JP2007224275A - Glass paste for forming partitioning wall - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass paste for forming a partitioning wall capable of obtaining a dried membrane capable of preventing sand blasting property from lowering even on drying at a high temperature in order to dry the paste applied on a glass substrate plate in a short time, while maintaining the close adhesion with the substrate plate or a dry film resist and membrane strength. <P>SOLUTION: This paste for forming the partitioning wall used for the formation of the partitioning wall of a plasma display by using an organic resin containing 1 to 5 mass% total amount of a cellulose-based resin and butyral resin is characterized by containing an antioxidant. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a barrier rib forming glass paste used for forming barrier ribs of a plasma display.

  The plasma display is a self-luminous flat display that has excellent characteristics such as light weight and thinness, high viewing angle, etc., and it is easy to enlarge the screen, so it is attracting attention as the most promising display device. Yes.

  FIG. 1 is a cross-sectional view showing the structure of such a plasma display panel. As shown in FIG. 1, in a plasma display panel, a front glass substrate 1 and a rear glass substrate 2 are generally provided facing each other, and a large number of gas discharge portions are provided in a space between these substrates. A partition wall (barrier rib) 3 is formed for separation. A pair of transparent electrodes 4 are formed on the front glass substrate 1, and a voltage is applied between the transparent electrodes 4 to generate plasma discharge.

  A dielectric layer 5 is formed on the transparent electrode 4 so as to cover the entire surface of the front glass substrate 1. On the dielectric layer 5, a protective layer 6 made of MgO for stably forming plasma is formed.

  A data electrode 7 is formed on the rear glass substrate 2 between the partition walls 3. On the side walls of the partition walls 3 and the back glass substrate 2 between the partition walls 3, a phosphor 8 is applied so as to cover the data electrodes 7.

  A voltage is applied between the transparent electrodes 4, thereby generating a plasma discharge in the gas discharge section partitioned by the partition 3, and the phosphor 8 is irradiated with ultraviolet rays generated by the plasma discharge, and the phosphor 8 emits light.

  In the plasma display panel, the partition walls 3 are usually formed on the rear glass substrate 2. And the panel is comprised by combining the back glass substrate 2 in which the partition 3 was formed, and the front glass substrate 1 so that it might oppose. In the panel structure shown in FIG. 1, the partition walls 3 are formed directly on the rear glass substrate 2, but after forming a dielectric layer for electrode protection covering the data electrodes 7 on the rear glass substrate 2, A panel structure in which partition walls are formed on the dielectric layer is also known.

  As a typical method for forming the partition wall, a sand blast method is known. In the sandblasting method, a partition wall forming glass paste is applied by screen printing or the like and dried to form a partition wall material layer on the entire surface of the back glass substrate or on the dielectric layer so as to have a predetermined thickness. Furthermore, after applying a dry film resist (DFR) on this, exposing and developing, the portion where the dry film resist film is not formed is removed by sandblasting, and the remaining dry film resist film is peeled off and baked. This is a method of forming a partition wall at a predetermined location.

  Therefore, the partition wall-forming glass paste has (1) good sandblasting properties, (2) high strength of the dried film obtained by applying and drying the glass paste, and partition wall damage due to sandblasting hardly occurs. (3) Properties such as high adhesion to the substrate and dry film resist are required.

  Conventionally, in order to satisfy these requirements, a cellulose-based resin has been added to the partition wall forming glass paste. Cellulosic resins have the effect of increasing the adhesion of the dry film obtained by drying and the substrate and dry film resist, and the film strength, but at the same time it takes time during the sandblasting process, which increases the production efficiency of the plasma display panel. descend. If the amount of cellulose-based resin added is reduced to improve production efficiency, the strength of the dry film will deteriorate and the partition will break during sandblasting, or the adhesion between the partition and the substrate or dry film resist will decrease. Problems such as missing partition walls occur.

Therefore, in order to prevent the decrease in sandblasting property while maintaining the adhesion and film strength with the substrate and the dry film resist, and to improve the production efficiency, a cellulose resin and a butyral resin as shown in Patent Document 1 are included. A partition-forming glass paste using an organic resin has been proposed.
JP 2003-257322 A

  By the way, in recent years, in order to further improve the production efficiency, the paste applied to the glass substrate tends to be dried at a high temperature in a short time.

