JP2007500771A - 導電性ポリマー、導電性ポリマーの製造方法、およびポリマーの導電率の制御方法 - Google Patents
導電性ポリマー、導電性ポリマーの製造方法、およびポリマーの導電率の制御方法 Download PDFInfo
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Classifications
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
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- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本願は、2003年7月29日に出願された「導電性および非導電性のナノ粒子およびマイクロ粒子の使用によるポリマーの導電率の制御(CONTROLLER ELECTRICAL CONDUCTIVITY IN POLYMERS THROUGH THE USE OF CONDUCTIVE AND NON−CONDUCTIVE NANO AND MICROPARTICLES)」と題する米国仮特許出願第60/490,871号に基づいて優先権を主張する。
上述した本発明の概括的な説明に加えて、具体的な実施形態を以下に説明する。この実施形態は、ポリマー樹脂としてのナイロン6(「Ny6」)と、導電性フィラーとしてのカーボンブラック(「CB」)と、分散制御剤としてのモンモリロナイト(「有機粘土」)とを含む。以下の具体的な説明には、Ny6およびCBを含み、かつ分散制御剤を含まない従来のポリマー組成物を比較のために説明して、CB充填Ny6と有機粘土を含むCB充填Ny6とから圧縮成形された製品の電気的特性/CB分散の関係を説明する。
2種類の市販のフィルムグレード原料ナイロン6と、3.0体積%および5.0体積%の有機粘土(米国RTP社)を添加した溶融ブレンドナイロン6ナノ複合材を使用した。導電性フィラーナノ粒子として、市販のローストラクチャー(low−structure)ゴムグレードカーボンブラック(CB)(東海カーボン(株)製シースト(Seast)(登録商標) G−SVH:一次粒子径:62nm、N2比表面積:32m2/g、DBP吸油量:140cm3/100g)を使用した。
導電率は、直流電圧源を備えたケースレー(Keithley)6487ピコアンメーターを使用してフィルムの厚さ方向で測定した。電圧値は約0.001〜5000Vとした。フィルムのバルク導電率は、4つの導電率測定値の平均として決定し、各導電率測定値は、フィルムの中央領域の異なる位置で得た。
CBの分散状態を電界放出型SEM(JEOL製)によって観察した。サンプルを液体窒素内で凍結破砕した。凍結破砕面を、真空中で1分間、ポーラロン(Polaron)高エネルギー銀スパッタ装置でコーティングした。
CB分散の定量分析は、最小2乗法(quadrate method)およびモリシタ(Morishita)の分散指数Iδを使用したSEM写真の統計的な処理によって特徴付けられた。この指数は、分散モードの特徴付けにおいて重要な役割を果たし、以下の式で与えられる。
(電気的パーコレーション挙動)
図2aは、有機粘土の添加率が異なる各種のNy6/CBをベースとする組成物のパーコレーション曲線を示し、室温における対数σに対するCB濃度の典型的なプロットを示しており、図2bは、各CB濃度における有機粘土の体積分率に対する対数σのプロットを示している。導電ネットワークの形成には2つのCB粒子間の直接の接触は必要ではないが、電子トンネルが発生するための十分に近接した関係(通常はナノメートルオーダー)が必要となる。有機粘土を含まないNy6/CB組成物は、CB濃度が30phr(phr=樹脂100部あたりのCBの重量)に達すると約3桁の導電率上昇を示し、パーコレーション閾値Vf *と決定された。
図3は、有機粘土の添加率が異なるNy6/CB 10phr系の典型的なSEM像を示している。図3において、元画像の白点(拡大画像の黒点)はCB一次凝集体を示し、元画像の黒領域(拡大画像の灰色領域)はナイロン6ネットワークを示す。各対の像において、左の画像は元画像であり、右の画像は同一のSEM画像の拡大画像である。図3dの模式図は、SEM画像の理解を容易にするためのものである。図3aおよび図3bに示す有機粘土の添加量が0〜3体積%の場合には、それぞれ、図3aの元画像のCB分散は、図3bに示すように、「分岐」および/または「鎖状」モフォロジに転移している。この観察は、Ny6/CB/有機粘土(3体積%)組成物が、図2aに示すパーコレーション閾値Vf *である約10phr CBでのパーコレーションを達成していることと一致する。また、10phr CB濃度がNy6/CB/有機粘土(5体積%)組成物のパーコレーション閾値Vf *でないという事実から、有機粘土添加量を3体積%から5体積%に増加させると、Ny6/CB/有機粘土(5体積%)組成物におけるCBの分散状態がパーコレーション構造ではなくなることが分かる。
上述した見解を支持または拒絶する証拠を捜し出すために、異なる有機粘土添加率を有するNy6ナノ複合材およびNy6/CB組成物について、STEMによるリアルタイムのモフォロジ的な選択領域の高分解能観察(×135,000)を行った。その目的は、上述した高度パーコレーション現象のメカニズムについて説明することができるモフォロジ的証拠を探ることであり、特に、硬い球形のCBと脆い粘土プレートレットとの関係を探ることである。図10aおよび図10bには、20phr CB濃度と異なる有機粘土添加率を有する各種Ny6/CB組成物の明視野TEM画像を示し、黒い球状領域はCB一次凝集体を示し、灰色/白色領域はNy6マトリックスを示す。左の画像は元画像であり、右の画像は分割した単一のTEM画像の拡大画像である。矢印は、一次有機粘土プレートレット(または黒い単層)を示す。2つの明らかなモフォロジ的な特徴が観察された。
