JP2007524227A - 高電圧/高電力ダイパッケージを形成する方法 - Google Patents
高電圧/高電力ダイパッケージを形成する方法 Download PDFInfo
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Abstract
【解決手段】フレキシブル非伝導性基板を提供するステップと、伝導層を基板に形成するステップと、弱体なリードを有する回路トレースを伝導層から形成するステップとを備える、高電圧構成要素パッケージを形成する方法である。構成要素の第一の側部は、回路トレースの少なくとも一部分の上方にあり、構成要素は、トレースの弱体なリードを破断させ且つ、リードを構成要素に接合することにより回路トレースに連結される。次に、フレキシブル基板は、回路トレースの別の部分が構成要素の第二の側部に近接するように曲げ又は折り重ねる。トレースは、伝導性接着剤又は別の弱体なトレースと接合することにより、構成要素の第二の側部に連結される。
Description
本発明の以下の詳細な説明において、実施の形態の一部を形成し、また、本発明を本発明に従って実施することができる一例としての特定の実施の形態を介して示した添付図面について説明する。しかし、その他の実施の形態も利用可能で、本発明の範囲から逸脱せずに構造的及び論理的な変更を為すことも可能であることを理解すべきである。
Claims (24)
- 構成要素の1つ以上の側部に電気接点を有する構成要素用のフリップチップ構成要素パッケージを形成する方法において、
構成要素の実質的に2倍の幅のフレキシブル基板を提供するステップと、
該基板に伝導層を形成するステップと、
電気的に別個の回路トレースを伝導層から形成するステップであって、少なくとも1つの該回路トレースは弱体なリードを有する前記ステップと、
構成要素の第一の側部を第一の回路トレースに取り付けるステップと、
第二の回路トレースが構成要素の第二の側部の上方に位置するように基板を折り重ねるステップと、
構成要素の第一の側部を第一の回路トレースに電気的に接合するステップと、
構成要素の第二の側部を第二の回路トレースに電気的に接合するステップとを備え、
接合部の1つは、弱体なリードを破断させ且つ、弱体なリードを構成要素に接触させることにより形成される、フリップチップ構成要素パッケージを形成する方法。 - 請求項1に記載の方法において、
第一の回路トレース及び第二の回路トレースの双方は、基板が折り重ねられたとき、通路(vias)の全てが構成要素の同一側にあるように配置された通路を有する、方法。 - 請求項2に記載の方法において、
構成要素を回路板に実装することができるようはんだボールを通路に施すステップを更に備える、方法。 - 請求項1に記載の構成要素パッケージを形成する方法において、
前記構成要素は、電界効果トランジスタ(FET)、金属酸化物半導体(MOS)FET(MOSFET)、絶縁ゲートFET(IGFET)、サイリスタ、双極トランジスタ、ダイオード、MOS制御サイリスタ、及び抵抗器から成る群から選ばれたデバイスである、構成要素パッケージを形成する方法。 - 請求項1に記載の方法において、
フレキシブル基板は、ポリイミド、ポリエステル、フルオロポリマーエポキシ、ポリエチレン及びフルオロカーボンから成る群から選ばれた材料である、方法。 - 請求項4に記載の方法において、
構成要素は50ボルト以上の電位にて作動可能である、方法。 - 請求項4に記載の方法において、
構成要素は500ボルト以上の電位にて作動可能である、方法。 - 請求項4に記載の方法において、
構成要素は1000ボルト以上の電位にて作動可能である、方法。 - 請求項1に記載の構成要素パッケージを形成する方法において、
回路トレースは、回路トレースの弱体なリードと接合することにより構成要素の第一の側部に連結される、構成要素パッケージを形成する方法。 - 携帯型電子製品のアプリケーション物を形成する方法において、
構成要素パッケージを形成するステップを備え、該構成要素パッケージを形成するステップは、
構成要素の実質的に2倍の幅のフレキシブル基板を提供するステップと、
該基板に伝導層を形成するステップと、
電気的に別個の回路トレースを伝導層から形成するステップであって、少なくとも1つの該回路トレースは弱体なリードを有する前記ステップと、
構成要素の第一の側部を第一の回路トレースに取り付けるステップと、
第二の回路トレースが構成要素の第二の側部の上方に位置するように基板を折り重ねるステップと、
構成要素の第一の側部を第一の回路トレースに電気的に接合するステップと、
構成要素の第二の側部を第二の回路トレースに電気的に接合するステップとを備え、
