JP2007500943A5 - - Google Patents
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- Publication number
- JP2007500943A5 JP2007500943A5 JP2006521994A JP2006521994A JP2007500943A5 JP 2007500943 A5 JP2007500943 A5 JP 2007500943A5 JP 2006521994 A JP2006521994 A JP 2006521994A JP 2006521994 A JP2006521994 A JP 2006521994A JP 2007500943 A5 JP2007500943 A5 JP 2007500943A5
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- sio
- moo
- contained
- glycine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/631,698 US20050022456A1 (en) | 2003-07-30 | 2003-07-30 | Polishing slurry and method for chemical-mechanical polishing of copper |
US10/846,718 US20050026444A1 (en) | 2003-07-30 | 2004-05-13 | Slurry and method for chemical-mechanical planarization of copper |
PCT/US2004/024143 WO2005012451A2 (fr) | 2003-07-30 | 2004-07-27 | Suspensions aqueuses et procedes pour la planarisation chimico-mecanique du cuivre |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011234230A Division JP2012084895A (ja) | 2003-07-30 | 2011-10-25 | 銅の化学的機械的平滑化のためのスラリー及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007500943A JP2007500943A (ja) | 2007-01-18 |
JP2007500943A5 true JP2007500943A5 (fr) | 2011-04-21 |
Family
ID=34119220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006521994A Pending JP2007500943A (ja) | 2003-07-30 | 2004-07-27 | 銅を化学的機械的に平滑化するためのスラリーおよび方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1648974A4 (fr) |
JP (1) | JP2007500943A (fr) |
KR (1) | KR20060118396A (fr) |
WO (1) | WO2005012451A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7186653B2 (en) * | 2003-07-30 | 2007-03-06 | Climax Engineered Materials, Llc | Polishing slurries and methods for chemical mechanical polishing |
US8017524B2 (en) * | 2008-05-23 | 2011-09-13 | Cabot Microelectronics Corporation | Stable, high rate silicon slurry |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6330321A (ja) * | 1986-07-19 | 1988-02-09 | Tokyo Tungsten Co Ltd | 二酸化モリブデン粉末及びその製造方法 |
US6290735B1 (en) * | 1997-10-31 | 2001-09-18 | Nanogram Corporation | Abrasive particles for surface polishing |
US20090255189A1 (en) * | 1998-08-19 | 2009-10-15 | Nanogram Corporation | Aluminum oxide particles |
US6142855A (en) * | 1997-10-31 | 2000-11-07 | Canon Kabushiki Kaisha | Polishing apparatus and polishing method |
JP2000158331A (ja) * | 1997-12-10 | 2000-06-13 | Canon Inc | 基板の精密研磨方法および装置 |
JPH11204474A (ja) * | 1998-01-09 | 1999-07-30 | Sony Corp | フッ素を含む膜の研磨方法 |
JP2000108004A (ja) * | 1998-10-07 | 2000-04-18 | Canon Inc | 研磨装置 |
JP4273475B2 (ja) * | 1999-09-21 | 2009-06-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2003510802A (ja) * | 1999-09-23 | 2003-03-18 | ロデール ホールディングス インコーポレイテッド | 銅又はタングステンの研磨用スラリー溶液 |
US6348076B1 (en) * | 1999-10-08 | 2002-02-19 | International Business Machines Corporation | Slurry for mechanical polishing (CMP) of metals and use thereof |
WO2001032799A1 (fr) * | 1999-11-04 | 2001-05-10 | Nanogram Corporation | Dispersions de particules |
JP3490038B2 (ja) * | 1999-12-28 | 2004-01-26 | Necエレクトロニクス株式会社 | 金属配線形成方法 |
JP3945964B2 (ja) * | 2000-06-01 | 2007-07-18 | 株式会社ルネサステクノロジ | 研磨剤、研磨方法及び半導体装置の製造方法 |
US6569222B2 (en) * | 2000-06-09 | 2003-05-27 | Harper International Corporation | Continuous single stage process for the production of molybdenum metal |
JP4743941B2 (ja) * | 2000-06-30 | 2011-08-10 | Jsr株式会社 | 化学機械研磨用水系分散体 |
JP3837277B2 (ja) * | 2000-06-30 | 2006-10-25 | 株式会社東芝 | 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法 |
JP2002184734A (ja) * | 2000-12-19 | 2002-06-28 | Tokuyama Corp | 半導体装置の製造方法 |
JP3507794B2 (ja) * | 2000-12-25 | 2004-03-15 | 日本電気株式会社 | 半導体装置の製造方法 |
-
2004
- 2004-07-27 EP EP04779276A patent/EP1648974A4/fr not_active Withdrawn
- 2004-07-27 JP JP2006521994A patent/JP2007500943A/ja active Pending
- 2004-07-27 KR KR1020067000223A patent/KR20060118396A/ko not_active Application Discontinuation
- 2004-07-27 WO PCT/US2004/024143 patent/WO2005012451A2/fr active Application Filing
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