JP2007519251A - トランジスタの製造方法 - Google Patents
トランジスタの製造方法 Download PDFInfo
- Publication number
- JP2007519251A JP2007519251A JP2006550430A JP2006550430A JP2007519251A JP 2007519251 A JP2007519251 A JP 2007519251A JP 2006550430 A JP2006550430 A JP 2006550430A JP 2006550430 A JP2006550430 A JP 2006550430A JP 2007519251 A JP2007519251 A JP 2007519251A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- source
- region
- gate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims description 45
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 125000006850 spacer group Chemical group 0.000 claims abstract description 49
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000004888 barrier function Effects 0.000 claims description 49
- 238000000151 deposition Methods 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 26
- 238000002513 implantation Methods 0.000 claims description 15
- 230000005684 electric field Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 5
- 239000007943 implant Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 239000002019 doping agent Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 4
- 229910021332 silicide Inorganic materials 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7839—Field effect transistors with field effect produced by an insulated gate with Schottky drain or source contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Shannon、Gerstner、「ソース・ゲーティッド薄膜トランジスタ(Source-gated Thin-Film Transistors)」、IEEE Electron Device Letters Vol.24 No.6、2003年6月
(a)透明基板を設ける工程;
(b)ゲート層を堆積し且つ該ゲート層をパターン形成してゲートを形成する工程;
(c)ゲート絶縁層を堆積する工程;
(d)薄膜半導体層を堆積する工程;
(e)前記半導体層とともに障壁を定めるソース層を堆積し、前記ゲートをマスクとして利用する前記基板を介しての背面露光工程を用いてソース層と前記半導体層との間に前記障壁の広がりを定める工程;を有する。
(e)透明ソース層を該透明ソース層と前記半導体層との界面に障壁を形成するために堆積する工程;
(f)ポジ型フォトレジスト層を堆積する工程;
(g)前記フォトレジスト層を前記ゲートと自己整合でパターン形成するために、前記ゲートをマスクとして利用し、前記透明基板及びソース層を介して前記ポジ型フォトレジスト層を露光する工程;
(h)ソース領域を形成するために前記フォトレジスト層によって直接的又は間接的に定められたパターンを用いて前記透明ソース層をエッチングする工程;
(i)工程(h)の前、後又は最中に前記ソース領域の端部にスペーサを形成する工程;
(j)前記ソース領域から前記スペーサの幅だけ離された高濃度ドープされたドレイン領域を形成するために、前記ソース領域及びスペーサをマスクとして利用して前記半導体層のドレイン領域にドーパントを注入する工程;を有する。
透明基板;
前記透明基板上のゲート;
前記ゲート上のゲート絶縁体;
前記ゲート上方の半導体層;
前記半導体層に沿って延在するソースであり、前記ゲートと重なり合うソースと半導体層との界面の障壁を定めるソース;
前記半導体層の高濃度ドープされたドレイン領域;及び
前記ドレイン領域と前記障壁との間の横方向の間隔を定める自己整合されたスペーサ領域又は電界緩和領域;を有する。
Claims (16)
- ソース・ゲーティッドトランジスタの製造方法であって:
(a)透明基板を設ける工程;
(b)ゲート層を堆積し且つ該ゲート層をパターン形成してゲートを形成する工程;
(c)ゲート絶縁層を堆積する工程;
(d)薄膜半導体層を堆積する工程;
(e)前記半導体層とともに障壁を定めるソース層を堆積し、前記ゲートをマスクとして利用する前記基板を介しての背面露光工程を用いてソース層と前記半導体層との間に前記障壁を定める工程;
を有する製造方法。 - 請求項1に記載の製造方法であって:
前記半導体層にドレインコンタクトと接触するドレイン領域を定める工程;
をさらに有し、
前記半導体層のスペーサ領域の横方向の範囲を自己整合プロセスを用いて前記ゲートに位置整合して定めるためにスペーサが用いられ、該スペーサ領域が前記ドレイン領域と前記障壁との間の領域である;
ところの製造方法。 - 前記ソース層が透明ソース層である請求項1又は2に記載の製造方法であって:
(f)前記透明ソース層にフォトレジストを堆積する工程;
をさらに有し、
前記背面露光工程が、前記ゲートをマスクとして利用して前記基板、ゲート絶縁層、半導体層及び透明ソース層を介する照明によって前記フォトレジストを露光することを含む;
