JP2007134404A5 - - Google Patents

Download PDF

Info

Publication number
JP2007134404A5
JP2007134404A5 JP2005323684A JP2005323684A JP2007134404A5 JP 2007134404 A5 JP2007134404 A5 JP 2007134404A5 JP 2005323684 A JP2005323684 A JP 2005323684A JP 2005323684 A JP2005323684 A JP 2005323684A JP 2007134404 A5 JP2007134404 A5 JP 2007134404A5
Authority
JP
Japan
Prior art keywords
electronic component
adhesive layer
mounting structure
component mounting
resist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005323684A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007134404A (ja
JP4555211B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005323684A priority Critical patent/JP4555211B2/ja
Priority claimed from JP2005323684A external-priority patent/JP4555211B2/ja
Priority to CNB2006101445262A priority patent/CN100553403C/zh
Publication of JP2007134404A publication Critical patent/JP2007134404A/ja
Publication of JP2007134404A5 publication Critical patent/JP2007134404A5/ja
Application granted granted Critical
Publication of JP4555211B2 publication Critical patent/JP4555211B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005323684A 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法 Expired - Fee Related JP4555211B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法
CNB2006101445262A CN100553403C (zh) 2005-11-08 2006-11-08 电子部件安装组件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323684A JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007134404A JP2007134404A (ja) 2007-05-31
JP2007134404A5 true JP2007134404A5 (ko) 2007-11-22
JP4555211B2 JP4555211B2 (ja) 2010-09-29

Family

ID=38083414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005323684A Expired - Fee Related JP4555211B2 (ja) 2005-11-08 2005-11-08 電子部品実装構造及びその製造方法

Country Status (2)

Country Link
JP (1) JP4555211B2 (ko)
CN (1) CN100553403C (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104557A (ja) * 2010-11-08 2012-05-31 Ngk Spark Plug Co Ltd 電子部品付き配線基板及びその製造方法
US9237686B2 (en) 2012-08-10 2016-01-12 Panasonic Intellectual Property Management Co., Ltd. Method and system for producing component mounting board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111894A (ja) * 1997-10-02 1999-04-23 Fujitsu Ltd フリップチップ実装用基板
JPH11186334A (ja) * 1997-12-25 1999-07-09 Toshiba Corp 半導体実装装置及びその製造方法及び異方性導電材料

Similar Documents

Publication Publication Date Title
JP2007048976A5 (ko)
JP2009501442A5 (ko)
JP2009302227A5 (ko)
JP2007194598A5 (ko)
JP2009135470A5 (ko)
US20070114674A1 (en) Hybrid solder pad
JP2007012850A5 (ko)
WO2006127669A3 (en) Integrated circuit die attach using backside heat spreader
JP2006517348A5 (ko)
TWI429043B (zh) 電路板結構、封裝結構與製作電路板的方法
JP2008311520A5 (ko)
JP2007019267A5 (ko)
JP2007134404A5 (ko)
JP2007134402A5 (ko)
JP2007294735A5 (ko)
JP2005340448A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP2010098077A (ja) 回路モジュールの製造方法
JP2006073953A (ja) 半導体装置および半導体装置の製造方法
JP2007134402A (ja) 電子部品実装構造
JP2006332246A5 (ko)
JP2016163020A (ja) 基板接続構造
KR20150092882A (ko) 인쇄회로기판, 이를 포함하는 패키지 기판 및 이의 제조 방법
WO2011034137A1 (ja) 電子部品内蔵モジュール
JP2015012091A (ja) 回路基板、回路モジュール、回路基板の製造方法及び回路モジュールの製造方法
JP4015050B2 (ja) 電子回路ユニットの製造方法