JP2007123552A - Manufacturing method for etching foil for electrolytic capacitor - Google Patents

Manufacturing method for etching foil for electrolytic capacitor Download PDF

Info

Publication number
JP2007123552A
JP2007123552A JP2005313665A JP2005313665A JP2007123552A JP 2007123552 A JP2007123552 A JP 2007123552A JP 2005313665 A JP2005313665 A JP 2005313665A JP 2005313665 A JP2005313665 A JP 2005313665A JP 2007123552 A JP2007123552 A JP 2007123552A
Authority
JP
Japan
Prior art keywords
time
etching
waveform
current value
ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005313665A
Other languages
Japanese (ja)
Inventor
Akira Ishii
陽 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichicon Corp
Original Assignee
Nichicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichicon Corp filed Critical Nichicon Corp
Priority to JP2005313665A priority Critical patent/JP2007123552A/en
Publication of JP2007123552A publication Critical patent/JP2007123552A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To equalize the generation of a pit in the case of etching, to expand the effective surface area of an electrode foil, and to improve an electrostatic capacity. <P>SOLUTION: In a manufacturing method for an etching foil for an electrolytic capacitor, an aluminum foil is passed between a pair of electrodes in an aqueous solution mixing at least one kind in phosphoric acid, nitric acid, sulfuric acid, and oxalic acid in a hydrochloric-acid aqueous solution; and an AC current is applied. In the manufacturing method for the etching foil for the electrolytic capacitor, a waveform for the positive half period of the AC current contains a section largely lowering from the case of a peak and the section rising or lowering constantly or slowly, from a time immediately after the completion of the lowering to the time of the completion of the half period. In the manufacturing method for the etching foil for the electrolytic capacitor, the ratio of a current value is 0.2 to 0.7 in the case of the completion of the lowering to the current value in the case of the peak, the ratio of the current value is 0.7 to 1.2 in the case of the completion of the subsequent half period to the current value immediately after the completion of the lowering, the ratio of the time is 0.1 to 0.7 from the case of the start of the half period to the case of the peak to a half-period time, and the ratio of the time is ≤0.4 from the time of the peak to the time of the completion of the lowering to the half-period time. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電解コンデンサ用アルミニウム電極箔のエッチング箔の製造方法に関するものである。   The present invention relates to a method for producing an etching foil for an aluminum electrode foil for electrolytic capacitors.

電解コンデンサ用アルミニウム箔は、一般に陽極用、陰極用ともエッチング工程にてその表面を粗面化し、表面積を拡大して用いられる。
エッチング液としては、アルミニウムを溶解させるため、塩酸水溶液にリン酸、硝酸、硫酸、シュウ酸等を混合したものが用いられる。
The aluminum foil for electrolytic capacitors is generally used by roughening the surface in an etching process for both the anode and cathode and expanding the surface area.
As an etchant, a solution in which phosphoric acid, nitric acid, sulfuric acid, oxalic acid, or the like is mixed with an aqueous hydrochloric acid solution is used to dissolve aluminum.

電解コンデンサ用エッチング箔は、上記の塩酸等を含む水溶液中で、アルミニウム箔を一対の電極間に通過させて、交流電流を印加する方法が用いられている。
その印加する交流電流の波形(以下、波形という)は、正弦波形や三角波形、矩形波形等の標準波形の他、これらを変形した波形が用いられている(例えば、特許文献1、2、非特許文献1参照)。
特開2003−86468号公報 特開平06−272097号公報 アルミニウム、第2巻、第4号(1995)、P136
As the electrolytic capacitor etching foil, a method is used in which an alternating current is applied by passing an aluminum foil between a pair of electrodes in an aqueous solution containing hydrochloric acid or the like.
As a waveform of the alternating current to be applied (hereinafter, referred to as a waveform), a standard waveform such as a sine waveform, a triangular waveform, or a rectangular waveform, or a waveform obtained by modifying these waveforms is used (for example, Patent Documents 1 and 2, (See Patent Document 1).
JP 2003-86468 A Japanese Patent Laid-Open No. 06-272097 Aluminum, Vol. 2, No. 4 (1995), P136

近年、電解コンデンサの小形化の要求はますます高まっており、それに伴い、電解コンデンサに用いられる電極箔も従来以上に高い静電容量が要求され、より表面積が拡大されたエッチング箔の開発が求められている。   In recent years, the demand for miniaturization of electrolytic capacitors has been increasing, and accordingly, electrode foils used in electrolytic capacitors are required to have higher capacitance than before, and the development of etching foils with a larger surface area is required. It has been.