Claims (12)
- ポリマー組成物であって、
ポリマー樹脂と、
導電性フィラーと、
前記ポリマー組成物全体での前記導電性フィラーのほぼ均一な配置を促進する分散制御剤と、
を含み、
多環式芳香族化合物を実質的に含まない、ポリマー組成物。 - 請求項1において、
ポリマーネットワークが熱可塑性ポリマーを含む、ポリマー組成物。 - 請求項1において、
ポリマーネットワークが熱硬化性ポリマーを含む、ポリマー組成物。 - 請求項1において、
ポリマーネットワークが、ポリアミド、ポリエステル、およびポリオレフィンからなる群から選択されるポリマーを含む、ポリマー組成物。 - 請求項1において、
前記導電性フィラーが、カーボンブラック、導電性カーボンブラック、およびカーボンナノチューブからなる群から選択される、ポリマー組成物。 - ポリマー組成物であって、
ポリマー樹脂と、
導電性フィラーと、
サブミクロンからナノサイズの粒子を含まない同一の組成物と比較して、前記ポリマー組成物の導電率を上昇させるのに有効な量の非導電性フィラーと、
を含み、
多環式芳香族化合物を実質的に含まない、ポリマー組成物。 - 請求項6において、
前記導電性フィラーが、カーボンブラック、導電性カーボンブラック、およびカーボンナノチューブからなる群から選択される、ポリマー組成物。 - 請求項6において、
前記非導電性フィラーが、サブミクロンまたはナノメートルの粒径を有する粒子状フィラーである、ポリマー組成物。 - 請求項6において、
前記非導電性フィラーを含まない同一のポリマー組成物のパーコレーション閾値よりも低いパーコレーション閾値を有する、ポリマー組成物。 - ポリマー組成物であって、
ポリマー樹脂と、
導電性フィラーと、
サブミクロンからナノサイズの粒子を含まない同一の組成物のパーコレーション閾値と比較して、前記ポリマー組成物のパーコレーション閾値を低下させるのに有効な量のサブミクロンからナノサイズの非導電性フィラーと、
を含み、
多環式芳香族化合物を実質的に含まない、ポリマー組成物。 - ポリマー組成物であって、
ポリマー樹脂と、
導電性フィラーと、
所望の導電率領域における前記導電性フィラーの濃度の変化に対する前記ポリマー組成物の導電率の感度を最小化するのに有効な量の分散制御剤と、
を含み、
多環式芳香族化合物を実質的に含まない、ポリマー組成物。 - 目的とする導電率を含む所望の導電率の範囲を特定する工程と、
有効な量の分散制御剤をポリマー樹脂に添加し、前記所望の導電率の範囲内で前記ポリマー組成物の導電率の感度を最小化させる工程と、
前記ポリマー樹脂に導電性フィラーを添加し、前記ポリマー組成物を前記目的とする導電率に調整する工程と、
を含む、ポリマー組成物の導電率の制御方法。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007056050A (ja) * | 2005-08-22 | 2007-03-08 | Matsushita Electric Ind Co Ltd | 高分子抵抗体インク |
JP2010514883A (ja) * | 2006-12-26 | 2010-05-06 | チェイル インダストリーズ インコーポレイテッド | 導電性熱可塑性樹脂組成物及びプラスチック成形品 |
JP2011515549A (ja) * | 2008-03-25 | 2011-05-19 | ロディア オペレーションズ | ポリアミド組成物 |
JP5206903B2 (ja) * | 2011-03-25 | 2013-06-12 | 東レ株式会社 | 熱可塑性樹脂組成物およびそれを用いた成形品 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070102188A1 (en) | 2005-11-01 | 2007-05-10 | Cable Components Group, Llc | High performance support-separators for communications cable supporting low voltage and wireless fidelity applications and providing conductive shielding for alien crosstalk |
DE102004058305B3 (de) * | 2004-12-02 | 2006-05-18 | Infineon Technologies Ag | Halbleiterbauteil mit einem eine Passivierungsschicht aufweisenden Halbleiterchip sowie Verfahren zur Herstellung desselben |
US8114314B2 (en) * | 2005-07-20 | 2012-02-14 | Agency For Science, Technology And Research | Electroconductive curable resins |
CN101848675B (zh) * | 2007-09-25 | 2013-06-05 | 日本光电工业株式会社 | 电极片和电极片的制造方法 |
BRPI0911534A2 (pt) * | 2008-04-24 | 2019-09-24 | Polyone Corp | composto de ácido polilático resistentes a calor |