However, in order to apply a partition-forming glass paste using an organic resin containing a cellulose-based resin and a butyral resin as disclosed in Patent Document 1 on a glass substrate, and to dry the applied paste in a short time 200 When dried at a temperature of about 0 ° C., the organic resin in the paste is oxidized and decomposed by the heat of the drying process (specifically, oxidation of cellulose resin or butyral resin, reduction of hydrocarbons caused by hydroxylation, CO ₂ , Decomposition due to H ₂ O conversion, decomposition accompanied by elimination of butyral groups), and the resulting dry film may have reduced adhesion to the substrate or dry film resist, film strength, and sandblasting.

  The purpose of the present invention is to dry the paste applied on the glass substrate in a short time, so that even if it is dried at a high temperature, the adhesion to the substrate and the dry film resist and the film strength are maintained while the sandblasting property is lowered. An object of the present invention is to provide a partition wall forming glass paste capable of obtaining a dry film that can be prevented.

  The partition wall forming glass paste of the present invention is a partition wall forming glass paste used for forming a partition wall of a plasma display using an organic resin containing a cellulose resin and a butyral resin in a total amount of 1 to 5% by mass. Further, it contains an antioxidant.

  Moreover, the glass paste for partition formation of this invention is characterized by the content of antioxidant being 1-10000 ppm in mass parts per million.

  Further, the partition wall forming glass paste of the present invention is characterized in that the antioxidant is any one or more of phosphorus-based, phenol-based and sulfur-based organic compounds.

  Moreover, the glass paste for partition formation of this invention is characterized by the usage-ratio of a cellulose resin and a butyral resin being 90: 10-40: 60 by mass ratio.

  The partition wall forming glass paste of the present invention is characterized in that the cellulose resin is ethyl cellulose.

  Further, the partition wall forming glass paste of the present invention is characterized in that the butyral resin has a mass average molecular weight (Mw) of 10,000 to 80,000.

  Moreover, the glass paste for partition wall formation of this invention is a mass percentage, and is 50-80% of glass powder, 3-30% of inorganic filler powder, 1-5% of organic resin, 5-30% of solvent, 1-10,000 ppm of antioxidant. It is the ratio of this.

  The partition wall forming glass paste of the present invention is obtained because the paste applied on the glass substrate is dried in a short time, so that the oxidative decomposition reaction of the organic resin hardly occurs even when dried at a temperature of about 200 ° C. The resulting dry film has high adhesion to the substrate and the dry film resist, and can prevent a decrease in sandblasting properties while maintaining the strength of the dry film. Moreover, the drying time of the paste applied on the glass substrate can be shortened, and the production efficiency can be improved. Therefore, it is suitable as a glass paste for forming a partition wall of a plasma display.

Since the partition wall-forming glass paste of the present invention contains an antioxidant, a paste using an organic resin containing a cellulosic resin and a butyral resin is applied on a glass substrate and dried at a high temperature. Oxidation and decomposition of organic resin due to heat in drying process (specifically, oxidation of cellulose resin and butyral resin, reduction of hydrocarbons caused by hydroxylation, decomposition due to CO ₂ and H ₂ O conversion, elimination of butyral group) Accompanying decomposition) can be suppressed. Therefore, the obtained dry film has high adhesion to the substrate and the dry film resist, and can prevent a decrease in sandblasting properties while maintaining the film strength. Moreover, the drying time of the paste applied on the glass substrate can be shortened, and the production efficiency can be improved.

  As content of antioxidant, it is preferable that it is 1-10000 ppm in mass parts per million. If the antioxidant is 1 ppm or more, in order to dry the paste applied on the glass substrate in a short time, even if it is dried at a temperature of about 200 ° C., the oxidation and decomposition of the organic resin due to the heat of the drying process is prevented. It becomes possible to do. Moreover, if it is 10000 ppm or less, when baking a dry film at the temperature of 500-600 degreeC, decomposition | disassembly of the organic substance of an organic resin, a solvent, and antioxidant will be completed, and these organic substance residue (carbide) will be suppressed to a small quantity. It becomes possible. The preferable range of the antioxidant is 5 to 6000 ppm.

  In addition, the antioxidant as used in the field of this invention means what has an effect which suppresses that an organic resin and oxygen couple | bond together and an organic resin decomposes | disassembles when drying the paste apply | coated on the glass substrate.