しかしながら、これまでのエッチング工程で用いられてきた交流波形では、発生したエッチングピット同士が結合して不均一となり、表面積拡大の面で非効率的であった。そのため、エッチング減量当りの容量が低く、より表面積を拡大できるエッチング方法が望まれていた。   However, in the alternating current waveform used in the etching process so far, the generated etching pits are combined and become non-uniform, which is inefficient in terms of surface area expansion. Therefore, there has been a demand for an etching method that has a low capacity per etching loss and can increase the surface area.

本発明は上記課題を解決するものであり、塩酸水溶液にリン酸、硝酸、硫酸、シュウ酸のうち少なくとも1種を混合した水溶液中で、アルミニウム箔を一対の電極の間に通過させて交流電流を印加する電解コンデンサ用エッチング箔の製造方法において、
上記交流電流の正の半周期における波形が、ピーク時から大きく低下する部分と、低下終了直後から半周期終了時まで一定、または緩やかに上昇若しくは下降する部分とを含むことを特徴とする電解コンデンサ用エッチング箔の製造方法である。
The present invention solves the above-mentioned problem, and in an aqueous solution in which at least one of phosphoric acid, nitric acid, sulfuric acid, and oxalic acid is mixed with an aqueous hydrochloric acid solution, an aluminum foil is passed between a pair of electrodes to generate an alternating current. In the manufacturing method of the etching foil for electrolytic capacitors to apply
The electrolytic capacitor characterized in that the waveform in the positive half cycle of the alternating current includes a portion that greatly decreases from the peak time, and a portion that rises or falls gradually or immediately after the end of the decrease until the end of the half cycle. It is a manufacturing method of the etching foil for water.

また、上記の波形において、ピーク時の電流値に対する低下終了時の電流値の比率が、0.2〜0.7であることを特徴とする電解コンデンサ用エッチング箔の製造方法である。   In the above waveform, the ratio of the current value at the end of the decrease to the current value at the peak is 0.2 to 0.7.

さらに、上記波形において、低下終了直後の電流値に対する、以後の半周期終了時の電流値の比率が0.7〜1.2であることを特徴とする電解コンデンサ用エッチング箔の製造方法である。   Furthermore, in the above waveform, the ratio of the current value at the end of the subsequent half cycle to the current value immediately after the end of the decrease is 0.7 to 1.2. .

そして、上記波形において、半周期時間に対する、半周期開始時からピーク時までの時間の比率が、0.1〜0.7であることを特徴とする電解コンデンサ用エッチング箔の製造方法である。   And in the said waveform, the ratio of the time from the half-cycle start time to the peak time with respect to half-cycle time is 0.1-0.7, It is a manufacturing method of the etching foil for electrolytic capacitors characterized by the above-mentioned.

また、上記波形において、半周期時間に対する、ピーク時から低下終了時までの時間の比率が、0.4以下であることを特徴とする電解コンデンサ用エッチング箔の製造方法である。   Further, in the above waveform, the ratio of the time from the peak time to the end of the reduction with respect to the half cycle time is 0.4 or less.

上記のように、交流電流の波形が正の半周期においてピーク時から大きく低下する部分と、低下終了直後から半周期終了時まで一定、または緩やかに上昇若しくは下降する部分とを設けることにより、従来の波形で発生していたエッチングピットが結合してしまう問題が改善され、その結果、ピットが均一となり、エッチング時のアルミニウム減量が抑えられるとともに、静電容量の向上を図ることができる。すなわち、より表面積を拡大することができ、エッチング減量当りの静電容量の向上が可能となる。   As described above, by providing a portion in which the waveform of the alternating current greatly decreases from the peak in the positive half cycle and a portion in which the waveform of the alternating current rises or falls slowly from immediately after the end of the decrease until the end of the half cycle The problem that the etching pits generated in this waveform are combined is improved. As a result, the pits become uniform, the aluminum loss during etching can be suppressed, and the capacitance can be improved. That is, the surface area can be further increased, and the capacitance per etching loss can be improved.

