードは、前記合金フィラーによって前記ウィンドウフレームの第2の表面に結合しており、少なくとも1つのチップが前記ウィンドウフレームにおける開口部内の前記フランジ上に実装され、ワイヤが前記複数のリードに接着され、周辺端部を有する蓋は、前記リードおよび前記フランジと反対側の前記ウィンドウフレームの第2の表面にエポキシによって結合し、前記合金フィラーは60Au20Ag20Cuからなることを特徴とする半導体パッケージ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/442,549 US6900525B2 (en) | 2003-05-21 | 2003-05-21 | Semiconductor package having filler metal of gold/silver/copper alloy |
US10/442,549 | 2003-05-21 | ||
PCT/US2004/015639 WO2004107436A1 (en) | 2003-05-21 | 2004-05-19 | Semiconductor package having filler metal of gold/silver/copper alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007528590A true JP2007528590A (ja) | 2007-10-11 |
JP5097403B2 JP5097403B2 (ja) | 2012-12-12 |
Family
ID=33450226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006533207A Expired - Fee Related JP5097403B2 (ja) | 2003-05-21 | 2004-05-19 | 金/銀/銅の合金の金属フィラーを有する半導体パッケージ |
Country Status (10)
Country | Link |
---|---|
US (1) | US6900525B2 (ja) |
EP (1) | EP1625618B1 (ja) |
JP (1) | JP5097403B2 (ja) |
KR (1) | KR101109803B1 (ja) |
CN (1) | CN1802740B (ja) |
AT (1) | ATE546833T1 (ja) |
CA (1) | CA2526484C (ja) |
HK (1) | HK1086948A1 (ja) |
IL (1) | IL172051A (ja) |
WO (1) | WO2004107436A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7364168B2 (ja) | 2019-02-12 | 2023-10-18 | 住友電工デバイス・イノベーション株式会社 | 半導体モジュール及び半導体デバイス収容体 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900525B2 (en) * | 2003-05-21 | 2005-05-31 | Kyocera America, Inc. | Semiconductor package having filler metal of gold/silver/copper alloy |
US20050253282A1 (en) * | 2004-04-27 | 2005-11-17 | Daoqiang Lu | Temperature resistant hermetic sealing formed at low temperatures for MEMS packages |
CN102217059A (zh) * | 2011-06-03 | 2011-10-12 | 华为技术有限公司 | 一种封装用绝缘环、绝缘环组合件和封装体 |
US9331000B2 (en) | 2014-04-02 | 2016-05-03 | Kyocera America, Inc. | Heat management in electronics packaging |
CN109037161A (zh) * | 2018-06-15 | 2018-12-18 | 华为技术有限公司 | 一种法兰和半导体功率器件 |
CN114582826A (zh) * | 2020-11-30 | 2022-06-03 | 上海华为技术有限公司 | 一种封装结构、封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0366493A (ja) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | エレクトロマイグレーション防止性ロウ付け用材料 |
JPH11150217A (ja) * | 1997-11-14 | 1999-06-02 | Nec Corp | 半導体装置及びその製造方法 |
JP2003197803A (ja) * | 2001-12-27 | 2003-07-11 | Sumitomo Metal Electronics Devices Inc | 半導体パッケージ |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4325051A (en) * | 1980-08-29 | 1982-04-13 | Sprague Electric Company | PTCR Package |
US4431983A (en) * | 1980-08-29 | 1984-02-14 | Sprague Electric Company | PTCR Package |
US4487638A (en) * | 1982-11-24 | 1984-12-11 | Burroughs Corporation | Semiconductor die-attach technique and composition therefor |
JPS61287155A (ja) * | 1985-06-14 | 1986-12-17 | Hitachi Ltd | 半導体装置及び半導体装置の製造方法 |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
US5043534A (en) * | 1990-07-02 | 1991-08-27 | Olin Corporation | Metal electronic package having improved resistance to electromagnetic interference |
US5043139A (en) * | 1990-10-09 | 1991-08-27 | Eastman Kodak Company | Amalgam preform, method of forming the preform and method of bonding therewith |
US5164885A (en) * | 1991-11-21 | 1992-11-17 | Motorola, Inc. | Electronic package having a non-oxide ceramic bonded to metal and method for making |
US5313365A (en) * | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
US5428501A (en) * | 1993-08-13 | 1995-06-27 | Marine Mechanical Corporation | Packaging structure and method for solid electrolyte capacitors |
US5360942A (en) * | 1993-11-16 | 1994-11-01 | Olin Corporation | Multi-chip electronic package module utilizing an adhesive sheet |
US5569958A (en) * | 1994-05-26 | 1996-10-29 | Cts Corporation | Electrically conductive, hermetic vias and their use in high temperature chip packages |
KR100215181B1 (ko) * | 1995-10-06 | 1999-08-16 | 포만 제프리 엘 | 도전성 은/증합체 복합체의 부식 및 용해 방지구조물 |