ところの製造方法。 - 請求項1乃至3の何れかに記載の製造方法であって、電界緩和領域、又は前記ソースの端部の領域群を自己整合の背面露光プロセスを用いて前記ゲートに位置整合して定める工程であり、前記基板の頂部のフォトレジストであり前記ゲートをマスクとして利用して前記基板を介する照明で露光されたフォトレジストを用いて該電界緩和領域又は領域群がパターン形成されるところの工程をさらに有する製造方法。
- 請求項1乃至4の何れかに記載の製造方法であって、工程(d)の後に:
(e)透明ソース層を該透明ソース層と前記半導体層との界面に障壁を形成するために堆積する工程;
(f)ポジ型フォトレジスト層を堆積する工程;
(g)前記フォトレジスト層を前記ゲートと自己整合でパターン形成するために、前記ゲートをマスクとして利用し前記透明基板及びソース層を介して前記ポジ型フォトレジスト層を露光する工程;
(h)ソース領域を形成するために前記フォトレジスト層によって直接的又は間接的に定められたパターンを用いて前記透明ソース層をエッチングする工程;
(i)工程(h)の前、後又は最中に前記ソース領域の端部にスペーサを形成する工程;
(j)前記ソース領域から前記スペーサの幅だけ離された高濃度ドープされたドレイン領域を形成するために、前記ソース領域及びスペーサをマスクとして利用して前記半導体層のドレイン領域にドーパントを注入する工程;
を有する製造方法。 - 請求項5に記載の製造方法であって:
前記半導体層を堆積する工程(d)の後に絶縁層を堆積する工程;及び
前記マスクと位置整合されたソース開口を形成するために前記絶縁層をエッチングする工程;
を有する製造方法。 - 請求項5又は6に記載の製造方法であって:
前記ポジ型フォトレジスト層を堆積且つパターン形成する工程(f)及び(g)を実行する前に、前記透明ソース層上に透明犠牲層を堆積する工程;
工程(g)を実行した後に、スペーサを、該スペーサと前記透明犠牲層とが合わさって前記ゲートより幅広となるように、前記透明犠牲層の側壁に形成する工程;及び
前記ソース層及びその下の絶縁層をエッチングするために前記透明犠牲層及びスペーサをマスクとして利用して、前記ゲートより幅広の領域に延在するソース層を残し、且つ該ソース層と前記半導体層との間のフィールドプレートスペーサを形作る絶縁層を形成する工程;
をさらに有する製造方法。 - 請求項5に記載の製造方法であって、前記スペーサが前記ソース領域の端部に形成されるようにスペーサを形成する工程(i)がソース領域を形成する工程(h)の後に実行されるところの製造方法。
- 請求項5乃至8の何れかに記載の製造方法であって、前記半導体層のドープ領域を前記ソース領域に位置整合して形成するために、ソース領域を形成する工程(h)の後に前記半導体層への注入を行う工程をさらに有する製造方法。
- 請求項1乃至9の何れかに記載の製造方法であって、前記半導体層に低障壁化注入を行う工程をさらに有する製造方法。
- 請求項10に記載の製造方法であって、前記低障壁化注入は、前記ゲートに自己整合されるが前記ゲートの面積より狭い面積に注入され、該低障壁化注入の周辺に該低障壁化注入が注入されない中心領域の電界緩和領域を定めるところの製造方法。
- 請求項1乃至11の何れかに記載の製造方法であって、前記ソースと前記半導体層との間の前記障壁の中心にある中心領域に透明絶縁層を堆積する工程をさらに有する製造方法。
- 透明基板;
前記透明基板上のゲート;
前記ゲート上のゲート絶縁体;
前記ゲート上方の半導体層;
前記半導体層に沿って延在するソースであり、前記ゲートと重なり合うソースと半導体層との界面の障壁を定めるソース;
前記半導体層の高濃度ドープされたドレイン領域;及び
前記ドレイン領域と前記障壁との間の横方向の間隔を定める自己整合されたスペーサ領域;
を有するトランジスタ。 - 請求項13に記載のトランジスタであって、前記半導体層内に低障壁化注入物をさらに有するトランジスタ。
- 請求項14に記載のトランジスタであって、前記低障壁化注入物は前記障壁の中心部分に設けられ、該低障壁化注入物の周辺の中心領域の電界緩和領域を定めているところのトランジスタ。
- 請求項13乃至15の何れかに記載のトランジスタであって、前記ソースと前記半導体層との間の障壁の中心にある中心領域に透明絶縁層をさらに有するトランジスタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0401579.8A GB0401579D0 (en) | 2004-01-24 | 2004-01-24 | Transistor manufacture |
GB0401579.8 | 2004-01-24 | ||
PCT/IB2005/050249 WO2005071753A1 (en) | 2004-01-24 | 2005-01-21 | Transistor manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007519251A true JP2007519251A (ja) | 2007-07-12 |
JP4995577B2 JP4995577B2 (ja) | 2012-08-08 |
Family
ID=31971406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006550430A Active JP4995577B2 (ja) | 2004-01-24 | 2005-01-21 | トランジスタの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7569435B2 (ja) |
EP (1) | EP1711965B1 (ja) |
JP (1) | JP4995577B2 (ja) |
KR (1) | KR20070007046A (ja) |
CN (1) | CN1910756B (ja) |
GB (1) | GB0401579D0 (ja) |
TW (1) | TW200535936A (ja) |
WO (1) | WO2005071753A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8003504B2 (en) | 2006-09-01 | 2011-08-23 | Bae Systems Information And Electronic Systems Integration Inc. | Structure and method for fabrication of field effect transistor gates with or without field plates |