以下、本願発明の実施例について説明する。
なお、以下の説明では、ピーク時の電流値aに対する、低下終了時の電流値bの比率を波形パラメータA、低下終了直後の電流値bに対する、以後の半周期終了時の電流値cの比率を波形パラメータB、半周期時間T1に対する、半周期開始時からピーク時までの時間T2の比率を波形パラメータC、半周期時間T1に対する、ピーク時から低下終了時までの時間T3の比率を波形パラメータDで表記する。
ここで、上記の波形パラメータA、B、C、Dについて図示すると、図1のようになり、A=b/a、B=c/b、C=T2/T1、D=T3/T1のように表される。
Examples of the present invention will be described below.
In the following description, the ratio of the current value b at the end of the decrease to the current value a at the peak is the waveform parameter A, and the ratio of the current value c at the end of the subsequent half cycle to the current value b immediately after the end of the decrease. The waveform parameter B, the ratio of the time T2 from the start of the half cycle to the peak time with respect to the half cycle time T1, the waveform parameter C, the ratio of the time T3 from the peak time to the end of decrease with respect to the half cycle time T1, the waveform parameter Denoted by D.
Here, the waveform parameters A, B, C, and D are illustrated as shown in FIG. 1, and A = b / a, B = c / b, C = T2 / T1, and D = T3 / T1. It is expressed in

[実施例1〜4]波形パラメータAの比較
エッチング溶液の組成は、塩酸15.0wt%、リン酸2.0wt%、硝酸2.0wt%、硫酸1.0wt%とし、アルミニウム箔は純度99.9%のものを用いた。
まず、波形パラメータAについて、0.2〜0.7の範囲で比較した。Bは1.0、Cは0.4、Dは0で固定した。
アルミニウム箔に所定のエッチング電気量を印加後、公知の方法でケミカル洗浄を行い、電極箔を作製した。
[Examples 1-4] Comparison of Waveform Parameter A The composition of the etching solution was 15.0 wt% hydrochloric acid, 2.0 wt% phosphoric acid, 2.0 wt% nitric acid, and 1.0 wt% sulfuric acid, and the aluminum foil had a purity of 99. 9% was used.
First, the waveform parameter A was compared in the range of 0.2 to 0.7. B was fixed at 1.0, C at 0.4, and D at 0.
After applying a predetermined amount of etching electricity to the aluminum foil, chemical cleaning was performed by a known method to prepare an electrode foil.

(比較例1、2)
波形パラメータAを0.1または0.8とした以外は実施例3と同様とし、電極箔を作製した。
(Comparative Examples 1 and 2)
An electrode foil was produced in the same manner as in Example 3 except that the waveform parameter A was set to 0.1 or 0.8.

[実施例5、10、(3)]波形パラメータBの比較
波形パラメータBを0.7〜1.2の範囲とした以外は実施例3と同様とし、電極箔を作製した。
[Examples 5, 10, (3)] Comparison of waveform parameter B An electrode foil was prepared in the same manner as in Example 3 except that the waveform parameter B was in the range of 0.7 to 1.2.

(比較例3、7)
波形パラメータBを1.3または0.6とした以外は実施例3と同様とし、電極箔を作製した。
(Comparative Examples 3 and 7)
An electrode foil was produced in the same manner as in Example 3 except that the waveform parameter B was set to 1.3 or 0.6.

[実施例6、7、(3)]波形パラメータCの比較
波形パラメータCを、0.1〜0.7の範囲とした以外は実施例3と同様とし、電極箔を作製した。
[Examples 6, 7, and (3)] Comparison of waveform parameter C An electrode foil was prepared in the same manner as in Example 3 except that the waveform parameter C was set in the range of 0.1 to 0.7.

(比較例4、5)
波形パラメータCを、0.8または0.05とした以外は実施例3と同様とし、電極箔を作製した。
(Comparative Examples 4 and 5)
An electrode foil was produced in the same manner as in Example 3 except that the waveform parameter C was set to 0.8 or 0.05.

