JP2007234850A5 - - Google Patents

Download PDF

Info

Publication number
JP2007234850A5
JP2007234850A5 JP2006054460A JP2006054460A JP2007234850A5 JP 2007234850 A5 JP2007234850 A5 JP 2007234850A5 JP 2006054460 A JP2006054460 A JP 2006054460A JP 2006054460 A JP2006054460 A JP 2006054460A JP 2007234850 A5 JP2007234850 A5 JP 2007234850A5
Authority
JP
Japan
Prior art keywords
gate
semiconductor device
temperature
central region
connection lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006054460A
Other languages
English (en)
Japanese (ja)
Other versions
JP5014646B2 (ja
JP2007234850A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006054460A priority Critical patent/JP5014646B2/ja
Priority claimed from JP2006054460A external-priority patent/JP5014646B2/ja
Publication of JP2007234850A publication Critical patent/JP2007234850A/ja
Publication of JP2007234850A5 publication Critical patent/JP2007234850A5/ja
Application granted granted Critical
Publication of JP5014646B2 publication Critical patent/JP5014646B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006054460A 2006-03-01 2006-03-01 半導体装置 Active JP5014646B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006054460A JP5014646B2 (ja) 2006-03-01 2006-03-01 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006054460A JP5014646B2 (ja) 2006-03-01 2006-03-01 半導体装置

Publications (3)

Publication Number Publication Date
JP2007234850A JP2007234850A (ja) 2007-09-13
JP2007234850A5 true JP2007234850A5 (enrdf_load_stackoverflow) 2009-02-26
JP5014646B2 JP5014646B2 (ja) 2012-08-29

Family

ID=38555132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006054460A Active JP5014646B2 (ja) 2006-03-01 2006-03-01 半導体装置

Country Status (1)

Country Link
JP (1) JP5014646B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6115050B2 (ja) * 2012-09-10 2017-04-19 トヨタ自動車株式会社 半導体装置
CN104838497B (zh) 2012-12-21 2017-08-25 丰田自动车株式会社 半导体装置
DE102017110536B4 (de) * 2017-05-15 2022-06-30 Infineon Technologies Ag Halbleitervorrichtung mit breiter Bandlücke, die Gatefinger zwischen Bondpads enthält, und Halbleitermodul
JP7095316B2 (ja) * 2018-03-06 2022-07-05 株式会社デンソー 半導体装置
CN112543993B (zh) 2019-02-07 2025-06-06 富士电机株式会社 半导体装置
JP7242491B2 (ja) 2019-09-20 2023-03-20 株式会社東芝 半導体装置及び半導体回路
JP7305589B2 (ja) 2020-03-19 2023-07-10 株式会社東芝 半導体装置及び半導体回路
JP7490604B2 (ja) * 2021-03-22 2024-05-27 株式会社東芝 半導体装置
CN117577672A (zh) * 2023-11-30 2024-02-20 江苏易矽科技有限公司 一种具有多有效栅的igbt结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823096A (ja) * 1994-07-08 1996-01-23 Toshiba Corp 半導体装置
GB9818044D0 (en) * 1998-08-20 1998-10-14 Koninkl Philips Electronics Nv Power transistor device
JP2000101076A (ja) * 1998-09-25 2000-04-07 Toshiba Corp 絶縁ゲート型半導体素子とその駆動方法
JP4086558B2 (ja) * 2002-06-21 2008-05-14 三洋電機株式会社 半導体装置およびその製造方法
JP3997126B2 (ja) * 2002-08-29 2007-10-24 株式会社ルネサステクノロジ トレンチゲート型半導体装置
JP4130356B2 (ja) * 2002-12-20 2008-08-06 株式会社東芝 半導体装置
JP3906213B2 (ja) * 2004-03-10 2007-04-18 株式会社東芝 半導体装置
JP2005302953A (ja) * 2004-04-09 2005-10-27 Toshiba Corp 半導体装置

Similar Documents

Publication Publication Date Title
JP2007234850A5 (enrdf_load_stackoverflow)
CN101876683B (zh) 测试半导体器件的方法和系统
JP2009192309A5 (enrdf_load_stackoverflow)
JP2008134302A5 (enrdf_load_stackoverflow)
JP2015215611A5 (enrdf_load_stackoverflow)
JP2013501983A5 (enrdf_load_stackoverflow)
MX2018005578A (es) Arreglo de cristal que tiene un cristal compuesto calentable que tiene una region de conmutacion capacitiva.
JP2017162173A5 (enrdf_load_stackoverflow)
JP2013231894A5 (enrdf_load_stackoverflow)
JP2009278078A5 (enrdf_load_stackoverflow)
JP2007510238A (ja) 電子部品の冷却システム
WO2010005498A3 (en) Method and apparatus for detecting two simultaneous touches and gestures on a resistive touchscreen
JP2009218577A5 (ja) 表示装置
CN104808859A (zh) 一种内嵌式触摸面板和触摸显示装置
CN104898741B (zh) 显示装置
JP2014075377A5 (enrdf_load_stackoverflow)
US9130569B2 (en) Controller for load circuit
TWI528240B (zh) 觸控面板及其觸控電極結構與偵測方法
JP2011174919A5 (enrdf_load_stackoverflow)
JP2007298508A (ja) センサ
JP2015099893A5 (enrdf_load_stackoverflow)
JP2004213667A5 (enrdf_load_stackoverflow)
JP2016109791A5 (enrdf_load_stackoverflow)
JP2011238897A5 (enrdf_load_stackoverflow)
JP2012222813A5 (ja) 半導体装置