JP2007221000A5 - - Google Patents

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Publication number
JP2007221000A5
JP2007221000A5 JP2006041424A JP2006041424A JP2007221000A5 JP 2007221000 A5 JP2007221000 A5 JP 2007221000A5 JP 2006041424 A JP2006041424 A JP 2006041424A JP 2006041424 A JP2006041424 A JP 2006041424A JP 2007221000 A5 JP2007221000 A5 JP 2007221000A5
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JP
Japan
Prior art keywords
substrate
processing
substrates
holding
gas
Prior art date
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Granted
Application number
JP2006041424A
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English (en)
Japanese (ja)
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JP4895634B2 (ja
JP2007221000A (ja
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Priority to JP2006041424A priority Critical patent/JP4895634B2/ja
Priority claimed from JP2006041424A external-priority patent/JP4895634B2/ja
Publication of JP2007221000A publication Critical patent/JP2007221000A/ja
Publication of JP2007221000A5 publication Critical patent/JP2007221000A5/ja
Application granted granted Critical
Publication of JP4895634B2 publication Critical patent/JP4895634B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2006041424A 2006-02-17 2006-02-17 基板処理装置 Expired - Lifetime JP4895634B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006041424A JP4895634B2 (ja) 2006-02-17 2006-02-17 基板処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006041424A JP4895634B2 (ja) 2006-02-17 2006-02-17 基板処理装置

Publications (3)

Publication Number Publication Date
JP2007221000A JP2007221000A (ja) 2007-08-30
JP2007221000A5 true JP2007221000A5 (https=) 2009-03-19
JP4895634B2 JP4895634B2 (ja) 2012-03-14

Family

ID=38497923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006041424A Expired - Lifetime JP4895634B2 (ja) 2006-02-17 2006-02-17 基板処理装置

Country Status (1)

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JP (1) JP4895634B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5545055B2 (ja) * 2010-06-15 2014-07-09 東京エレクトロン株式会社 支持体構造及び処理装置
JP6458547B2 (ja) * 2015-02-24 2019-01-30 株式会社デンソー シャワーヘッド、シャワーヘッドシステム、及び成膜装置
CN108695138A (zh) * 2017-03-29 2018-10-23 株式会社日立国际电气 衬底支承件、衬底处理装置及半导体器件的制造方法
TWI806261B (zh) * 2020-12-24 2023-06-21 日商國際電氣股份有限公司 基板處理方法、半導體裝置之製造方法、基板處理裝置及程式
KR20260037195A (ko) * 2024-09-10 2026-03-17 주식회사 유진테크 배치식 기판 처리 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102524A (ja) * 1988-10-11 1990-04-16 Nec Corp ウェハーボート
JP3023977B2 (ja) * 1990-11-01 2000-03-21 東京エレクトロン株式会社 縦型熱処理装置
JPH0737814A (ja) * 1993-07-23 1995-02-07 Sony Corp 薄膜形成装置

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