JP2007281370A5 - - Google Patents

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Publication number
JP2007281370A5
JP2007281370A5 JP2006108884A JP2006108884A JP2007281370A5 JP 2007281370 A5 JP2007281370 A5 JP 2007281370A5 JP 2006108884 A JP2006108884 A JP 2006108884A JP 2006108884 A JP2006108884 A JP 2006108884A JP 2007281370 A5 JP2007281370 A5 JP 2007281370A5
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JP
Japan
Prior art keywords
lid
recessed portion
package base
piezoelectric
bonding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006108884A
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English (en)
Japanese (ja)
Other versions
JP4830074B2 (ja
JP2007281370A (ja
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Publication date
Application filed filed Critical
Priority to JP2006108884A priority Critical patent/JP4830074B2/ja
Priority claimed from JP2006108884A external-priority patent/JP4830074B2/ja
Publication of JP2007281370A publication Critical patent/JP2007281370A/ja
Publication of JP2007281370A5 publication Critical patent/JP2007281370A5/ja
Application granted granted Critical
Publication of JP4830074B2 publication Critical patent/JP4830074B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006108884A 2006-04-11 2006-04-11 圧電デバイスおよび電子デバイスの製造方法 Expired - Fee Related JP4830074B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006108884A JP4830074B2 (ja) 2006-04-11 2006-04-11 圧電デバイスおよび電子デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006108884A JP4830074B2 (ja) 2006-04-11 2006-04-11 圧電デバイスおよび電子デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2007281370A JP2007281370A (ja) 2007-10-25
JP2007281370A5 true JP2007281370A5 (enrdf_load_stackoverflow) 2009-06-18
JP4830074B2 JP4830074B2 (ja) 2011-12-07

Family

ID=38682485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006108884A Expired - Fee Related JP4830074B2 (ja) 2006-04-11 2006-04-11 圧電デバイスおよび電子デバイスの製造方法

Country Status (1)

Country Link
JP (1) JP4830074B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5417737B2 (ja) * 2008-04-23 2014-02-19 パナソニック株式会社 慣性力センサ
JP2011049992A (ja) * 2009-08-28 2011-03-10 Seiko Instruments Inc 圧電デバイス及び圧電デバイスの製造方法
KR102221892B1 (ko) * 2016-10-24 2021-03-02 미쓰비시덴키 가부시키가이샤 반도체 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168088A (ja) * 1986-12-29 1988-07-12 株式会社デンソー 物品の加熱方法
JPH02198435A (ja) * 1989-01-27 1990-08-06 Konica Corp ストロボ付カメラ
JP3034370B2 (ja) * 1991-12-26 2000-04-17 株式会社東芝 固体撮像装置及びその製造方法
JP3434406B2 (ja) * 1996-03-01 2003-08-11 パイオニア株式会社 パッケージの製造方法
JP2000151336A (ja) * 1998-11-05 2000-05-30 Seiko Epson Corp 圧電振動子及び圧電発振器とこれらの製造方法
JP2000165189A (ja) * 1998-11-27 2000-06-16 Seiko Epson Corp 圧電振動子及び圧電発振器とこれらの製造方法
JP2001068577A (ja) * 1999-06-22 2001-03-16 Seiko Epson Corp 電子部品用パッケージ及びその製造方法
JP2001326290A (ja) * 2000-03-10 2001-11-22 Seiko Epson Corp パッケージの封止方法、電子素子モジュールの製造方法、封止装置並びにパッケージ品
JP4089149B2 (ja) * 2000-10-25 2008-05-28 セイコーエプソン株式会社 圧電デバイス
JP2002353352A (ja) * 2001-05-30 2002-12-06 Kyocera Corp 撮像素子収納用パッケージ
JP2003017607A (ja) * 2001-06-28 2003-01-17 Kyocera Corp 撮像素子収納用パッケージ
JP3786097B2 (ja) * 2002-03-25 2006-06-14 セイコーエプソン株式会社 圧電デバイスの蓋封止方法及び圧電デバイスの製造方法並びに圧電デバイスの蓋封止装置
JP3965685B2 (ja) * 2002-08-30 2007-08-29 株式会社大真空 表面実装型圧電振動デバイス
JP2006005019A (ja) * 2004-06-15 2006-01-05 Seiko Epson Corp 電子デバイスの製造方法

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