JP2007504001A5 - - Google Patents

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Publication number
JP2007504001A5
JP2007504001A5 JP2006532403A JP2006532403A JP2007504001A5 JP 2007504001 A5 JP2007504001 A5 JP 2007504001A5 JP 2006532403 A JP2006532403 A JP 2006532403A JP 2006532403 A JP2006532403 A JP 2006532403A JP 2007504001 A5 JP2007504001 A5 JP 2007504001A5
Authority
JP
Japan
Prior art keywords
die
gas escape
escape passages
internal cavity
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006532403A
Other languages
English (en)
Japanese (ja)
Other versions
JP4685783B2 (ja
JP2007504001A (ja
Filing date
Publication date
Priority claimed from US10/439,448 external-priority patent/US7083826B2/en
Application filed filed Critical
Publication of JP2007504001A publication Critical patent/JP2007504001A/ja
Publication of JP2007504001A5 publication Critical patent/JP2007504001A5/ja
Application granted granted Critical
Publication of JP4685783B2 publication Critical patent/JP4685783B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006532403A 2003-05-16 2004-04-13 塗布ダイおよび使用方法 Expired - Fee Related JP4685783B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/439,448 US7083826B2 (en) 2003-05-16 2003-05-16 Coating die and method for use
PCT/US2004/011274 WO2004103578A1 (en) 2003-05-16 2004-04-13 Coating die and method for use

Publications (3)

Publication Number Publication Date
JP2007504001A JP2007504001A (ja) 2007-03-01
JP2007504001A5 true JP2007504001A5 (enExample) 2007-06-14
JP4685783B2 JP4685783B2 (ja) 2011-05-18

Family

ID=33417801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006532403A Expired - Fee Related JP4685783B2 (ja) 2003-05-16 2004-04-13 塗布ダイおよび使用方法

Country Status (7)

Country Link
US (2) US7083826B2 (enExample)
EP (2) EP2072148B1 (enExample)
JP (1) JP4685783B2 (enExample)
KR (1) KR101087384B1 (enExample)
AT (1) ATE427788T1 (enExample)
DE (1) DE602004020458D1 (enExample)
WO (1) WO2004103578A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020015785A (ko) * 2000-08-23 2002-03-02 고성달 피혁의 염색방법
US7083826B2 (en) * 2003-05-16 2006-08-01 3M Innovative Properties Company Coating die and method for use
ES2455128T5 (es) 2003-11-24 2020-11-16 Intertape Polymer Corp Proceso para la preparación de adhesivos utilizando una extrusora planetaria
JP4704425B2 (ja) * 2004-05-13 2011-06-15 ディーエスエム アイピー アセッツ ビー．ブイ． 繊維のフィルムの形成のための装置および方法
DE602006005164D1 (de) * 2005-07-13 2009-03-26 Agfa Gevaert Nv Verfahren zur breitschlitzextrusionsbeschichtung einer flüssigen zusammensetzung
US7621737B2 (en) * 2006-07-19 2009-11-24 3M Innovative Properties Company Die with insert and gas purging method for die
JP5007168B2 (ja) * 2007-07-10 2012-08-22 日東電工株式会社 ダイコーター調整方法及び光学フィルムの製造方法
US20100285227A1 (en) * 2007-12-31 2010-11-11 Yapel Robert A Method for applying a coatable material
KR101014659B1 (ko) * 2008-07-09 2011-02-16 (주)티에스티아이테크 유체 토출장치
KR101107651B1 (ko) * 2011-07-27 2012-01-20 성안기계 (주) 도포 균일성이 향상된 슬롯다이
JP6055280B2 (ja) * 2012-11-11 2016-12-27 平田機工株式会社 塗布液充填方法
JP6068271B2 (ja) * 2013-06-10 2017-01-25 東レ株式会社 塗布器、及び塗布装置
JP6196916B2 (ja) * 2014-02-25 2017-09-13 東京応化工業株式会社 ノズルおよび塗布装置
JP6309407B2 (ja) * 2014-09-17 2018-04-11 東レ株式会社 塗布器、塗布装置、及び塗布方法
KR20180104770A (ko) * 2016-02-12 2018-09-21 쓰리엠 이노베이티브 프로퍼티즈 캄파니 능동 제어식 코팅 폭을 가진 슬롯 다이
JP6967477B2 (ja) * 2018-03-22 2021-11-17 東レ株式会社 塗布器、及び塗布器のエア排出方法
KR102368359B1 (ko) 2019-05-14 2022-02-25 주식회사 엘지에너지솔루션 에어 벤트를 포함하는 슬롯 다이 코팅 장치
WO2022065778A1 (ko) * 2020-09-28 2022-03-31 주식회사 엘지에너지솔루션 다중 슬롯 다이 코터
WO2022102979A1 (ko) * 2020-11-13 2022-05-19 주식회사 엘지에너지솔루션 에어 벤트를 포함하는 듀얼 슬롯 다이 코터
CN113171889B (zh) * 2021-04-27 2022-07-12 常州瑞择微电子科技有限公司 水帘喷头
CN218945476U (zh) * 2022-11-29 2023-05-02 宁德时代新能源科技股份有限公司 涂布模头和涂布设备
EP4427847B1 (en) * 2023-01-28 2025-12-17 Contemporary Amperex Technology (Hong Kong) Limited Coating die, coating apparatus and battery production apparatus