KR100885783B1 (ko) | 2007-01-23 | 2009-02-26 | 주식회사 하이닉스반도체 | 플래시 메모리 장치 및 동작 방법 |
JP2009076866A (ja) * | 2007-08-31 | 2009-04-09 | Sumitomo Electric Ind Ltd | ショットキーバリアダイオード |
CN102130009B (zh) * | 2010-12-01 | 2012-12-05 | 北京大学深圳研究生院 | 一种晶体管的制造方法 |
TWI511200B (zh) * | 2013-07-25 | 2015-12-01 | Ye Xin Technology Consulting Co Ltd | 顯示面板製作方法 |
CN110197851A (zh) | 2018-02-27 | 2019-09-03 | 京东方科技集团股份有限公司 | 薄膜晶体管及其制造方法、阵列基板和电子装置 |
US11088078B2 (en) * | 2019-05-22 | 2021-08-10 | Nanya Technology Corporation | Semiconductor device and method for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338615A (ja) * | 1993-05-28 | 1994-12-06 | Philips Electron Nv | 標本化回路を形成する薄膜回路素子を有する電子装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562124A (en) * | 1968-08-02 | 1971-02-09 | Hooker Chemical Corp | Composition for corrosion protection |
US3998779A (en) * | 1973-05-21 | 1976-12-21 | Chromalloy American Corporation | Coating method and composition for the sacrificial protection of metal substrates |
GB1459231A (en) | 1973-06-26 | 1976-12-22 | Mullard Ltd | Semiconductor devices |
US5175056A (en) * | 1990-06-08 | 1992-12-29 | Potters Industries, Inc. | Galvanically compatible conductive filler |
KR940007451B1 (ko) * | 1991-09-06 | 1994-08-18 | 주식회사 금성사 | 박막트랜지스터 제조방법 |
US5441905A (en) * | 1993-04-29 | 1995-08-15 | Industrial Technology Research Institute | Process of making self-aligned amorphous-silicon thin film transistors |
JP2938351B2 (ja) * | 1994-10-18 | 1999-08-23 | 株式会社フロンテック | 電界効果トランジスタ |
US5700398A (en) * | 1994-12-14 | 1997-12-23 | International Business Machines Corporation | Composition containing a polymer and conductive filler and use thereof |
US5968417A (en) * | 1997-03-03 | 1999-10-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Conducting compositions of matter |
US6627117B2 (en) * | 1998-06-09 | 2003-09-30 | Geotech Chemical Company, Llc | Method for applying a coating that acts as an electrolytic barrier and a cathodic corrosion prevention system |
KR20000076864A (ko) * | 1999-03-16 | 2000-12-26 | 마츠시타 덴끼 산교 가부시키가이샤 | 능동 소자 어레이 기판의 제조 방법 |
US6562201B2 (en) * | 2001-06-08 | 2003-05-13 | Applied Semiconductor, Inc. | Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion |
US6402933B1 (en) * | 2001-06-08 | 2002-06-11 | Applied Semiconductor, Inc. | Method and system of preventing corrosion of conductive structures |
JP2003273397A (ja) * | 2002-03-19 | 2003-09-26 | Fuji Xerox Co Ltd | 半導体発光素子、半導体複合素子、及び半導体発光素子の製造方法 |
US6841434B2 (en) * | 2002-03-26 | 2005-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
-
2004
- 2004-01-24 GB GBGB0401579.8A patent/GB0401579D0/en not_active Ceased
-
2005
- 2005-01-21 WO PCT/IB2005/050249 patent/WO2005071753A1/en active Application Filing
- 2005-01-21 US US10/597,252 patent/US7569435B2/en active Active
