JP2007307493A - Method for manufacturing coating roll, coating device having the same, and printed circuit board - Google Patents

Method for manufacturing coating roll, coating device having the same, and printed circuit board Download PDF

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JP2007307493A
JP2007307493A JP2006139852A JP2006139852A JP2007307493A JP 2007307493 A JP2007307493 A JP 2007307493A JP 2006139852 A JP2006139852 A JP 2006139852A JP 2006139852 A JP2006139852 A JP 2006139852A JP 2007307493 A JP2007307493 A JP 2007307493A
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coating
roll
printed wiring
wiring board
rolls
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JP5010855B2 (en
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Kazuo Sato
和男 佐藤
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Nippon CMK Corp
CMK Corp
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Nippon CMK Corp
CMK Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating roll used for a coating device neither single-sidedly moving coating compositions to one side of a pair of doctor bars inside the coating device nor holding the coating compositions inside the same doctor bar, the coating device having the same coating rolls, and a printed circuit board where there is no insufficient embedding of the coating compositions on a coated surface and no rubbing and the quality of coating compositions coated may be evenly made on the front and the back thereof. <P>SOLUTION: The coating roll used for the coating device to simultaneously coat the front and back of the printed circuit board and/or fill the coating compositions on them, wherein the peripheral surface of the roll is provided with trench areas having a plurality of annular trenches and flat areas having flat surfaces with no trenches. The coating device where two coating rolls are positioned at both ends and the trench areas and the flat areas are opposed to each other. The method for manufacturing the printed circuit board where the coating compositions simultaneously coat the front surface and backside and/or fill them while they are circulate-moved inside a pair of the coating rolls and the doctor bar disposed as opposed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プリント配線板の表裏に同時に塗料を塗布及び/又は充填する塗布装置に用いる塗布用ロールと、前記塗布用ロールを備えた塗布装置、及び前記塗布装置を用いたプリント配線板の製造方法に関する。   The present invention relates to a coating roll used in a coating apparatus that simultaneously applies and / or fills a front and back of a printed wiring board, a coating apparatus including the coating roll, and a printed wiring board using the coating apparatus. Regarding the method.

近年の機器の小型・高性能化に伴って、搭載されるプリント配線板においても小型・高密度配線化に加えて、更なる薄型化が要求されている。   Along with recent downsizing and high performance of equipment, printed circuit boards to be mounted are required to be further thinned in addition to downsizing and high density wiring.

このようなプリント配線板の製造装置、特にプリント配線板に表裏同時に塗料を塗布する塗布装置としては、図9及び図10に示したようなものが既に知られている。   As an apparatus for manufacturing such a printed wiring board, in particular, an application apparatus for applying a coating material to the printed wiring board simultaneously on the front and back sides, those shown in FIGS. 9 and 10 are already known.

すなわち、まず、図9に示すように、塗布用ロールR9a,R9bの間に、塗装されるべきプリント配線板P9を矢印D9の方向に搬送し、ドクターバ96a,96bから供給される塗料T9a,T9bを、塗布用ロールR9a,R9bを用いてプリント配線板P9の表裏に同時に塗布するものが一般的である(例えば、特許文献1参照)。   That is, first, as shown in FIG. 9, the printed wiring board P9 to be coated is transported in the direction of the arrow D9 between the coating rolls R9a and R9b, and the paints T9a and T9b supplied from the doctor bars 96a and 96b. Is commonly applied to the front and back of the printed wiring board P9 using application rolls R9a and R9b (see, for example, Patent Document 1).

また、図10に示すように、プリント配線板P10を矢印D10のように垂直方向に投入し、水平方向に配置された塗布用ロールR10a,R10bに供給された塗料T10a,T10bにて、プリント配線板P10の表裏を同時に塗布する方法も採られている(例えば、特許文献2参照)。   Further, as shown in FIG. 10, the printed wiring board P10 is put in the vertical direction as indicated by an arrow D10, and the printed wiring is made by the coating materials T10a and T10b supplied to the coating rolls R10a and R10b arranged in the horizontal direction. A method of simultaneously applying the front and back of the plate P10 is also employed (see, for example, Patent Document 2).

これら図9及び図10に示したような従来の塗布装置に用いられている塗布用ロールは、図11に示すような回転軸115の外層に、複数のリング状の溝を持つ塗布面111を備えた溝ロールR11と、図12に示すような回転軸125の外層に、溝を持たない塗布面122を備えたベタロールR12がある。   The coating roll used in the conventional coating apparatus as shown in FIGS. 9 and 10 has a coating surface 111 having a plurality of ring-shaped grooves on the outer layer of the rotating shaft 115 as shown in FIG. There is a groove roll R11 provided and a solid roll R12 provided with an application surface 122 having no groove on the outer layer of the rotating shaft 125 as shown in FIG.