接合部の1つは、弱体なリードを破断させ且つ、弱体なリードを構成要素に接触させることにより形成される、携帯型電子製品のアプリケーション物を形成する方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素パッケーを携帯型電子製品のアプリケーション物に連結する前記ステップは、前記構成要素パッケージを携帯型電子製品のアプリケーション物に実装するステップを備える、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素パッケージを携帯型電子製品のアプリケーション物に連結する前記ステップは、前記構成要素パッケージを携帯型電子製品のアプリケーション物に表面実装するステップを備える、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記携帯型電子製品のアプリケーション物は植込み型医療装置(IMD)である、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素は50ボルト以上の電位にて作動可能である、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素は500ボルト以上の電位にて作動可能である、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素は1000ボルト以上の電位にて作動可能である、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記構成要素は、電界効果トランジスタ(FET)、金属酸化物半導体(MOS)FET(MOSFET)、絶縁ゲートFET(IGFET)、サイリスタ、双極トランジスタ、ダイオード、MOS制御サイリスタ、及び抵抗器から成る群から選ばれたデバイスを備える、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
前記フレキシブル基板は、ポリイミド、ポリエステル、フルオロポリマーエポキシ、ポリエチレン及びフルオロカーボンから成る群から選ばれた材料である、方法。 - 請求項10に記載の携帯型電子製品のアプリケーション物を形成する方法において、
回路トレースは、伝導性境界面により構成要素の第二の側部に連結される、方法。 - 請求項19に記載の携帯型電子製品を形成する方法において、
前記伝導性境界面は伝導性接着剤である、方法。 - 請求項10に記載の構成要素パッケージを形成する方法において、
回路トレースは、回路トレースの弱体なリードと接合することにより構成要素の第一の側部に連結される、方法。 - 構成要素の1つ以上の側部に電気接点を有する構成要素に対する表面実装構成要素パッケージを形成する方法において、
導電層を有するフレキシブル基板を提供するステップと、
電気的に別個の回路トレースを伝導層から形成するステップであって、少なくとも1つの該回路トレースは弱体なリードを有する前記ステップと、
回路トレースが構成要素の第一の側部における電気接点と電気的接触を為すように構成要素の第一の側部を第一の回路トレースに取り付けるステップと、
第二の回路トレースが構成要素の第二の側部の上方に位置し、第二の回路トレースが構成要素の第二の側部における電気接点と電気的接触を為すように基板を折り重ねるステップとを備え、
電気接点の1つは、弱体なリードを破断させ且つ、弱体なリードを構成要素の電気接点に接触させることにより形成される、表面実装構成要素パッケージを形成する方法。 - 請求項22に記載の方法において、回路トレースの各々には、基板の通路を通って伸びるはんだボールが接触する、方法。
- 請求項23に記載の方法において、はんだボールの全てがパッケージをフリップチップ様に実装するのを許容し得るようにパッケージの同一側部にある、方法。
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US10/464,151 | 2003-06-18 | ||
US10/464,151 US6991961B2 (en) | 2003-06-18 | 2003-06-18 | Method of forming a high-voltage/high-power die package |
PCT/US2004/019245 WO2004114336A2 (en) | 2003-06-18 | 2004-06-17 | Method for forming a high-voltage / high-power die package |
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JP2007524227A true JP2007524227A (ja) | 2007-08-23 |
JP4733025B2 JP4733025B2 (ja) | 2011-07-27 |
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US (1) | US6991961B2 (ja) |
EP (1) | EP1644977A2 (ja) |
JP (1) | JP4733025B2 (ja) |
CA (1) | CA2529272A1 (ja) |
WO (1) | WO2004114336A2 (ja) |
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WO2004114336A2 (en) | 2004-12-29 |
US6991961B2 (en) | 2006-01-31 |
US20040259289A1 (en) | 2004-12-23 |
EP1644977A2 (en) | 2006-04-12 |
CA2529272A1 (en) | 2004-12-29 |
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