- 2005-01-21 CN CN2005800029333A patent/CN1910756B/zh active Active
- 2005-01-21 JP JP2006550430A patent/JP4995577B2/ja active Active
- 2005-01-21 TW TW094101864A patent/TW200535936A/zh unknown
- 2005-01-21 EP EP05702743.5A patent/EP1711965B1/en active Active
- 2005-01-21 KR KR1020067014528A patent/KR20070007046A/ko not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338615A (ja) * | 1993-05-28 | 1994-12-06 | Philips Electron Nv | 標本化回路を形成する薄膜回路素子を有する電子装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1910756A (zh) | 2007-02-07 |
TW200535936A (en) | 2005-11-01 |
GB0401579D0 (en) | 2004-02-25 |
US20080224184A1 (en) | 2008-09-18 |
EP1711965B1 (en) | 2013-04-24 |
EP1711965A1 (en) | 2006-10-18 |
JP4995577B2 (ja) | 2012-08-08 |
CN1910756B (zh) | 2010-09-08 |
WO2005071753A1 (en) | 2005-08-04 |
US7569435B2 (en) | 2009-08-04 |
KR20070007046A (ko) | 2007-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100628250B1 (ko) | 전력용 반도체 소자 및 그의 제조방법 | |
US7663143B2 (en) | Thin film transistor having a short channel formed by using an exposure mask with slits | |
US5658808A (en) | Method of fabricating polycrystalline silicon thin-film transistor having symmetrical lateral resistors | |
JP4995577B2 (ja) | トランジスタの製造方法 | |
KR0177785B1 (ko) | 오프셋 구조를 가지는 트랜지스터 및 그 제조방법 | |
US6429485B1 (en) | Thin film transistor and method of fabricating thereof | |
US5439837A (en) | Method of fabricating a thin-film transistor having an offset gate structure | |
JP2733909B2 (ja) | 薄膜トランジスタ及びその製造方法 | |
KR100268895B1 (ko) | 박막트랜지스터 및 이의 제조방법 | |
JPH07211912A (ja) | 薄膜トランジスタ及びその製造方法 | |
US6861298B2 (en) | Method of fabricating CMOS thin film transistor | |
JPH08125190A (ja) | 薄膜トランジスタおよびその製造方法 | |
JPH0883810A (ja) | 電界効果トランジスタおよびその製造方法 | |
KR100362191B1 (ko) | 반도체소자의박막트랜지스터및그제조방법 | |
JP3923600B2 (ja) | 薄膜トランジスタの製造方法 | |
KR100732827B1 (ko) | 박막 트랜지스터 및 그 제조방법 | |
KR0141780B1 (ko) | 반도체소자 제조방법 | |
KR970003742B1 (ko) | 자기정열구조의 박막트랜지스터 제조방법 | |
JP3035969B2 (ja) | 化合物半導体装置の製造方法 | |
KR20010005300A (ko) | 반도체소자의 비대칭 트랜지스터 형성방법 | |
KR100900125B1 (ko) | 수직형 트랜지스터 형성 방법 | |
JP2001308337A (ja) | 低温ポリシリコンtftの製造方法 | |
KR970011503B1 (ko) | 모스 트랜지스터의 제조방법 | |
JPH11233774A (ja) | 薄膜トランジスタ及びその製造方法 | |
KR101128100B1 (ko) | 박막 트랜지스터 및 그 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110927 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110929 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20111222 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120105 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120327 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120417 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120510 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150518 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4995577 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |