JP2007324138A - 導電性微粒子及び異方性導電材料 - Google Patents

導電性微粒子及び異方性導電材料 Download PDF

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Publication number
JP2007324138A
JP2007324138A JP2007189278A JP2007189278A JP2007324138A JP 2007324138 A JP2007324138 A JP 2007324138A JP 2007189278 A JP2007189278 A JP 2007189278A JP 2007189278 A JP2007189278 A JP 2007189278A JP 2007324138 A JP2007324138 A JP 2007324138A
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conductive
fine particles
film
plating
conductive fine
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Japanese (ja)
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JP2007324138A5 (https=
Inventor
Hiroya Ishida
浩也 石田
Takeshi Wakiya
武司 脇屋
Shinya Uenoyama
伸也 上野山
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2007189278A priority Critical patent/JP2007324138A/ja
Publication of JP2007324138A publication Critical patent/JP2007324138A/ja
Publication of JP2007324138A5 publication Critical patent/JP2007324138A5/ja
Pending legal-status Critical Current

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  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2007189278A 2004-01-30 2007-07-20 導電性微粒子及び異方性導電材料 Pending JP2007324138A (ja)

Priority Applications (1)

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JP2007189278A JP2007324138A (ja) 2004-01-30 2007-07-20 導電性微粒子及び異方性導電材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004024063 2004-01-30
JP2004241571 2004-08-20
JP2007189278A JP2007324138A (ja) 2004-01-30 2007-07-20 導電性微粒子及び異方性導電材料

Related Parent Applications (1)

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JP2005517472A Division JP4243279B2 (ja) 2004-01-30 2005-01-27 導電性微粒子及び異方性導電材料

Publications (2)

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JP2007324138A true JP2007324138A (ja) 2007-12-13
JP2007324138A5 JP2007324138A5 (https=) 2008-02-14

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JP2007189278A Pending JP2007324138A (ja) 2004-01-30 2007-07-20 導電性微粒子及び異方性導電材料

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JP (1) JP2007324138A (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010768A1 (ja) * 2008-07-24 2010-01-28 ソニーケミカル＆インフォメーションデバイス株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2011111152A1 (ja) * 2010-03-08 2011-09-15 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP2012142137A (ja) * 2010-12-28 2012-07-26 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
KR20130115150A (ko) * 2012-04-10 2013-10-21 니폰 가가쿠 고교 가부시키가이샤 도전성 입자 및 그것을 포함하는 도전성 재료
WO2014054572A1 (ja) * 2012-10-02 2014-04-10 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR20160006614A (ko) * 2014-07-09 2016-01-19 히타치가세이가부시끼가이샤 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제, 접속 구조체 및 도전 입자의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855514A (ja) * 1993-12-16 1996-02-27 Shin Etsu Polymer Co Ltd 導電性粒子およびこれを用いた異方導電接着剤
JP2504057B2 (ja) * 1987-06-02 1996-06-05 日立化成工業株式会社 導電性粒子
JPH11134934A (ja) * 1997-10-30 1999-05-21 Shin Etsu Polymer Co Ltd 異方導電性接着剤
JP4243279B2 (ja) * 2004-01-30 2009-03-25 積水化学工業株式会社 導電性微粒子及び異方性導電材料

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2504057B2 (ja) * 1987-06-02 1996-06-05 日立化成工業株式会社 導電性粒子
JPH0855514A (ja) * 1993-12-16 1996-02-27 Shin Etsu Polymer Co Ltd 導電性粒子およびこれを用いた異方導電接着剤
JPH11134934A (ja) * 1997-10-30 1999-05-21 Shin Etsu Polymer Co Ltd 異方導電性接着剤
JP4243279B2 (ja) * 2004-01-30 2009-03-25 積水化学工業株式会社 導電性微粒子及び異方性導電材料

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8395052B2 (en) 2008-07-24 2013-03-12 Dexerials Corporation Conductive particle, anisotropic conductive film, joined structure, and joining method
JP2010027569A (ja) * 2008-07-24 2010-02-04 Sony Chemical & Information Device Corp 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2010010768A1 (ja) * 2008-07-24 2010-01-28 ソニーケミカル＆インフォメーションデバイス株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
KR101592057B1 (ko) 2008-07-24 2016-02-05 데쿠세리아루즈 가부시키가이샤 도전성 입자, 이방성 도전 필름, 접합체 및 접속 방법
KR101704856B1 (ko) 2010-03-08 2017-02-08 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 이방성 도전 재료 및 접속 구조체
KR20130015268A (ko) * 2010-03-08 2013-02-13 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 이방성 도전 재료 및 접속 구조체
WO2011111152A1 (ja) * 2010-03-08 2011-09-15 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP2012142137A (ja) * 2010-12-28 2012-07-26 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
KR20130115150A (ko) * 2012-04-10 2013-10-21 니폰 가가쿠 고교 가부시키가이샤 도전성 입자 및 그것을 포함하는 도전성 재료
KR20170117983A (ko) * 2012-04-10 2017-10-24 니폰 가가쿠 고교 가부시키가이샤 도전성 입자 및 그것을 포함하는 도전성 재료
KR101995595B1 (ko) * 2012-04-10 2019-07-02 니폰 가가쿠 고교 가부시키가이샤 도전성 입자 및 그것을 포함하는 도전성 재료
WO2014054572A1 (ja) * 2012-10-02 2014-04-10 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP5636118B2 (ja) * 2012-10-02 2014-12-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
KR20150063962A (ko) * 2012-10-02 2015-06-10 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
KR102095823B1 (ko) 2012-10-02 2020-04-01 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
KR20160006614A (ko) * 2014-07-09 2016-01-19 히타치가세이가부시끼가이샤 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제, 접속 구조체 및 도전 입자의 제조 방법
KR102411476B1 (ko) * 2014-07-09 2022-07-05 쇼와덴코머티리얼즈가부시끼가이샤 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제, 접속 구조체 및 도전 입자의 제조 방법

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