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US3023456A (en) * 1959-08-03 1962-03-06 Dow Chemical Co Extruder apparatus
US3889633A (en) 1974-05-08 1975-06-17 Formulabs Ind Inks Inc Apparatus for applying one or more stripes to conductors
CH585920A5 (enExample) * 1974-06-07 1977-03-15 Hoechst Ag
US4491417A (en) * 1983-04-29 1985-01-01 Usm Corporation Devolatilizing mixing extruder
US4938994A (en) 1987-11-23 1990-07-03 Epicor Technology, Inc. Method and apparatus for patch coating printed circuit boards
JPH074399Y2 (ja) * 1989-08-28 1995-02-01 石川島播磨重工業株式会社 給油量制御装置
JP2816510B2 (ja) * 1991-01-23 1998-10-27 東京エレクトロン株式会社 液体供給ノズル
KR100230753B1 (ko) 1991-01-23 1999-11-15 도꾜 일렉트론 큐슈리미티드 액도포 시스템
JPH0515828A (ja) * 1991-07-09 1993-01-26 Kanzaki Paper Mfg Co Ltd 加圧型カーテン塗布装置
CA2098784A1 (en) 1992-07-08 1994-01-09 Bentley Boger Apparatus and methods for applying conformal coatings to electronic circuit boards
JP2537739B2 (ja) * 1992-07-31 1996-09-25 三菱化学株式会社 ダイコ―タ
US5702527A (en) * 1995-02-22 1997-12-30 Minnesota Mining And Manufacturing Company Restricted flow die
JPH10277464A (ja) 1997-04-02 1998-10-20 Dainippon Printing Co Ltd 塗布装置及びこれを使用する塗布方法
JPH11188301A (ja) 1997-12-26 1999-07-13 Hirata Corp 流体塗布装置
US6319316B1 (en) 1998-02-17 2001-11-20 Fastar, Ltd. System and method for performing low contamination extrusion for microelectronics applications
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JP2002119907A (ja) * 2000-10-12 2002-04-23 Konica Corp 押出し塗布装置およびエア抜き方法
GB0030182D0 (en) 2000-12-11 2001-01-24 Univ Brunel Material processing
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JP2003340335A (ja) * 2002-05-27 2003-12-02 Okazaki Kikai Kogyo Kk 周面浸漬型のグラビアコータ
US7083826B2 (en) * 2003-05-16 2006-08-01 3M Innovative Properties Company Coating die and method for use

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