  As the antioxidant used in the present invention, it is preferable to use at least one of phosphorus-based, phenol-based and sulfur-based organic compounds.

  When a phosphorous organic compound is used as an antioxidant, triphenyl phosphate, tris (2,4-di-t-butylphenyl) phosphite, or the like can be used.

  When a phenolic organic compound is used as an antioxidant, 2,6-di-t-butyl-P-cresol, 4,4′-thiobis- (6-t-butyl-3-methylphenol), tetrakis [Methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane, triethylene glycol bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate] N-octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate and the like can be used.

  Moreover, when using a sulfur type organic compound as antioxidant, dilauryl thiodipropionate, distearyl thiodipropionate, ditridecyl thiodipropionate, etc. can be used.

  In order to reduce the residue of the organic resin, the solvent and the antioxidant generated when the dried film is fired, it is desirable to use a phenolic organic compound. In the drying process of the paste, the oxidation and decomposition of the organic resin can be suppressed. In the baking process of the dry film, the decomposition of the organic substance is completed, and the molecular weight of the antioxidant is 200 to 1000 in order to reduce the residue. It is desirable to use (preferably 200 to 800).

  The partition wall-forming glass paste of the present invention contains glass powder, filler powder, organic resin and solvent as main components in addition to the above-mentioned antioxidant. Hereinafter, each component will be described.

The glass powder used in the present invention is not limited as long as it has a thermal expansion coefficient of 60 to 90 × 10 ⁻⁷ / ° C. (30 to 300 ° C.) and a softening point of 480 to 630 ° C., It is desirable to use PbO—B ₂ O ₃ —SiO ₂ type, BaO—ZnO—B ₂ O ₃ —SiO ₂ type, or ZnO—Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ type glass.

The PbO-B ₂ O ₃ -SiO ₂ based glass, in percent by _{mass, PbO 35~75%, B 2 O} 3 0~50%, SiO 2 8~30%, Al 2 O 3 0~10%, ZnO Glass having a composition of 0 to 10%, CaO + MgO + SrO + BaO 0 to 10%, SnO ₂ + TiO ₂ + ZrO ₂ 0 to 6% can be used.

The _{BaO-ZnO-B 2 O 3} -SiO 2 based glass, in mass percentage, have BaO 20~50%, 25~50% ZnO, B 2 O 3 10~35%, a composition of SiO2 0% Glass, BaO 0-25%, ZnO 15-60%, B ₂ O ₃ 15-35%, SiO ₂ 3-30%, Al ₂ O ₃ 0-20%, Li ₂ O + Na ₂ O + K ₂ O 1-15 % Glass composition can be used.

ZnO—Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ -based glass has a mass percentage of ZnO 25-45%, Bi ₂ O ₃ 15-40%, B ₂ O ₃ 10-30%, SiO ₂ Glass having a composition of 0.5-10%, CaO + MgO + SrO + BaO 0-24% can be used.

  The content of the glass powder is preferably 50 to 80% by mass. If the glass powder is 50% or more, a dense fired layer can be obtained. Moreover, if it is 80% or less, it can be paste-ized and it becomes possible to reduce the deformation | transformation at the time of baking.

The particle size distribution of the glass powder, 1 to 7 [mu] m 50% average particle diameter (D _50), and it is desirable to the maximum particle diameter (D _max) to 5 to 30 [mu] m. That is, when D ₅₀ is 1 μm or more and D _max is 5 μm or more, the shape maintenance of the partition wall is good, and when D ₅₀ is 7 μm or less and D _max is 30 μm or less, the sinterability is high. It becomes easy to obtain a dense partition.

  The inorganic filler powder used in the present invention comprises one or more selected from quartz glass, α-quartz, alumina, titania (rutile, anatase type), zirconia, inorganic pigment, zircon and the like. In particular, when a silica-based material such as α-quartz is used, the partition walls can have a low dielectric constant, and power consumption can be reduced. Moreover, in order to improve the mechanical strength of a partition, you may make a part or all of a filler a spherical filler.

When PbO—B ₂ O ₃ —SiO ₂ glass is used as the glass powder, alumina is used as the inorganic filler powder, and BaO—ZnO—B ₂ O ₃ —SiO ₂ glass or ZnO— is used as the glass powder. When Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass is used, a fired film having excellent permeability can be obtained by using mullite as the inorganic filler powder.

