JP2007134705A5 - - Google Patents
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- Publication number
- JP2007134705A5 JP2007134705A5 JP2006299177A JP2006299177A JP2007134705A5 JP 2007134705 A5 JP2007134705 A5 JP 2007134705A5 JP 2006299177 A JP2006299177 A JP 2006299177A JP 2006299177 A JP2006299177 A JP 2006299177A JP 2007134705 A5 JP2007134705 A5 JP 2007134705A5
- Authority
- JP
- Japan
- Prior art keywords
- contact hole
- region
- forming
- silicidation
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 238000004519 manufacturing process Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 10
- 229910021332 silicide Inorganic materials 0.000 claims 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 6
- 239000012535 impurity Substances 0.000 claims 2
- 238000005468 ion implantation Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050106099A KR100735522B1 (ko) | 2005-11-07 | 2005-11-07 | 반도체 소자의 제조 방법 및 그에 의해 제조된 반도체 소자 |
| US11/355,112 US7662716B2 (en) | 2005-11-07 | 2006-02-14 | Method for forming silicide contacts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007134705A JP2007134705A (ja) | 2007-05-31 |
| JP2007134705A5 true JP2007134705A5 (OSRAM) | 2009-12-17 |
Family
ID=38156058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006299177A Pending JP2007134705A (ja) | 2005-11-07 | 2006-11-02 | 半導体素子及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007134705A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8803245B2 (en) | 2008-06-30 | 2014-08-12 | Mcafee, Inc. | Method of forming stacked trench contacts and structures formed thereby |
| JP2024062790A (ja) * | 2022-10-25 | 2024-05-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1167688A (ja) * | 1997-08-22 | 1999-03-09 | Nec Corp | シリサイド材料とその薄膜およびシリサイド薄膜の製造方法 |
| JP2002261161A (ja) * | 2001-03-05 | 2002-09-13 | Hitachi Ltd | 半導体装置の製造方法 |
| KR100493411B1 (ko) * | 2001-06-12 | 2005-06-07 | 주식회사 하이닉스반도체 | 반도체 소자의 셀 플러그 형성방법 |
| JP2003142608A (ja) * | 2001-11-08 | 2003-05-16 | Mitsubishi Electric Corp | 半導体記憶装置およびその製造方法 |
-
2006
- 2006-11-02 JP JP2006299177A patent/JP2007134705A/ja active Pending
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