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US8003014B2 (en) * | 2008-07-02 | 2011-08-23 | Eaton Corporation | Dielectric isolators |
US8752438B2 (en) * | 2009-01-16 | 2014-06-17 | The Board Of Regents Of The University Of Oklahoma | Sensor-enabled geosynthetic material and method of making and using the same |
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WO2011149991A1 (en) | 2010-05-24 | 2011-12-01 | The Regents Of The University Of California | Inorganic nanostructure-organic polymer heterostructures useful for thermoelectric devices |
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JP6476375B2 (ja) * | 2015-03-13 | 2019-03-06 | ブラバス・ジャパン株式会社 | 熱電性高分子複合体の製造方法 |
DE102015207818A1 (de) * | 2015-04-28 | 2016-11-17 | Benecke-Kaliko Ag | Leitfähige Folie für eine Widerstandsheizung |
JP6191805B2 (ja) * | 2015-06-25 | 2017-09-06 | 株式会社村田製作所 | 樹脂基板および電子機器 |
CN106229030B (zh) * | 2016-07-08 | 2018-04-20 | 中南大学 | 一种导电组合物、导电油墨、导电膜、制备方法及应用 |
CN107301886A (zh) * | 2017-05-15 | 2017-10-27 | 江苏东昇光伏科技有限公司 | 一种太阳能电池中背电极用导电浆料及其制备方法 |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
EP4215573A1 (en) | 2022-01-20 | 2023-07-26 | SHPP Global Technologies B.V. | Method of adjusting electrical properties by silica in thermoplastic compositions and uses thereof |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56839A (en) * | 1979-06-18 | 1981-01-07 | Shin Kobe Electric Mach Co Ltd | Conductive thermoplastic resin composition |
JPS56159252A (en) * | 1980-05-13 | 1981-12-08 | Lion Corp | Electrically conductive plastic sheet |
JPS5721441A (en) * | 1980-07-14 | 1982-02-04 | Mitsubishi Petrochem Co Ltd | Electrically conductive resin composition |
JPS5875706A (ja) * | 1981-10-30 | 1983-05-07 | 旭化成株式会社 | 導電性材料 |
JPS59132504A (ja) * | 1983-01-19 | 1984-07-30 | 株式会社明電舎 | プラスチツク導電材料 |
JPS60124654A (ja) * | 1983-12-12 | 1985-07-03 | Mitsubishi Petrochem Co Ltd | 導電性樹脂組成物 |
JPS6312665A (ja) * | 1986-07-03 | 1988-01-20 | Sumitomo Electric Ind Ltd | 半導電性樹脂組成物 |
JPH09309720A (ja) * | 1996-03-21 | 1997-12-02 | Kao Corp | 有機変性層状珪酸塩及び永久帯電防止性樹脂組成物 |
JP2002241607A (ja) * | 2001-02-20 | 2002-08-28 | Toray Ind Inc | ポリアミド樹脂組成物 |
JP2003082231A (ja) * | 2001-09-17 | 2003-03-19 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂組成物、ポリイミドフィルムおよびポリイミド管状物 |
WO2003036661A2 (en) * | 2001-10-25 | 2003-05-01 | Cts Corporation | Resistor nanocomposite compoisitons |
JP2003171562A (ja) * | 2001-12-06 | 2003-06-20 | Tokai Carbon Co Ltd | 抵抗安定性に優れたポリマー組成物 |
JP2007515502A (ja) * | 2003-05-22 | 2007-06-14 | ゼネラル・エレクトリック・カンパニイ | 導電性組成物及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3962531A (en) * | 1972-07-19 | 1976-06-08 | General Electric Company | Electrical conductor insulated with filled polymeric compounds |
GB2111071B (en) * | 1981-09-16 | 1985-04-03 | Mitsubishi Petrochemical Co | Moldable composition containing propylene polymer |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
DE3729566A1 (de) * | 1987-09-04 | 1989-03-16 | Zipperling Kessler & Co | Intrinsisch leitfaehiges polymer in form eines dispergierbaren feststoffes, dessen herstellung und dessen verwendung |
US5445327A (en) * | 1989-07-27 | 1995-08-29 | Hyperion Catalysis International, Inc. | Process for preparing composite structures |
IL96196A (en) * | 1989-11-01 | 1995-03-30 | Raychem Ltd | Electrically conductive polymeric preparation |
DE3943420A1 (de) * | 1989-12-30 | 1991-07-04 | Zipperling Kessler & Co | Verfahren zur herstellung von antistatisch bzw. elektrisch leitfaehig ausgeruesteten polymeren zusammensetzungen |
US5591382A (en) * | 1993-03-31 | 1997-01-07 | Hyperion Catalysis International Inc. | High strength conductive polymers |
IL109497A (en) * | 1993-05-05 | 1998-02-22 | Hyperion Catalysis Int | Three-dimensional macroscopic clusters of randomly arranged charcoal fibrils and products containing these |
US5512399A (en) * | 1993-09-21 | 1996-04-30 | Fuji Electric Co., Ltd. | Organic photo sensitive member for electrophotography |
US5508348A (en) * | 1994-08-12 | 1996-04-16 | The Research Foundation Of Suny | Inverted emulsion pathways to conductive polymers |
KR100303577B1 (ko) * | 1994-09-21 | 2001-11-22 | 다쯔타 도키오 | 전자사진용유기감광체및원통형상지지체의제조방법 |
JPH09115334A (ja) * | 1995-10-23 | 1997-05-02 | Mitsubishi Materiais Corp | 透明導電膜および膜形成用組成物 |
US5910378A (en) * | 1997-10-10 | 1999-06-08 | Minnesota Mining And Manufacturing Company | Membrane electrode assemblies |
US6277303B1 (en) * | 1998-07-10 | 2001-08-21 | Pirelli Cable Corporation | Conductive polymer composite materials and methods of making same |
US6284832B1 (en) * | 1998-10-23 | 2001-09-04 | Pirelli Cables And Systems, Llc | Crosslinked conducting polymer composite materials and method of making same |
EP1263887A1 (en) * | 2000-02-04 | 2002-12-11 | Massachusetts Institute Of Technology | Insulated nanoscopic pathways, compositions and devices of the same |
US7265174B2 (en) * | 2001-03-22 | 2007-09-04 | Clemson University | Halogen containing-polymer nanocomposite compositions, methods, and products employing such compositions |
KR100428647B1 (ko) * | 2002-02-04 | 2004-04-28 | 삼성전자주식회사 | 감광체 및 그것을 이용한 화상형성 장치 |