  The content of the inorganic filler powder is preferably 3 to 30% by mass. If filler powder is 3% or more, sufficient intensity | strength and shape of the partition after baking can be maintained. If it is 30% or less, the glass can be sintered and sufficient strength can be obtained after firing.

The particle size distribution of the inorganic filler powder is desirably 0.5 to 8 μm in average particle diameter (D ₅₀ ) and 5 to 30 μm in maximum particle diameter (D _max ). That is, when D ₅₀ is 0.5 μm or more and D _max is 5 μm or more, the viscosity of the paste and the strength during sintering are good, and when D ₅₀ is 8 μm or less and D _max is 30 μm or less, firing is performed. The front and back surface roughness is smooth, and when combined with the front plate, the front plate is less likely to break, which is good.

  It is important that the organic resin used in the present invention is a cellulosic resin and a butyral resin in combination, and the total content thereof is in the range of 1 to 5% by mass. If the organic resin is lower than 1%, the strength of the dry film becomes too weak to form partition walls, and if it exceeds 5%, the strength of the dry film becomes too strong and the sand blasting property is lowered, resulting in production efficiency. This causes a problem of lowering. A preferable range of the organic solvent is 1.2 to 3.6% by mass.

  Moreover, it is preferable that the usage-ratio of a cellulose resin and a butyral resin shall be the range of 90: 10-40: 60 by mass ratio. When the cellulose-based resin increases, the dry film strength of the partition walls tends to decrease or the adhesion to the glass substrate or the dry film resist tends to decrease. When the butyral-based resin increases, the sand blasting property decreases and the production efficiency increases. Although both tend to decrease, if both are within this range, moderate blasting properties and the like can be obtained. A more preferable use ratio of the cellulosic resin and the butyral resin is 88:12 to 50:50.

  The cellulose resin has an effect of improving the strength of the dry film and the adhesion between the substrate and the dry film resist. As the cellulose-based resin, ethyl cellulose, hydroxyethyl cellulose, methyl cellulose, carboxymethyl cellulose and the like can be used. In particular, ethyl cellulose is preferable because it has paste characteristics suitable for printing and coater when the partition wall material layer is formed.

  Moreover, butyral resin has an important role in ensuring the adhesion between the substrate and the dry film resist. The effect is effectively exhibited by coexisting with the cellulosic resin. In order to further improve the adhesion to a glass substrate or a dry film, and to obtain an appropriate dry film strength, flexibility and high smoothness, the butyral resin has a mass average molecular weight (Mw) of 10,000 to 80000. It is desirable to use those. Furthermore, in order to improve the adhesion to a glass substrate or a dry film, it is desirable to use one having a polymerization degree of 200 to 1000 and a butyralization degree of 65 to 80 mol% (preferably 70 to 80 mol%).

  The solvent used in the present invention is a material for pasting the material, and its content is generally about 5 to 30% by mass. As the solvent, terpineol, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate or the like can be used alone or in combination.

  The viscosity of the resulting paste is in the range of 100 to 1200 poise as measured at 23 ° C. and a shear rate of 5.7 / sec from the viewpoint of paste storage and printability. It is desirable to adjust.

  In order to form a plasma display partition using the paste of the present invention composed of the above materials, first, the paste is directly applied to the back substrate by using a screen printing method or a batch coating method, or address electrode protection is performed. Application via a dielectric layer for forming a coating layer having a predetermined film thickness, followed by drying. Next, a resist film is formed, exposed and developed. Subsequently, unnecessary portions are removed by a sand blasting method, followed by baking. In this way, a partition having a predetermined shape can be obtained.

  Hereinafter, the present invention will be described based on examples.

  Tables 1 to 7 show examples (samples Nos. 1 to 14) and comparative examples (samples Nos. 15 to 19) of the present invention. Sample No. For comparison, the organic resin in the paste was dried under a temperature condition that does not cause an oxidation reaction.

First of all, various compositions having a mass% of BaO 12%, ZnO 50%, B ₂ O ₃ 20%, SiO ₂ 12%, Li ₂ O 1%, Na ₂ O 4%, K ₂ O 1%. After the oxide raw materials were prepared and mixed uniformly, they were put in a platinum crucible and melted at 1250 ° C. for 2 hours to obtain a uniform glass body. This was pulverized and classified with an alumina ball mill to obtain a glass powder having an average particle diameter D ₅₀ of 3 μm and D _max of 20 μm.