前記溝ロールR11の塗布面111にある複数のリング状の溝は、ロールの外周方向に塗料をガイドするために適正な幅、深さ及び間隔で設置されており、均一な膜厚を確保するためにいくつかの工夫が施されたものもある(例えば、特許文献3参照)。   The plurality of ring-shaped grooves on the application surface 111 of the groove roll R11 are provided with an appropriate width, depth, and interval to guide the paint in the outer peripheral direction of the roll, and ensure a uniform film thickness. Some have been devised for this purpose (for example, see Patent Document 3).

一般的な塗布装置は、溝ロールとベタロールの2種類の組み合わせで一対をなしており、組み合わせ方法として、図13に示すような溝ロールR13a,R13bを2つ組み合わせた塗布装置M13と、図14に示すような溝ロールR14aとベタロールR14bを1つずつ組み合わせた塗布装置M14がある。   A general coating apparatus forms a pair by combining two types of groove rolls and solid rolls. As a combination method, a coating apparatus M13 combining two groove rolls R13a and R13b as shown in FIG. 13 and FIG. There is a coating apparatus M14 that combines a groove roll R14a and a solid roll R14b as shown in FIG.

前記塗布装置M14は、主に、被塗布物であるプリント配線板の貫通スルーホールに塗料を埋め込む場合に用いるが、図14に示した塗料T14bは、溝ロールR14b側からベタロールR14a側に徐々に移動すると共に、塗料T14aは、ベタロールR14a側のドクターバ146aに停滞してしまうため、ドクターバ146a内の塗料T14bが少なくなり、塗布面に埋め込み不足や擦れが発生するという不具合が起こった。従って通常は、ある程度ベタロールR14a側のドクターバ146aに塗料T14aが停滞すると、作業者が塗料T14aを溝ロールR14b側のドクターバ146bに手作業で移動しなくてはならないという問題があった。   The coating device M14 is mainly used when a coating material is embedded in a through-through hole of a printed wiring board that is an object to be coated. The coating material T14b shown in FIG. 14 is gradually applied from the groove roll R14b side to the solid roll R14a side. As the paint T14a moves, the paint T14a stays in the doctor bar 146a on the solid roll R14a side. Therefore, the paint T14b in the doctor bar 146a is reduced, and there is a problem that the coating surface is insufficiently embedded or rubbed. Therefore, normally, when the paint T14a stays in the doctor bar 146a on the solid roll R14a side to some extent, there is a problem that the operator has to manually move the paint T14a to the doctor bar 146b on the groove roll R14b side.

また、前記塗布装置M13は、主に、被塗布物であるプリント配線板の両面に塗料を塗布する場合に用いるが、図13に示した塗料T13a,T13bは共に、ドクターバ136a,136bに停滞してしまい、塗料の品質がドクターバ136a内とドクターバ136b内で均一でなくなるという不具合があった。近年では、基板の薄型化や重量軽減、部品実装性向上等の需要が高まり、基板に塗布する塗料の薄型化に対する要求が強く求められているが、その際、塗料の品質の均一を保つための攪拌が重要であり、上述のような塗料がドクターバ内に停滞するということに問題があった。
特開平05−265219号公報 特開平09−290191号公報 特開2001−121053号公報
The coating device M13 is mainly used when coating is applied to both surfaces of a printed wiring board, which is an object to be coated, but both of the coatings T13a and T13b shown in FIG. 13 stagnate in the doctor bars 136a and 136b. As a result, the quality of the paint is not uniform in the doctor bar 136a and the doctor bar 136b. In recent years, there has been a strong demand for thinner coatings to be applied to boards, as demand for thinner boards, reduced weight, and improved component mountability has increased. In that case, in order to maintain uniform paint quality. This stirring is important, and there is a problem that the above-mentioned paint stagnates in the doctor bar.
JP 05-265219 A JP 09-290191 A JP 2001-121053 A

本発明は上記2つの不具合を解消すべくなされたもので、その課題とするところは、塗布装置内の一対のドクターバの片側に一方的に塗料が移動してしまうことがなく、且つ、同一のドクターバ内に塗料が停滞することがない塗布用ロール、塗布装置、及び塗布面に埋め込み不足や擦れがなく、塗布される塗料の品質を表裏で均一にすることが可能なプリント配線板の製造方法を提供することにある。   The present invention has been made to solve the above-mentioned two problems, and the problem is that the paint does not move unilaterally to one side of a pair of doctor bars in the coating apparatus, and the same Application roll, application device, and printed wiring board manufacturing method capable of uniforming the quality of the applied paint on the front and back sides without being insufficiently embedded or rubbed on the application surface. Is to provide.