-
2004
- 2004-07-29 US US10/566,339 patent/US20080015284A1/en not_active Abandoned
- 2004-07-29 CN CN200480025104.2A patent/CN1845956B/zh not_active Expired - Fee Related
- 2004-07-29 WO PCT/US2004/024527 patent/WO2005012411A1/en active Application Filing
- 2004-07-29 JP JP2006522069A patent/JP2007500771A/ja active Pending
-
2012
- 2012-05-15 JP JP2012111657A patent/JP2012177131A/ja active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56839A (en) * | 1979-06-18 | 1981-01-07 | Shin Kobe Electric Mach Co Ltd | Conductive thermoplastic resin composition |
JPS56159252A (en) * | 1980-05-13 | 1981-12-08 | Lion Corp | Electrically conductive plastic sheet |
JPS5721441A (en) * | 1980-07-14 | 1982-02-04 | Mitsubishi Petrochem Co Ltd | Electrically conductive resin composition |
JPS5875706A (ja) * | 1981-10-30 | 1983-05-07 | 旭化成株式会社 | 導電性材料 |
JPS59132504A (ja) * | 1983-01-19 | 1984-07-30 | 株式会社明電舎 | プラスチツク導電材料 |
JPS60124654A (ja) * | 1983-12-12 | 1985-07-03 | Mitsubishi Petrochem Co Ltd | 導電性樹脂組成物 |
JPS6312665A (ja) * | 1986-07-03 | 1988-01-20 | Sumitomo Electric Ind Ltd | 半導電性樹脂組成物 |
JPH09309720A (ja) * | 1996-03-21 | 1997-12-02 | Kao Corp | 有機変性層状珪酸塩及び永久帯電防止性樹脂組成物 |
JP2002241607A (ja) * | 2001-02-20 | 2002-08-28 | Toray Ind Inc | ポリアミド樹脂組成物 |
JP2003082231A (ja) * | 2001-09-17 | 2003-03-19 | Kanegafuchi Chem Ind Co Ltd | ポリイミド樹脂組成物、ポリイミドフィルムおよびポリイミド管状物 |
WO2003036661A2 (en) * | 2001-10-25 | 2003-05-01 | Cts Corporation | Resistor nanocomposite compoisitons |
JP2003171562A (ja) * | 2001-12-06 | 2003-06-20 | Tokai Carbon Co Ltd | 抵抗安定性に優れたポリマー組成物 |
JP2007515502A (ja) * | 2003-05-22 | 2007-06-14 | ゼネラル・エレクトリック・カンパニイ | 導電性組成物及びその製造方法 |
Cited By (5)
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JP2007056050A (ja) * | 2005-08-22 | 2007-03-08 | Matsushita Electric Ind Co Ltd | 高分子抵抗体インク |
JP2010514883A (ja) * | 2006-12-26 | 2010-05-06 | チェイル インダストリーズ インコーポレイテッド | 導電性熱可塑性樹脂組成物及びプラスチック成形品 |
JP2011515549A (ja) * | 2008-03-25 | 2011-05-19 | ロディア オペレーションズ | ポリアミド組成物 |
JP5206903B2 (ja) * | 2011-03-25 | 2013-06-12 | 東レ株式会社 | 熱可塑性樹脂組成物およびそれを用いた成形品 |
US9947433B2 (en) | 2011-03-25 | 2018-04-17 | Toray Industries, Inc. | Thermoplastic resin composition and molded product using the same |
Also Published As
Publication number | Publication date |
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CN1845956B (zh) | 2014-07-16 |
US20080015284A1 (en) | 2008-01-17 |
JP2012177131A (ja) | 2012-09-13 |
WO2005012411A1 (en) | 2005-02-10 |
CN1845956A (zh) | 2006-10-11 |
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