JP2007500943A5 - - Google Patents

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Publication number
JP2007500943A5
JP2007500943A5 JP2006521994A JP2006521994A JP2007500943A5 JP 2007500943 A5 JP2007500943 A5 JP 2007500943A5 JP 2006521994 A JP2006521994 A JP 2006521994A JP 2006521994 A JP2006521994 A JP 2006521994A JP 2007500943 A5 JP2007500943 A5 JP 2007500943A5
Authority
JP
Japan
Prior art keywords
slurry
sio
moo
contained
glycine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006521994A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007500943A (ja
Filing date
Publication date
Priority claimed from US10/631,698 external-priority patent/US20050022456A1/en
Application filed filed Critical
Priority claimed from PCT/US2004/024143 external-priority patent/WO2005012451A2/fr
Publication of JP2007500943A publication Critical patent/JP2007500943A/ja
Publication of JP2007500943A5 publication Critical patent/JP2007500943A5/ja
Pending legal-status Critical Current

Links

JP2006521994A 2003-07-30 2004-07-27 銅を化学的機械的に平滑化するためのスラリーおよび方法 Pending JP2007500943A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/631,698 US20050022456A1 (en) 2003-07-30 2003-07-30 Polishing slurry and method for chemical-mechanical polishing of copper
US10/846,718 US20050026444A1 (en) 2003-07-30 2004-05-13 Slurry and method for chemical-mechanical planarization of copper
PCT/US2004/024143 WO2005012451A2 (fr) 2003-07-30 2004-07-27 Suspensions aqueuses et procedes pour la planarisation chimico-mecanique du cuivre

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011234230A Division JP2012084895A (ja) 2003-07-30 2011-10-25 銅の化学的機械的平滑化のためのスラリー及び方法

Publications (2)

Publication Number Publication Date
JP2007500943A JP2007500943A (ja) 2007-01-18
JP2007500943A5 true JP2007500943A5 (fr) 2011-04-21

Family

ID=34119220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006521994A Pending JP2007500943A (ja) 2003-07-30 2004-07-27 銅を化学的機械的に平滑化するためのスラリーおよび方法

Country Status (4)

Country Link
EP (1) EP1648974A4 (fr)
JP (1) JP2007500943A (fr)
KR (1) KR20060118396A (fr)
WO (1) WO2005012451A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6330321A (ja) * 1986-07-19 1988-02-09 Tokyo Tungsten Co Ltd 二酸化モリブデン粉末及びその製造方法
US6290735B1 (en) * 1997-10-31 2001-09-18 Nanogram Corporation Abrasive particles for surface polishing
US20090255189A1 (en) * 1998-08-19 2009-10-15 Nanogram Corporation Aluminum oxide particles
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method
JP2000158331A (ja) * 1997-12-10 2000-06-13 Canon Inc 基板の精密研磨方法および装置
JPH11204474A (ja) * 1998-01-09 1999-07-30 Sony Corp フッ素を含む膜の研磨方法
JP2000108004A (ja) * 1998-10-07 2000-04-18 Canon Inc 研磨装置
JP4273475B2 (ja) * 1999-09-21 2009-06-03 株式会社フジミインコーポレーテッド 研磨用組成物
JP2003510802A (ja) * 1999-09-23 2003-03-18 ロデール ホールディングス インコーポレイテッド 銅又はタングステンの研磨用スラリー溶液
US6348076B1 (en) * 1999-10-08 2002-02-19 International Business Machines Corporation Slurry for mechanical polishing (CMP) of metals and use thereof
WO2001032799A1 (fr) * 1999-11-04 2001-05-10 Nanogram Corporation Dispersions de particules
JP3490038B2 (ja) * 1999-12-28 2004-01-26 Ｎｅｃエレクトロニクス株式会社 金属配線形成方法
JP3945964B2 (ja) * 2000-06-01 2007-07-18 株式会社ルネサステクノロジ 研磨剤、研磨方法及び半導体装置の製造方法
US6569222B2 (en) * 2000-06-09 2003-05-27 Harper International Corporation Continuous single stage process for the production of molybdenum metal
JP4743941B2 (ja) * 2000-06-30 2011-08-10 Ｊｓｒ株式会社 化学機械研磨用水系分散体
JP3837277B2 (ja) * 2000-06-30 2006-10-25 株式会社東芝 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法
JP2002184734A (ja) * 2000-12-19 2002-06-28 Tokuyama Corp 半導体装置の製造方法
JP3507794B2 (ja) * 2000-12-25 2004-03-15 日本電気株式会社 半導体装置の製造方法

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