請求項1に係る本発明は、プリント配線板の表裏に同時に塗料を塗布及び/又は充填する塗布装置に用いる塗布用ロールであって、当該ロールの外周面が、複数のリング状溝を有する溝領域と、溝のない平滑面を有するベタ領域とを備えていることを特徴とする塗布用ロールにより上記課題を解決したものである。   The present invention according to claim 1 is a coating roll used in a coating apparatus that simultaneously applies and / or fills the front and back of a printed wiring board, and the outer peripheral surface of the roll has a plurality of ring-shaped grooves. The above-mentioned problems are solved by a coating roll characterized by comprising a region and a solid region having a smooth surface without a groove.

この塗布用ロールを用いることにより、塗布装置内の一対のドクターバ内の塗料を循環させる塗布装置を構成することができる。   By using this coating roll, a coating device that circulates the paint in the pair of doctor bars in the coating device can be configured.

また、請求項2に係る本発明は、前記ベタ領域が、前記溝領域の一方の端部に形成されていることを特徴とする。   Moreover, the present invention according to claim 2 is characterized in that the solid region is formed at one end of the groove region.

この塗布用ロールを用いることにより、主に被塗布物であるプリント配線板の両面に塗料を塗布する場合に用いる塗布装置であっても、塗布装置内の一対のドクターバ内に塗料が停滞することがない塗布装置を構成することができる。   By using this coating roll, the coating material stagnates in a pair of doctor bars in the coating device, even when the coating device is used mainly for coating the coating material on both sides of the printed wiring board. A coating apparatus that does not have this can be configured.

また、請求項3に係る本発明は、前記ベタ領域が、前記溝領域の両方の端部に形成されていることを特徴とする。   Moreover, the present invention according to claim 3 is characterized in that the solid region is formed at both ends of the groove region.

また、請求項4に係る本発明は、前記溝領域が、前記ベタ領域の両方の端部に形成されていることを特徴とする。   The present invention according to claim 4 is characterized in that the groove region is formed at both ends of the solid region.

この請求項3に係る本発明の塗布用ロールと請求項4に係る本発明の塗布用ロールを組み合わせて用いることにより、主に、被塗布物であるプリント配線板の貫通スルーホールに塗料を埋め込む場合に用いる塗布装置であっても、塗布装置内の一対のドクターバの片側に一方的に塗料が移動せず、もう一方の側のドクターバの塗料が少なくなることがなく、塗布面に埋め込み不足や擦れが発生するという不具合が発生することがない塗布装置を構成することができる。   By using a combination of the coating roll of the present invention according to claim 3 and the coating roll of the present invention according to claim 4, the paint is mainly embedded in the through-through hole of the printed wiring board as the coating object. Even in the case of the coating device used in the case, the paint does not move unilaterally to one side of the pair of doctor bars in the coating device, the paint on the other side of the doctor bar does not decrease, It is possible to configure a coating apparatus that does not cause the problem of rubbing.

また、請求項5に係る本発明は、請求項1記載の塗布用ロール2本を、当該塗布用ロールの両端部において、前記溝領域と前記ベタ領域が互に向かい合う状態で備えていることを特徴とする塗布装置により上記課題を解決したものである。   Further, the present invention according to claim 5 is provided with the two coating rolls according to claim 1 in a state in which the groove region and the solid region face each other at both ends of the coating roll. The above-described problems are solved by a characteristic coating apparatus.

これにより、塗布装置内の塗料を循環させることができ、作業者の手作業による塗料の移動を必要とせず、塗料の一方的な移動や停滞を回避することができる。   Thereby, the coating material in the coating device can be circulated, and it is not necessary to move the coating material manually by the operator, and unidirectional movement or stagnation of the coating material can be avoided.

また、請求項6に係る本発明は、請求項2記載の塗布用ロール2本を、互い違いに向かい合わせた状態で備えていることを特徴とする塗布装置により上記課題を解決したものである。   Further, the present invention according to claim 6 solves the above-mentioned problem by a coating apparatus comprising two coating rolls according to claim 2 in a state of facing each other alternately.

これにより、主に被塗布物であるプリント配線板の両面に塗料を塗布する場合に用いる塗布装置であっても、塗布装置内の一対のドクターバ内に塗料が停滞することがない。   Thereby, even if it is a coating device mainly used when apply | coating a coating material on both surfaces of the printed wiring board which is a to-be-coated object, a coating material does not stagnate in a pair of doctor bar in a coating device.

また、請求項7に係る本発明は、請求項3記載の塗布用ロールと請求項4の塗布用ロールを、互いに向かい合わせた状態で備えていることを特徴とする塗布装置により上記課題を解決したものである。   The present invention according to claim 7 solves the above-mentioned problem by a coating apparatus comprising the coating roll according to claim 3 and the coating roll according to claim 4 in a state of facing each other. It is a thing.

