JP2007506992A5 - - Google Patents

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Publication number
JP2007506992A5
JP2007506992A5 JP2006517991A JP2006517991A JP2007506992A5 JP 2007506992 A5 JP2007506992 A5 JP 2007506992A5 JP 2006517991 A JP2006517991 A JP 2006517991A JP 2006517991 A JP2006517991 A JP 2006517991A JP 2007506992 A5 JP2007506992 A5 JP 2007506992A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006517991A
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Japanese (ja)
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JP2007506992A (ja
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Publication date
Priority claimed from US10/609,735 external-priority patent/US20040265733A1/en
Application filed filed Critical
Publication of JP2007506992A publication Critical patent/JP2007506992A/ja
Publication of JP2007506992A5 publication Critical patent/JP2007506992A5/ja
Pending legal-status Critical Current

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JP2006517991A 2003-06-30 2004-06-04 光酸発生剤を含む組成物 Pending JP2007506992A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/609,735 US20040265733A1 (en) 2003-06-30 2003-06-30 Photoacid generators
PCT/EP2004/006073 WO2005003858A2 (en) 2003-06-30 2004-06-04 Compositions comprising photoacid generators

Publications (2)

Publication Number Publication Date
JP2007506992A JP2007506992A (ja) 2007-03-22
JP2007506992A5 true JP2007506992A5 (https=) 2007-08-09

Family

ID=33540896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006517991A Pending JP2007506992A (ja) 2003-06-30 2004-06-04 光酸発生剤を含む組成物

Country Status (6)

Country Link
US (1) US20040265733A1 (https=)
EP (1) EP1642172A2 (https=)
JP (1) JP2007506992A (https=)
KR (1) KR20060025175A (https=)
TW (1) TW200516344A (https=)
WO (1) WO2005003858A2 (https=)

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US7473512B2 (en) * 2004-03-09 2009-01-06 Az Electronic Materials Usa Corp. Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof
JP2006078760A (ja) * 2004-09-09 2006-03-23 Tokyo Ohka Kogyo Co Ltd 電子線またはeuv(極端紫外光)用レジスト組成物及びレジストパターン形成方法
JP4505357B2 (ja) * 2005-03-16 2010-07-21 富士フイルム株式会社 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法
US7723008B2 (en) * 2005-03-22 2010-05-25 Intel Corporation Photoactive adhesion promoter in a slam
JP4724465B2 (ja) 2005-05-23 2011-07-13 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法
US7255970B2 (en) * 2005-07-12 2007-08-14 Az Electronic Materials Usa Corp. Photoresist composition for imaging thick films
US20070105040A1 (en) * 2005-11-10 2007-05-10 Toukhy Medhat A Developable undercoating composition for thick photoresist layers
US20070117041A1 (en) * 2005-11-22 2007-05-24 Christoph Noelscher Photosensitive coating for enhancing a contrast of a photolithographic exposure
JP4792299B2 (ja) * 2006-02-07 2011-10-12 富士フイルム株式会社 新規なスルホニウム化合物、該化合物を含有する感光性組成物及び該感光性組成物を用いたパターン形成方法
US7601482B2 (en) * 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
US7476492B2 (en) * 2006-05-26 2009-01-13 International Business Machines Corporation Low activation energy photoresist composition and process for its use
JP2007316507A (ja) * 2006-05-29 2007-12-06 Tokyo Ohka Kogyo Co Ltd 液浸露光用レジスト組成物およびレジストパターン形成方法
US7488568B2 (en) * 2007-04-09 2009-02-10 Tokyo Ohka Kogyo Co., Ltd. Resist composition, method of forming resist pattern, compound and acid generator
JP2010134126A (ja) * 2008-12-03 2010-06-17 Jsr Corp 感放射線性組樹脂組成物
JP4820914B2 (ja) * 2010-09-24 2011-11-24 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法
JP6049250B2 (ja) * 2010-11-30 2016-12-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC 光酸発生剤
US8906594B2 (en) 2012-06-15 2014-12-09 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working thick film photoresist
US9012126B2 (en) 2012-06-15 2015-04-21 Az Electronic Materials (Luxembourg) S.A.R.L. Positive photosensitive material
JP6209035B2 (ja) * 2013-09-25 2017-10-04 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置の製造方法
US10775697B2 (en) * 2014-04-22 2020-09-15 Zeon Corporation Radiation-sensitive resin composition, resin film, and electronic device
CN106032369A (zh) * 2014-12-31 2016-10-19 浙江九洲药业股份有限公司 卤代s-(全氟烷基)-二苯并噻吩盐及其制备方法
TWI731961B (zh) 2016-04-19 2021-07-01 德商馬克專利公司 正向感光材料及形成正向凸紋影像之方法
KR102261808B1 (ko) 2016-08-09 2021-06-07 리지필드 액퀴지션 환경적으로 안정한 후막성 화학증폭형 레지스트
EP3761117A4 (en) * 2018-03-27 2021-05-12 Tokyo Ohka Kogyo Co., Ltd. METHOD OF MANUFACTURING A PLATED SHAPED BODY
EP3847506A1 (en) 2018-09-05 2021-07-14 Merck Patent GmbH Positive working photosensitive material
FR3120871B1 (fr) * 2021-03-17 2024-04-19 Bostik Sa Composition à base de monomères (méth)acrylate
WO2022195221A1 (fr) * 2021-03-17 2022-09-22 Bostik Sa Composition a base de monomeres (meth)acrylate
US20230236507A1 (en) * 2022-01-26 2023-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing semiconductor structure and photoresist composition

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JPH0954437A (ja) * 1995-06-05 1997-02-25 Fuji Photo Film Co Ltd 化学増幅型ポジレジスト組成物
JP3607432B2 (ja) * 1995-10-12 2005-01-05 株式会社東芝 感光性組成物
US5863699A (en) * 1995-10-12 1999-01-26 Kabushiki Kaisha Toshiba Photo-sensitive composition
US6280897B1 (en) * 1996-12-24 2001-08-28 Kabushiki Kaisha Toshiba Photosensitive composition, method for forming pattern using the same, and method for manufacturing electronic parts
JP3431481B2 (ja) * 1996-12-24 2003-07-28 株式会社東芝 感光性組成物、およびこれを用いたパターン形成方法ならびに電子部品の製造方法
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KR20040004429A (ko) * 2000-11-09 2004-01-13 이 아이 듀폰 디 네모아 앤드 캄파니 미세리쏘그래피용 포토레지스트 조성물의 광산 발생제
US6696216B2 (en) * 2001-06-29 2004-02-24 International Business Machines Corporation Thiophene-containing photo acid generators for photolithography

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