The glass had a softening point of 550 ° C. and a linear expansion coefficient of 75.0 × 10 ⁻⁷ / ° C. The particle size distribution of the glass powder was measured with SALD-2000J manufactured by Shimadzu Corporation. The maximum particle diameter _Dmax was determined as a value when the integrated value was 99.9%. For the refractive index used to calculate the value of the particle size distribution, 1.75 for the real part and 0.05i for the imaginary part were used.

Next, glass powder, filler powder, organic resin, solvent and antioxidant were mixed at the ratio shown in the table, and kneaded uniformly with a three-roll mill. As filler powders, α-quartz powder (D ₅₀ 1.5 μm, D _max 10 μm), mullite powder (D ₅₀ 2.0 μm, D _max 15 μm) and alumina powder (D ₅₀ 3.5 μm, D _max 15 μm) are used. Using. Ethyl cellulose was used as the cellulose resin. As the butyral resin, those having a degree of polymerization of about 300, a degree of butyralization of 75 mol%, and a mass average molecular weight measured by liquid chromatography shown in the table were used. Turpineol was used as the solvent.

  A partition wall was formed using the obtained partition wall forming paste. First, each paste sample was apply | coated to the glass plate so that paste thickness might be set to 400 micrometers with an applicator. Subsequently, the paste was leveled in a dryer at 50 ° C. and dried in an IR furnace at 200 ° C. for 20 minutes (sample No. 19 only, dried at 150 ° C. for 30 minutes) to obtain a film thickness of about 180 μm. Two substrates having the partition wall material layer were prepared.

  One substrate was used for sandblasting evaluation as it was after observing the surface state of the dry film.

  The other substrate was laminated with a dry film resist (trade name: Odile S8040) manufactured by Tokyo Ohka Co., Ltd., and exposed with a negative light-shielding film (photosensitive line 40-200 μm wide, L / S 1/2). Thereafter, development with 0.5% sodium carbonate solution and washing with water were carried out, unnecessary portions of the dry film resist were removed, and adhesion between the dry film and the dry film resist was evaluated.

  Further, the sample after evaluating the adhesion to the dry film resist was removed by sand blasting to remove the portion not covered with the resist to form a partition wall shape, and then immersed in a 1% caustic soda solution to form the dry film resist. After peeling and removing, the film was washed with water in a shower, and the adhesion between the partition wall-like dry film and the glass substrate was evaluated.

  Moreover, the sample after adhesiveness evaluation with a glass substrate was baked at 550 degreeC for 10 minute (s), the partition was produced, and the coloring of the state of a partition and a baking film (partition) was evaluated.

  As described above, each sample was evaluated for the surface state of the dry film, the sandblasting property, the adhesion between the dry film and the substrate, the state of the partition walls, and the coloring of the fired film. The results are shown in each table.

  As is apparent from the table, sample No. which is an example of the present invention is shown. In Nos. 1 to 14, the number of dents in the dry film was as small as 10 or less, and the surface was smooth. Moreover, the grinding depth which shows sandblasting property was appropriate with 93-130 micrometers. Moreover, the width | variety of the dry film resist which remained on the dry film after developing a dry film resist was 80 micrometers or less, and adhesiveness with a dry film was favorable. Moreover, the defect rate of the partition walls after removing the dry film resist film was as low as 10% or less, and the adhesion to the glass substrate was also good. Furthermore, the partition walls obtained by firing did not show chipping or the like due to blasting, and had a good partition shape. In addition, regarding the coloring of the fired film, the L * value was as high as 85 or more, and the white fired film was obtained with little coloring due to organic residues. Sample No. For No. 8, the antioxidant content is as high as 11000 ppm. For No. 14, since the molecular weight of the antioxidant was as large as 1178, the grinding depth showing sandblasting was small compared to other samples, and the L * value of the fired film was low. Sample No. For No. 9, the ratio of butyral resin in the organic resin is low, and For No. 11, the molecular weight of the butyral resin was as small as 9000. For No. 13, since the molecular weight of the antioxidant was small, the adhesion to a dry film or a glass substrate was inferior to other samples. Furthermore, sample no. For No. 10, the ratio of butyral resin in the organic resin is high. For No. 12, since the molecular weight of the butyral resin was as large as 90000, the number of dents in the dry film was larger than in other samples, and the grinding depth showing sandblasting was small.