これにより、主に、被塗布物であるプリント配線板の貫通スルーホールに塗料を埋め込む場合に用いる塗布装置であっても、塗布装置内の一対のドクターバの片側に一方的に塗料が移動してしまうことがない。   As a result, even if the coating apparatus is used mainly for embedding paint in the through-hole of the printed wiring board that is the object to be coated, the paint is unilaterally moved to one side of the pair of doctor bars in the coating apparatus. There is no end.

また、請求項8に係わる本発明は、請求項6記載の塗布装置を用いて、塗料を、対向設置された一対の塗布用ロール間乃至ドクターバ内を循環移動せしめつつ、表裏同時に塗布及び/又は充填することを特徴とするプリント配線板の製造方法により上記課題を解決したものである。   The present invention according to claim 8 uses the coating apparatus according to claim 6 to apply and / or simultaneously coat and / or coat the coating material between the pair of coating rolls installed opposite to each other or through the doctor bar. The above-described problems are solved by a method for producing a printed wiring board, which is characterized by being filled.

これにより、ドクターバ内に塗料が停滞することを防止でき、プリント配線板の表裏に均一に攪拌された塗料が塗布されるため、塗布された塗料の品質が表裏で均一なプリント配線板を得ることができる。   This prevents the paint from stagnating in the doctor bar, and the uniformly stirred paint is applied to the front and back of the printed wiring board, so that the quality of the applied paint can be obtained on the front and back. Can do.

また、請求項9に係わる本発明は、請求項7記載の塗布装置を用いて、塗料を、対向設置された一対の塗布用ロール間乃至ドクターバ内を循環移動せしめつつ、表裏同時に塗布及び/又は充填することを特徴とするプリント配線板の製造方法により上記課題を解決したものである。   The present invention according to claim 9 uses the coating apparatus according to claim 7 to apply and / or simultaneously coat and / or coat the coating material between the pair of coating rolls installed opposite to each other and through the doctor bar. The above-described problems are solved by a method for producing a printed wiring board, which is characterized by being filled.

これにより、塗布面に埋め込み不足や擦れがないプリント配線板を得ることができる。   As a result, a printed wiring board can be obtained in which there is no insufficient embedding or rubbing on the coated surface.

本発明の塗布用ロール及び塗布装置を用いれば、塗料が塗布装置内の一対のドクターバの片側に一方的に移動してしまうことを防止できると共に、同一のドクターバ内に塗料が停滞することを防止することができる。また、本発明のプリント配線板の製造方法によれば、塗布面に埋め込み不足や擦れがなく、塗布された塗料の品質が表裏で均一なプリント配線板を製造することができる。   By using the coating roll and the coating apparatus of the present invention, it is possible to prevent the paint from unilaterally moving to one side of the pair of doctor bars in the coating apparatus and to prevent the paint from stagnating in the same doctor bar. can do. Further, according to the method for producing a printed wiring board of the present invention, it is possible to produce a printed wiring board in which the coating surface is not insufficiently embedded or rubbed and the quality of the applied paint is uniform on the front and back sides.

以下、本発明の塗布用ロールと塗布装置の実施の形態を、図1及び図4を用いて説明する。   Hereinafter, embodiments of a coating roll and a coating apparatus according to the present invention will be described with reference to FIGS. 1 and 4.

図1において、R1は本発明の塗布用ロールで、回転軸5を備えていると共に、当該ロールの外周面に複数のリング状溝を有する溝領域1と、溝のない平滑面を有するベタ領域4とを備えている。   In FIG. 1, R <b> 1 is a coating roll according to the present invention, which includes a rotating shaft 5, a groove region 1 having a plurality of ring-shaped grooves on the outer peripheral surface of the roll, and a solid region having a smooth surface without grooves. 4 is provided.

また、図4において、M4は本発明の塗布装置で、図1に示した本発明の塗布用ロールR1を2本互い違いに向かい合わせた状態に配設して構成されている。   In FIG. 4, M4 is a coating apparatus of the present invention, and is configured by arranging two coating rolls R1 of the present invention shown in FIG.

