JP2007525788A - 厚膜テープのためのイオンビームアシスト高温超伝導体(hts)堆積 - Google Patents
厚膜テープのためのイオンビームアシスト高温超伝導体(hts)堆積 Download PDFInfo
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- 230000008021 deposition Effects 0.000 title claims description 46
- 238000010884 ion-beam technique Methods 0.000 title claims description 23
- 239000002887 superconductor Substances 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 238000000034 method Methods 0.000 claims abstract description 36
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims abstract 2
- 238000000151 deposition Methods 0.000 claims description 48
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 15
- 238000005240 physical vapour deposition Methods 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 63
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 32
- 239000002243 precursor Substances 0.000 description 23
- 238000005137 deposition process Methods 0.000 description 18
- 238000004549 pulsed laser deposition Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 238000010849 ion bombardment Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000012159 carrier gas Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- IQAKAOAPBMJSGJ-UHFFFAOYSA-N [Cu].[Y].[Ba] Chemical compound [Cu].[Y].[Ba] IQAKAOAPBMJSGJ-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 2
- 229910016006 MoSi Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BTGZYWWSOPEHMM-UHFFFAOYSA-N [O].[Cu].[Y].[Ba] Chemical compound [O].[Cu].[Y].[Ba] BTGZYWWSOPEHMM-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 229910000953 kanthal Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/408—Oxides of copper or solid solutions thereof
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using ion beam radiation
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0436—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD]
- H10N60/0464—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD] by metalloorganic chemical vapour deposition [MOCVD]
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0521—Processes for depositing or forming copper oxide superconductor layers by pulsed laser deposition, e.g. laser sputtering
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- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Chemical Vapour Deposition (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (12)
- 1.5ミクロン以上の厚さのコーティングと幅1センチにつき200A以上の臨界電流とを持つ高電流密度のHTSテープを連続的に製造するプロセスであって、基板が、堆積反応炉で、第1の堆積ゾーンを通るとき、該基板に第1の厚さのコーティングを適用し、前記基板が、前記堆積反応炉で少なくとも一つの付加的な堆積ゾーンを通るとき、その基板に直ちに付加的な厚さのコーティングを適用することを備え、前記第1の堆積ゾーンからの出口でのコーティング厚さは1.5ミクロンより大きくなく、前記基板が少なくとも前記堆積ゾーンの最後のものを通過するとき、前記基板はイオンビームによって照射されることを特徴とする。
- 請求項1のプロセスであって、MOCVDプロセスである。
- 請求項1のプロセスであって、PLDプロセスである。
- 請求項1のプロセスであって、スパッタリングプロセスである。
- 請求項1のプロセスにおいて、2つの堆積ゾーンがある。
- 請求項1のプロセスにおいて、イオンビームは第1の堆積ゾーンの前記基板に衝突する。
- 請求項1のプロセスにおいて、臨界電流が幅1センチにつき300A以上である。
- 請求項1のプロセスにおいて、前記臨界電流が、幅1センチにつき400A以上である。
- 請求項1のプロセスの製造物。
- 請求項6のプロセスの製造物。
- 請求項7のプロセスの製造物。
- 請求項8のプロセスの製造物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US10/456,733 US8182862B2 (en) | 2003-06-05 | 2003-06-05 | Ion beam-assisted high-temperature superconductor (HTS) deposition for thick film tape |
PCT/US2004/016597 WO2005007918A2 (en) | 2003-06-05 | 2004-05-25 | Ion beam-assisted high-temperature superconductor (hts) deposition for thick film tape |
Publications (1)
Publication Number | Publication Date |
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JP2007525788A true JP2007525788A (ja) | 2007-09-06 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006514975A Ceased JP2007525788A (ja) | 2003-06-05 | 2004-05-25 | 厚膜テープのためのイオンビームアシスト高温超伝導体(hts)堆積 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8182862B2 (ja) |
EP (1) | EP1638701A4 (ja) |
JP (1) | JP2007525788A (ja) |
KR (1) | KR20060021877A (ja) |
CN (1) | CN100450646C (ja) |
CA (1) | CA2527870A1 (ja) |
WO (1) | WO2005007918A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007227086A (ja) * | 2006-02-22 | 2007-09-06 | Tokyo Electron Ltd | 成膜装置および発光素子の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1859071A4 (en) * | 2005-02-23 | 2010-04-14 | Picodeon Ltd Oy | SEPARATION METHOD WITH PULSED LASER |
US9362477B2 (en) | 2010-02-05 | 2016-06-07 | Sunam Co., Ltd. | Method of forming ceramic wire, system of forming the same, and superconductor wire using the same |
CN102208321B (zh) * | 2011-05-11 | 2013-06-19 | 江苏大学 | 一种激光诱导等离子体注入基材的方法及装置 |
JP2022521941A (ja) * | 2019-02-25 | 2022-04-13 | コーニング インコーポレイテッド | マルチシャワーヘッド式化学蒸着反応装置、方法および生成物 |
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- 2003-06-05 US US10/456,733 patent/US8182862B2/en active Active
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- 2004-05-25 CN CNB2004800154678A patent/CN100450646C/zh not_active Expired - Fee Related
- 2004-05-25 WO PCT/US2004/016597 patent/WO2005007918A2/en active Application Filing
- 2004-05-25 KR KR1020057023345A patent/KR20060021877A/ko not_active Application Discontinuation
- 2004-05-25 JP JP2006514975A patent/JP2007525788A/ja not_active Ceased
- 2004-05-25 CA CA002527870A patent/CA2527870A1/en not_active Abandoned
- 2004-05-25 EP EP04776126A patent/EP1638701A4/en not_active Withdrawn
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US5432151A (en) * | 1993-07-12 | 1995-07-11 | Regents Of The University Of California | Process for ion-assisted laser deposition of biaxially textured layer on substrate |
JP2002203439A (ja) * | 2000-10-31 | 2002-07-19 | Internatl Superconductivity Technology Center | テープ状酸化物超電導体 |
JP2002265221A (ja) * | 2001-03-08 | 2002-09-18 | Dowa Mining Co Ltd | 酸化物超電導体単結晶粒子の集合体およびターゲット材並びにその製造方法 |
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JP2007227086A (ja) * | 2006-02-22 | 2007-09-06 | Tokyo Electron Ltd | 成膜装置および発光素子の製造方法 |
Also Published As
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WO2005007918A2 (en) | 2005-01-27 |
WO2005007918A3 (en) | 2005-06-30 |
EP1638701A2 (en) | 2006-03-29 |
US20040247780A1 (en) | 2004-12-09 |
CN100450646C (zh) | 2009-01-14 |
US8182862B2 (en) | 2012-05-22 |
CN1798617A (zh) | 2006-07-05 |
EP1638701A4 (en) | 2007-02-21 |
CA2527870A1 (en) | 2005-01-27 |
KR20060021877A (ko) | 2006-03-08 |
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