  On the other hand, sample No. which is a comparative example. In Nos. 15, 17 and 18, the width of the dry film resist remaining on the dry film after developing the dry film resist is as large as 150 μm or more, and the defect rate of the partition walls after removing the dry film resist film is 13%. As described above, there was a problem in adhesion to a dry film or a glass substrate. Furthermore, the blast chipping was confirmed in the partition walls obtained by firing. Sample No. For No. 15, the grinding depth showing sandblasting properties was as large as 190 μm, and there was a problem with sandblasting properties.

  Sample No. No. 16 had a small sanding blasting depth of 65 μm and had a problem with sand blasting.

  Furthermore, sample no. No. 19 has no problem with sandblasting, adhesion to a glass substrate or dry film, the state and appearance of the partition walls obtained by firing, but it takes a long time to dry the paste applied on the glass substrate. Is low.

  Each evaluation was performed as follows.

The surface condition of the dried film is as follows. The surface of the dried film is illuminated from the side, and the surface (100 cm ² range) is observed with a stereomicroscope (10 times). I counted. The smaller the number, the smoother the surface and the better the surface state. Specifically, when the number is 10 or less, it can be said that the surface state is good.

  The sand blasting property was measured by sandblasting with a calcium carbonate powder (S4 # 600) for 90 seconds using a sandblasting machine pneumatic blaster manufactured by Fuji Seisakusho. If this value is about 85-140 micrometers, it can be said that sandblasting property is favorable.

  For the adhesion to the dry film, the width of the dry film resist remaining after development was measured. The narrower the width of the dry film resist, the higher the adhesiveness. Specifically, it can be said that the adhesiveness to the dry film is high if it is 80 μm or less.

  Further, for adhesion to the glass substrate, the glass substrate after the dry film resist film was peeled off was visually observed to confirm the presence or absence of defects in 100 partition wall-shaped dry films having a width of 80 μm and a length of 80 mm. The number of dry films lost per book was evaluated as the partition wall defect rate. The lower the partition defect rate, the higher the adhesion to the glass substrate. Specifically, if the partition defect rate is 10% or less, it can be said that the adhesion to the glass substrate is high.

  The state of the partition wall is the surface of the partition wall after firing was observed with a stereomicroscope (20 times), and the cross-sectional shape became a drum shape due to chipping or over-sand (excess sand blasting causes the center of the rib to be excessively shaved). The state) was observed. When these were not recognized, it was shown as ◯ and those recognized as x.

  The coloration of the partition walls was evaluated by measuring the L * value (brightness) of the fired film with a color difference meter. The larger the L * value, the less organic residue, indicating that a white fired film is obtained. Specifically, if the L * value is 85 or more (preferably 88 or more), the organic matter It can be said that it is a white fired film without black coloring due to the residue.

It is explanatory drawing which shows the structure of a plasma display panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Front glass substrate 2 Back glass substrate 3 Partition 4 Transparent electrode 5 Dielectric layer 6 Protective layer 7 Data electrode 8 Phosphor

Claims (7)

  A glass paste for forming a partition wall used for forming a partition wall of a plasma display using an organic resin containing a cellulose resin and a butyral resin in a total amount of 1 to 5% by mass, which contains an antioxidant. A glass paste for forming partition walls.   The partition forming glass paste according to claim 1, wherein the content of the antioxidant is 1 to 10,000 ppm in terms of parts per million by mass.   The partition forming glass paste according to claim 1, wherein the antioxidant is at least one of phosphorous, phenolic and sulfur organic compounds.   The partition wall-forming glass paste according to claim 1, wherein the ratio of the cellulose-based resin and the butyral resin used is 90:10 to 40:60 by mass ratio.   2. The partition wall forming glass paste according to claim 1, wherein the cellulosic resin is ethyl cellulose.   The partition-forming glass paste according to claim 1, wherein the butyral resin has a mass average molecular weight (Mw) of 10,000 to 80,000.   The glass powder is 50 to 80%, the inorganic filler powder is 3 to 30%, the organic resin is 1 to 5%, the solvent is 5 to 30%, and the antioxidant is 1 to 10000 ppm by mass percentage. The glass paste for barrier rib formation of description.