この本発明の塗布装置M4では、2つの塗布用ロールR14a,R14bにおいて、プリント配線板P4に接してなく、かつ互いの他方のベタ領域に接している溝領域1aの塗料T4a,T4bがベタ領域側に移動、すなわち塗料T4a,T4bは図中矢印D41及び矢印D43のように移動する。また、この矢印D41及び矢印D43方向への移動の影響を受けて、ドクターバ46a,46b内にある塗料T4a,T4bも図中矢印D42及び矢印D44のように移動する。結果として、塗布装置M4内の塗料は、矢印D41、矢印D42、矢印D43、矢印D44、再び矢印D41というように循環する。   In the coating apparatus M4 of the present invention, in the two coating rolls R14a and R14b, the paints T4a and T4b in the groove region 1a that is not in contact with the printed wiring board P4 and in contact with the other solid region are solid regions. In other words, the paints T4a and T4b move as indicated by arrows D41 and D43 in the figure. In addition, under the influence of the movement in the directions of the arrows D41 and D43, the paints T4a and T4b in the doctor bars 46a and 46b also move as indicated by arrows D42 and D44 in the drawing. As a result, the coating material in the coating apparatus M4 circulates as indicated by an arrow D41, an arrow D42, an arrow D43, an arrow D44, and an arrow D41 again.

これにより、ドクターバ内に塗料が停滞することを防止でき、プリント配線板の表裏に均一に攪拌された塗料が塗布されるため、塗布された塗料の品質が表裏で均一なプリント配線板を得ることができる。   This prevents the paint from stagnating in the doctor bar, and the uniformly stirred paint is applied to the front and back of the printed wiring board, so that the quality of the applied paint can be obtained on the front and back. Can do.

また、本発明の塗布用ロールと塗布装置の別の実施の形態を、図2、図3及び図5を用いて説明する。   Further, another embodiment of the coating roll and the coating apparatus of the present invention will be described with reference to FIG. 2, FIG. 3 and FIG.

図2において、R2は本発明の塗布用ロールで、回転軸25を備えていると共に、当該ロールの外周面に複数のリング状溝を有する溝領域21と、当該溝領域21の両側の端部に溝のない平滑面を有するベタ領域24a,24bとを備えている。   In FIG. 2, R2 is a coating roll according to the present invention, which has a rotating shaft 25, a groove region 21 having a plurality of ring-shaped grooves on the outer peripheral surface of the roll, and end portions on both sides of the groove region 21. Are provided with solid regions 24a and 24b having smooth surfaces without grooves.

また、図3において、R3は本発明の塗布用ロールで、回転軸35を備えていると共に、当該ロールの外周面に溝のない平滑面を有するベタ領域32と、当該溝領域32の両側の端部に複数のリング状溝を有する溝領域33a,33bとを備えている。   In FIG. 3, R3 is a coating roll according to the present invention, which includes a rotation shaft 35, a solid area 32 having a smooth surface without a groove on the outer peripheral surface of the roll, and both sides of the groove area 32. Groove regions 33a and 33b having a plurality of ring-shaped grooves at the end.

また、図5において、M5は本発明の塗布装置で、図2に示した本発明の塗布用ロールR2及び図3に示した本発明の塗布用ロールR3を互いに向かい合わせた状態に配設して構成されている。   In FIG. 5, M5 is a coating apparatus of the present invention, in which the coating roll R2 of the present invention shown in FIG. 2 and the coating roll R3 of the present invention shown in FIG. Configured.

この本発明の塗布装置M5では、2つの塗布用ロールR25,R35において、プリント配線板P5に接してなく、かつ互いの他方のベタ領域に接している溝領域の塗料T5a,T5bがベタ領域側に移動、すなわち塗料T5a,T5bは図中矢印D51及び矢印D55のように移動する。また、この矢印D51及び矢印D55方向への移動の影響と、矢印D53及び矢印D57方向への移動の影響を受けて、ドクターバ56a,56b内にある塗料T5a,T5bも図中矢印D52、矢印D54、及び矢印D56、矢印D58のように移動する。結果として、塗布装置M5内の塗料は、矢印D51、矢印D52、矢印D53、矢印D54、再び矢印D51という循環と、矢印D55、矢印D56、矢印D57、矢印D58、再び矢印D55という循環をする。   In the coating apparatus M5 of the present invention, in the two coating rolls R25 and R35, the coating regions T5a and T5b in the groove region that is not in contact with the printed wiring board P5 and is in contact with the other solid region are the solid region side. In other words, the paints T5a and T5b move as indicated by arrows D51 and D55 in the figure. Further, the paints T5a and T5b in the doctor bars 56a and 56b are also affected by the movement in the directions of the arrows D51 and D55 and the movements in the directions of the arrows D53 and D57, and the arrows D52 and D54 in the drawing are also shown. , And as indicated by arrows D56 and D58. As a result, the coating material in the coating apparatus M5 circulates as an arrow D51, an arrow D52, an arrow D53, an arrow D54, and an arrow D51 again, and an arrow D55, an arrow D56, an arrow D57, an arrow D58, and an arrow D55 again.

