JP2007186779A - Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造 - Google Patents

Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造 Download PDF

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Publication number
JP2007186779A
JP2007186779A JP2006230512A JP2006230512A JP2007186779A JP 2007186779 A JP2007186779 A JP 2007186779A JP 2006230512 A JP2006230512 A JP 2006230512A JP 2006230512 A JP2006230512 A JP 2006230512A JP 2007186779 A JP2007186779 A JP 2007186779A
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JP
Japan
Prior art keywords
layer
wiring material
semiconductor layer
alloy
wiring circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006230512A
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English (en)
Japanese (ja)
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JP2007186779A6 (ja
JP2007186779A5 (https=
Inventor
Hironari Urabe
宏成 占部
Yoshinori Matsuura
宜範 松浦
Takashi Kubota
高史 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2006230512A priority Critical patent/JP2007186779A/ja
Publication of JP2007186779A publication Critical patent/JP2007186779A/ja
Publication of JP2007186779A6 publication Critical patent/JP2007186779A6/ja
Publication of JP2007186779A5 publication Critical patent/JP2007186779A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium

Landscapes

  • Conductive Materials (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2006230512A 2005-04-26 2006-08-28 Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造 Pending JP2007186779A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006230512A JP2007186779A (ja) 2005-04-26 2006-08-28 Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2005128670 2005-04-26
JP2005128670 2005-04-26
JP2007508669 2005-08-30
JP2007508669 2005-08-30
JP2005302900 2005-10-18
JP2005302900 2005-10-18
JP2006230512A JP2007186779A (ja) 2005-04-26 2006-08-28 Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006093701A Division JP3979605B2 (ja) 2005-04-26 2006-03-30 Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造

Publications (3)

Publication Number Publication Date
JP2007186779A true JP2007186779A (ja) 2007-07-26
JP2007186779A6 JP2007186779A6 (ja) 2007-10-25
JP2007186779A5 JP2007186779A5 (https=) 2008-10-02

Family

ID=38342143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006230512A Pending JP2007186779A (ja) 2005-04-26 2006-08-28 Ａｌ−Ｎｉ−Ｂ合金配線材料及びそれを用いた素子構造

Country Status (1)

Country Link
JP (1) JP2007186779A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013133500A (ja) * 2011-12-27 2013-07-08 Tdk Corp 電極焼結体、積層電子部品、内部電極ペースト、電極焼結体の製造方法、積層電子部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294556A (ja) * 1999-04-05 2000-10-20 Hitachi Metals Ltd ドライエッチング性に優れたＡｌ合金配線膜およびＡｌ合金配線膜形成用ターゲット
JP2001053024A (ja) * 1999-08-11 2001-02-23 Hitachi Metals Ltd Ａｌ合金電極膜およびスパッタリング用ターゲット
JP2004214606A (ja) * 2002-12-19 2004-07-29 Kobe Steel Ltd 表示デバイスおよびその製法、ならびにスパッタリングターゲット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294556A (ja) * 1999-04-05 2000-10-20 Hitachi Metals Ltd ドライエッチング性に優れたＡｌ合金配線膜およびＡｌ合金配線膜形成用ターゲット
JP2001053024A (ja) * 1999-08-11 2001-02-23 Hitachi Metals Ltd Ａｌ合金電極膜およびスパッタリング用ターゲット
JP2004214606A (ja) * 2002-12-19 2004-07-29 Kobe Steel Ltd 表示デバイスおよびその製法、ならびにスパッタリングターゲット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013133500A (ja) * 2011-12-27 2013-07-08 Tdk Corp 電極焼結体、積層電子部品、内部電極ペースト、電極焼結体の製造方法、積層電子部品の製造方法

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