JP2007180077A5 - - Google Patents

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Publication number
JP2007180077A5
JP2007180077A5 JP2005373734A JP2005373734A JP2007180077A5 JP 2007180077 A5 JP2007180077 A5 JP 2007180077A5 JP 2005373734 A JP2005373734 A JP 2005373734A JP 2005373734 A JP2005373734 A JP 2005373734A JP 2007180077 A5 JP2007180077 A5 JP 2007180077A5
Authority
JP
Japan
Prior art keywords
electrode
tab
leads
lead
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005373734A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180077A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005373734A priority Critical patent/JP2007180077A/ja
Priority claimed from JP2005373734A external-priority patent/JP2007180077A/ja
Publication of JP2007180077A publication Critical patent/JP2007180077A/ja
Publication of JP2007180077A5 publication Critical patent/JP2007180077A5/ja
Pending legal-status Critical Current

Links

JP2005373734A 2005-12-27 2005-12-27 半導体装置 Pending JP2007180077A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005373734A JP2007180077A (ja) 2005-12-27 2005-12-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005373734A JP2007180077A (ja) 2005-12-27 2005-12-27 半導体装置

Publications (2)

Publication Number Publication Date
JP2007180077A JP2007180077A (ja) 2007-07-12
JP2007180077A5 true JP2007180077A5 (https=) 2009-02-12

Family

ID=38305004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005373734A Pending JP2007180077A (ja) 2005-12-27 2005-12-27 半導体装置

Country Status (1)

Country Link
JP (1) JP2007180077A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5155644B2 (ja) * 2007-07-19 2013-03-06 ルネサスエレクトロニクス株式会社 半導体装置
JP5130566B2 (ja) * 2008-07-01 2013-01-30 ルネサスエレクトロニクス株式会社 半導体装置
JP5404083B2 (ja) * 2009-02-10 2014-01-29 株式会社東芝 半導体装置
JP5237900B2 (ja) * 2009-08-11 2013-07-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6164895B2 (ja) * 2013-04-02 2017-07-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3154579B2 (ja) * 1993-02-23 2001-04-09 三菱電機株式会社 半導体素子搭載用のリードフレーム
JP4357344B2 (ja) * 2004-04-16 2009-11-04 株式会社ルネサステクノロジ 半導体装置

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