これにより、主に、被塗布物であるプリント配線板の貫通スルーホールに塗料を埋め込む場合に用いる塗布装置であっても、塗布装置内の一対のドクターバの片側に一方的に塗料が移動せず、もう一方の側のドクターバの塗料が少なくなることがなく、塗布面に埋め込み不足や擦れが発生するという不具合が発生することがないため、塗布面に埋め込み不足や擦れがないプリント配線板を得ることができる。   As a result, even if the coating device is used mainly when the coating material is embedded in the through-through hole of the printed wiring board as the coating object, the coating material does not move unilaterally to one side of the pair of doctor bars in the coating device. Because the paint on the doctor side on the other side is not reduced, and there is no problem of insufficient embedding or rubbing on the coated surface, a printed wiring board is obtained that does not have insufficient embedding or rubbing on the coated surface. be able to.

次に、本発明のプリント配線板の製造方法の実施の形態を、図6〜図8を用いて説明する。   Next, an embodiment of a method for manufacturing a printed wiring board according to the present invention will be described with reference to FIGS.

まず、図6(a)に示すように、絶縁層61の上下層に導体層62を備えた基板P6を用意する。このとき、前記基板P6は、片面基板、両面基板、多層基板のいずれであっても構わない。   First, as shown in FIG. 6A, a substrate P6 having a conductor layer 62 on the upper and lower layers of the insulating layer 61 is prepared. At this time, the substrate P6 may be a single-sided substrate, a double-sided substrate, or a multilayer substrate.

次に、図6(b)に示すように、NCドリル装置やレーザにより表裏接続用の貫通スルーホールを形成し、ホールクリーニング等の化学処理を施した後、図6(c)に示すように、無電解銅めっき、電解銅めっきの順で実施する。   Next, as shown in FIG. 6 (b), through through holes for front and back connection are formed by an NC drill device or a laser and subjected to chemical treatment such as hole cleaning, as shown in FIG. 6 (c). Conducted in the order of electroless copper plating and electrolytic copper plating.

次に、図示しない表裏及び貫通スルーホール内を覆うように感光性のエッチングレジストを塗布し、必要な部分を露光した後、現像、エッチングを実施し、図7(d)に示すような、回路形成後のプリント配線板を得る。尚、感光性のエッチングレジストを塗布する替わりに、表裏及び貫通スルーホール内を覆うようにエッチングレジストフィルムを張っても構わない。   Next, a photosensitive etching resist is applied so as to cover the front and back surfaces and through through holes (not shown), and after exposing necessary portions, development and etching are performed, and a circuit as shown in FIG. A printed wiring board after formation is obtained. Instead of applying the photosensitive etching resist, an etching resist film may be stretched so as to cover the front and back surfaces and the through through holes.

次に、図7(e)に示すように、ソルダーレジスト74を塗布する。このとき、図14に示した塗布装置を用いて塗布することが望ましい。   Next, as shown in FIG. 7E, a solder resist 74 is applied. At this time, it is desirable to apply using the application apparatus shown in FIG.

次に、図7(f)に示すように、図示しないスキージを用いて、前記ソルダーレジスト74を塗布したプリント配線板表面をスキージングする。   Next, as shown in FIG. 7F, the surface of the printed wiring board coated with the solder resist 74 is squeezed using a squeegee (not shown).

次に、図8(g)に示すように、ソルダーレジスト85を塗布し、図示しないスキージを用いてスキージングした後、図8(h)に示すように、ソルダーレジスト86を塗布し、図示しないスキージを用いてスキージングをする。このとき、図13に示した塗布装置を用いて塗布することが望ましい。   Next, as shown in FIG. 8G, a solder resist 85 is applied and squeezed using a squeegee (not shown), and then a solder resist 86 is applied as shown in FIG. Squeeze with a squeegee. At this time, it is desirable to apply using the application apparatus shown in FIG.

これらのソルダーレジストの塗布とスキージングの繰り返しの実施により、ソルダーレジストの表面の凹凸を低減することができる。   By repeatedly applying these solder resists and squeezing, unevenness on the surface of the solder resist can be reduced.

尚、ソルダーレジスト74、85及び86は同じものであっても構わない。   The solder resists 74, 85, and 86 may be the same.

また、前記ソルダーレジストの繰り返しの回数は、本例によって特定及び/又は制限されるものではない。   Further, the number of repetitions of the solder resist is not specified and / or limited by this example.

次に、図8(k)に示すように、ソルダーレジストの露光、現像、キュアを実施し、ソルダーレジストが塗布されたプリント配線板P8を得る。   Next, as shown in FIG. 8 (k), the solder resist is exposed, developed and cured to obtain a printed wiring board P8 coated with the solder resist.

これにより、塗布面に埋め込み不足や擦れがなく、表裏共に均一な品質のソルダーレジストが塗布されたプリント配線板を得る。   Thereby, there is obtained a printed wiring board on which the solder resist having a uniform quality is applied on both the front and back sides without being embedded and rubbing on the coated surface.