US5757611A (en) * | 1996-04-12 | 1998-05-26 | Norhtrop Grumman Corporation | Electronic package having buried passive components |
US5761048A (en) * | 1996-04-16 | 1998-06-02 | Lsi Logic Corp. | Conductive polymer ball attachment for grid array semiconductor packages |
US5825084A (en) * | 1996-08-22 | 1998-10-20 | Express Packaging Systems, Inc. | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices |
US6027791A (en) * | 1996-09-30 | 2000-02-22 | Kyocera Corporation | Structure for mounting a wiring board |
US5808870A (en) * | 1996-10-02 | 1998-09-15 | Stmicroelectronics, Inc. | Plastic pin grid array package |
CN1068064C (zh) * | 1997-05-27 | 2001-07-04 | 旭龙精密工业股份有限公司 | 引线框架及其制造方法 |
US6211463B1 (en) | 1998-01-26 | 2001-04-03 | Saint-Gobain Industrial Ceramics, Inc. | Electronic circuit package with diamond film heat conductor |
US20020005247A1 (en) * | 1999-02-08 | 2002-01-17 | Teresita Ordonez Graham | Electrically conductive paste materials and applications |
US6214152B1 (en) * | 1999-03-22 | 2001-04-10 | Rjr Polymers, Inc. | Lead frame moisture barrier for molded plastic electronic packages |
US6198634B1 (en) * | 1999-03-31 | 2001-03-06 | International Business Machines Corporation | Electronic package with stacked connections |
US6261868B1 (en) | 1999-04-02 | 2001-07-17 | Motorola, Inc. | Semiconductor component and method for manufacturing the semiconductor component |
US6307755B1 (en) * | 1999-05-27 | 2001-10-23 | Richard K. Williams | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
JP2002118202A (ja) * | 2000-10-05 | 2002-04-19 | Sanyo Electric Co Ltd | 放熱基板および半導体モジュール |
JP2003068919A (ja) * | 2001-08-27 | 2003-03-07 | Nec Yamagata Ltd | 半導体装置 |
US7005729B2 (en) * | 2002-04-24 | 2006-02-28 | Intel Corporation | Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame |
US6900525B2 (en) * | 2003-05-21 | 2005-05-31 | Kyocera America, Inc. | Semiconductor package having filler metal of gold/silver/copper alloy |
-
2003
- 2003-05-21 US US10/442,549 patent/US6900525B2/en not_active Expired - Lifetime
-
2004
- 2004-05-19 CA CA2526484A patent/CA2526484C/en not_active Expired - Fee Related
- 2004-05-19 JP JP2006533207A patent/JP5097403B2/ja not_active Expired - Fee Related
- 2004-05-19 EP EP04752628A patent/EP1625618B1/en not_active Expired - Lifetime
- 2004-05-19 AT AT04752628T patent/ATE546833T1/de active
- 2004-05-19 KR KR1020057022222A patent/KR101109803B1/ko active IP Right Grant
- 2004-05-19 CN CN2004800158931A patent/CN1802740B/zh not_active Expired - Fee Related
- 2004-05-19 WO PCT/US2004/015639 patent/WO2004107436A1/en active Application Filing
-
2005
- 2005-11-20 IL IL172051A patent/IL172051A/en active IP Right Grant
-
2006
- 2006-08-10 HK HK06108860.4A patent/HK1086948A1/xx not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0366493A (ja) * | 1989-08-04 | 1991-03-22 | Ngk Spark Plug Co Ltd | エレクトロマイグレーション防止性ロウ付け用材料 |
JPH11150217A (ja) * | 1997-11-14 | 1999-06-02 | Nec Corp | 半導体装置及びその製造方法 |
JP2003197803A (ja) * | 2001-12-27 | 2003-07-11 | Sumitomo Metal Electronics Devices Inc | 半導体パッケージ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7364168B2 (ja) | 2019-02-12 | 2023-10-18 | 住友電工デバイス・イノベーション株式会社 | 半導体モジュール及び半導体デバイス収容体 |
Also Published As
Publication number | Publication date |
---|---|
EP1625618B1 (en) | 2012-02-22 |
CA2526484C (en) | 2013-04-30 |
IL172051A (en) | 2013-12-31 |
CN1802740B (zh) | 2011-03-30 |
HK1086948A1 (en) | 2006-09-29 |
EP1625618A1 (en) | 2006-02-15 |
CA2526484A1 (en) | 2004-12-09 |
KR20060020634A (ko) | 2006-03-06 |
JP5097403B2 (ja) | 2012-12-12 |
EP1625618A4 (en) | 2010-03-31 |
KR101109803B1 (ko) | 2012-02-27 |
CN1802740A (zh) | 2006-07-12 |
WO2004107436A1 (en) | 2004-12-09 |
US20040232529A1 (en) | 2004-11-25 |
ATE546833T1 (de) | 2012-03-15 |
US6900525B2 (en) | 2005-05-31 |
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