尚、本発明を説明するに当たって、図1〜図8を例として説明したが、本発明の構成はこれらの限りでなく、また、これらの例により何ら制限されるものではなく、本発明の範囲内で種々の変更が可能である。   In describing the present invention, FIGS. 1 to 8 have been described as examples. However, the configuration of the present invention is not limited to these examples, and is not limited to these examples. Various modifications can be made within.

本発明の第1の塗布用ロールを示す概略平面説明図。FIG. 3 is a schematic plan view showing a first coating roll of the present invention. 本発明の第2の塗布用ロールを示す概略平面説明図。The schematic plane explanatory drawing which shows the 2nd roll for application | coating of this invention. 本発明の第3の塗布用ロールを示す概略平面説明図。FIG. 5 is a schematic plan view showing a third coating roll of the present invention. 本発明の第1の塗布装置を示す概略平面説明図。FIG. 3 is a schematic plan view showing a first coating apparatus of the present invention. 本発明の第2の塗布装置を示す概略平面説明図。The schematic plane explanatory view showing the 2nd coating device of the present invention. 本発明のプリント配線板の製造方法を示す概略断面工程説明図。BRIEF DESCRIPTION OF THE DRAWINGS The schematic cross-sectional process explanatory drawing which shows the manufacturing method of the printed wiring board of this invention. 図6に続く概略断面工程説明図。FIG. 7 is a schematic cross-sectional process explanatory diagram following FIG. 6. 図7に続く概略断面工程説明図。FIG. 8 is a schematic cross-sectional process explanatory diagram following FIG. 7. 一般的な塗布装置例を示す概略断面説明図。Schematic cross-sectional explanatory drawing which shows the example of a common coating device. 他の一般的な塗布装置例を示す概略断面説明図。Schematic cross-sectional explanatory drawing which shows the other general coating apparatus example. 従来の塗布用ロール例を示す概略平面説明図。The schematic plane explanatory drawing which shows the example of the conventional roll for an application | coating. 他の従来の塗布用ロール例を示す概略平面説明図。Schematic plane explanatory drawing which shows the other example of the conventional application | coating roll. 従来の塗布装置例を示す概略平面説明図。The schematic plane explanatory drawing which shows the example of the conventional coating device. 他の従来の塗布装置例を示す概略平面説明図。The schematic plane explanatory drawing which shows the other example of the conventional coating device.

符号の説明Explanation of symbols

1,1a,21,33a,33b,111:溝領域
4,24a,24b,32,122:ベタ領域
5,25,35,115,125:回転軸
R1,R2,R3,R14a,R14b,R25,R35,R9a,R9b,R10a,R10b,R11,R12:塗布用ロール
46a,46b,56a,56b,96a,96b,106a,106b,136a,136b,146a,146b:ドクターバ
T4a,T4b,T5a,T5b,T9a,T9b,T10a,T10b,T13a,T13b,T14a,T14b:塗料
P4,P5,P8,P9,P10,P13,P14:プリント配線板
97:搬送機
98:搬送ローラ
M4,M5,M13,M14:塗布装置
62:導体層
61:絶縁層
P6:基板
74,85,86:ソルダーレジスト
R13a,R13b,R14b:溝ロール
R14a:ベタロール
D41,D42,D43,D44,D51,D52,D53,D54,D55,D56,D57,D58,D131,D132,D141,D142,D143,D144:塗料循環方向
D9,D10:プリント配線板搬送方向
1, 1a, 21, 33a, 33b, 111: groove regions 4, 24a, 24b, 32, 122: solid regions 5, 25, 35, 115, 125: rotation axes R1, R2, R3, R14a, R14b, R25, R35, R9a, R9b, R10a, R10b, R11, R12: coating rolls 46a, 46b, 56a, 56b, 96a, 96b, 106a, 106b, 136a, 136b, 146a, 146b: doctor bars T4a, T4b, T5a, T5b, T9a, T9b, T10a, T10b, T13a, T13b, T14a, T14b: Paint P4, P5, P8, P9, P10, P13, P14: Printed wiring board 97: Conveying machine 98: Conveying rollers M4, M5, M13, M14: Coating device 62: Conductor layer 61: Insulating layer P6: Substrates 74, 85, 86: Solder regis R13a, R13b, R14b: Groove roll R14a: Solid roll D41, D42, D43, D44, D51, D52, D53, D54, D55, D56, D57, D58, D131, D132, D141, D142, D143, D144: Paint circulation direction D9, D10: Printed wiring board conveyance direction

Claims (9)

プリント配線板の表裏に同時に塗料を塗布及び/又は充填する塗布装置に用いる塗布用ロールであって、当該ロールの外周面が、複数のリング状溝を有する溝領域と、溝のない平滑面を有するベタ領域とを備えていることを特徴とする塗布用ロール。   An application roll used in an application device that simultaneously applies and / or fills the front and back surfaces of a printed wiring board, and the outer peripheral surface of the roll has a groove area having a plurality of ring-shaped grooves and a smooth surface without grooves. A coating roll, comprising: a solid region having the same. 前記ベタ領域が、前記溝領域の一方の端部に形成されていることを特徴とする請求項1記載の塗布用ロール。   2. The coating roll according to claim 1, wherein the solid area is formed at one end of the groove area. 前記ベタ領域が、前記溝領域の両方の端部に形成されていることを特徴とする請求項1記載の塗布用ロール。   The coating roll according to claim 1, wherein the solid region is formed at both ends of the groove region. 前記溝領域が、前記ベタ領域の両方の端部に形成されていることを特徴とする請求項1記載の塗布用ロール。   2. The coating roll according to claim 1, wherein the groove region is formed at both ends of the solid region. 請求項1記載の塗布用ロール2本を、当該塗布用ロールの両端部において、前記溝領域と前記ベタ領域が互に向かい合う状態で備えていることを特徴とする塗布装置。   2. A coating apparatus comprising two coating rolls according to claim 1, wherein the groove region and the solid region face each other at both ends of the coating roll. 請求項2記載の塗布用ロール2本を、互い違いに向かい合わせた状態で備えていることを特徴とする請求項5記載の塗布装置。   The coating apparatus according to claim 5, wherein the two coating rolls according to claim 2 are provided in a state of facing each other alternately. 請求項3記載の塗布用ロールと請求項4の塗布用ロールを、互いに向かい合わせた状態で備えていることを特徴とする請求項5記載の塗布装置。   The coating apparatus according to claim 5, wherein the coating roll according to claim 3 and the coating roll according to claim 4 are provided facing each other. 請求項6記載の塗布装置を用いて、塗料を、対向設置された一対の塗布用ロール間乃至ドクターバ内を循環移動せしめつつ、表裏同時に塗布及び/又は充填することを特徴とするプリント配線板の製造方法。   Using the coating apparatus according to claim 6, a coating material is applied and / or filled at the same time, while circulating and moving between a pair of coating rolls disposed opposite to each other or inside a doctor bar. Production method. 請求項7記載の塗布装置を用いて、塗料を、対向設置された一対の塗布用ロール間乃至ドクターバ内を循環移動せしめつつ、表裏同時に塗布及び/又は充填することを特徴とするプリント配線板の製造方法。   A printed wiring board characterized in that, using the coating apparatus according to claim 7, the coating material is applied and / or filled at the same time while circulating and moving between a pair of coating rolls disposed opposite to each other or inside the doctor bar. Production method.
JP2006139852A 2006-05-19 2006-05-19 Coating apparatus and method for manufacturing printed wiring board using the coating apparatus Expired - Fee Related JP5010855B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010041328A1 (en) * 2008-10-10 2010-04-15 有限会社マイスター Application roll

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JP5735047B2 (en) * 2013-06-21 2015-06-17 株式会社エナテック Coating apparatus and coating method

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JPH03229487A (en) * 1990-02-05 1991-10-11 Hitachi Ltd Printed wiring board and method and apparatus for manufacture thereof
JPH0691213A (en) * 1991-10-03 1994-04-05 Casco Nobel Ind Prod Ab Bonding method
JPH09141177A (en) * 1995-11-20 1997-06-03 Kyokuto Sanki Co Ltd Sizing apparatus
JP2001276696A (en) * 2000-03-30 2001-10-09 Sumitomo Metal Electronics Devices Inc Roll coater
JP2002260678A (en) * 2000-12-28 2002-09-13 Fuji Electric Co Ltd Method of manufacturing matrix layer for phosphoric acid fuel cell

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03229487A (en) * 1990-02-05 1991-10-11 Hitachi Ltd Printed wiring board and method and apparatus for manufacture thereof
JPH0691213A (en) * 1991-10-03 1994-04-05 Casco Nobel Ind Prod Ab Bonding method
JPH09141177A (en) * 1995-11-20 1997-06-03 Kyokuto Sanki Co Ltd Sizing apparatus
JP2001276696A (en) * 2000-03-30 2001-10-09 Sumitomo Metal Electronics Devices Inc Roll coater
JP2002260678A (en) * 2000-12-28 2002-09-13 Fuji Electric Co Ltd Method of manufacturing matrix layer for phosphoric acid fuel cell

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010041328A1 (en) * 2008-10-10 2010-04-15 有限会社マイスター Application roll

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