[実施例8、9、(3)]波形パラメータDの比較
波形パラメータDを、0〜0.4の範囲とした以外は実施例3と同様とし、電極箔を作製した。
[Examples 8, 9, and (3)] Comparison of Waveform Parameter D An electrode foil was manufactured in the same manner as in Example 3 except that the waveform parameter D was set in the range of 0 to 0.4.

(比較例6)
波形パラメータDを0.5とした以外は実施例3と同様とし、電極箔を作製した。
(Comparative Example 6)
An electrode foil was produced in the same manner as in Example 3 except that the waveform parameter D was set to 0.5.

(従来例1、2)
従来例1として三角波形を印加し、また、従来例2として矩形波形を印加し、それ以外は実施例3と同様とし、電極箔を作製した。
(Conventional examples 1 and 2)
A triangular waveform was applied as Conventional Example 1, a rectangular waveform was applied as Conventional Example 2, and the rest was the same as Example 3 to produce an electrode foil.

上記実施例1〜10、比較例1〜7、従来例1、2の電極箔について、エッチングによる減量[g/cm]、20V化成した時の静電容量[μF/cm]を測定し、エッチング減量当りの静電容量[μF/g]を算出した。
また、上記の実施例1〜10、比較例1〜7、従来例による各エッチング波形を図2〜18に示す。
その結果を表1に示す。
For the electrode foils of Examples 1 to 10, Comparative Examples 1 to 7, and Conventional Examples 1 and 2, the weight loss [g / cm 2 ] by etching and the capacitance [μF / cm 2 ] when formed 20V were measured. Then, the capacitance per μL of etching [μF / g] was calculated.
Moreover, each etching waveform by said Examples 1-10, Comparative Examples 1-7, and a prior art example is shown to FIGS.
The results are shown in Table 1.

Figure 2007123552
Figure 2007123552

[波形の形状による比較]
表1から明らかなように、波形が正の半周期中においてピーク時から大きく低下する部分と、低下終了直後から半周期終了時まで一定、または緩やかに上昇若しくは下降する部分とを含む実施例は、かかる部分を含まない従来例1、2と比較して、エッチング減量が少なく、20V化成容量が大きくなっており、エッチング減量当りの静電容量も大きくなっていることが分かる。
[Comparison by waveform shape]
As is apparent from Table 1, an embodiment including a portion where the waveform greatly decreases from the peak time during the positive half cycle and a portion where the waveform increases or decreases gradually from immediately after the end of the decrease until the end of the half cycle is It can be seen that, compared with the conventional examples 1 and 2 that do not include such a portion, the etching weight loss is small, the 20V conversion capacity is large, and the electrostatic capacity per etching weight loss is also large.

[波形パラメータAの比較]
ここで、上記波形のピーク時の電流値に対する、低下終了時の電流値の比率(波形パラメータA)は0.2〜0.7の範囲が適当である(実施例1〜4)。0.1ではピットの結合は抑えられるが、ピットの成長が進まず(比較例1)、0.7ではピットの結合が進み過ぎ(比較例2)、いずれも静電容量の改善効果が小さい。
[Comparison of waveform parameter A]
Here, the ratio of the current value at the end of the decrease (waveform parameter A) to the current value at the peak of the waveform is suitably in the range of 0.2 to 0.7 (Examples 1 to 4). At 0.1, the pit coupling is suppressed, but the pit growth does not proceed (Comparative Example 1), and at 0.7, the pit coupling proceeds too much (Comparative Example 2). .

[波形パラメータBの比較]
さらに、低下終了直後の電流値に対する、以後の半周期終了時の電流値の比率(波形パラメータB)は0.7〜1.2の範囲が適当である(実施例3、5、10)。1.3ではピットの結合が進み過ぎ(比較例3)、0.6ではピットの成長が不十分であり(比較例7)、いずれも静電容量の改善効果が小さい。
[Comparison of waveform parameter B]
Further, the ratio of the current value at the end of the subsequent half cycle (waveform parameter B) to the current value immediately after the end of the decrease is suitably in the range of 0.7 to 1.2 (Examples 3, 5, and 10). In 1.3, the pit coupling is too advanced (Comparative Example 3), and in 0.6, the pit growth is insufficient (Comparative Example 7). In either case, the effect of improving the capacitance is small.

[波形パラメータCの比較]
また、半周期時間に対する、半周期開始時からピーク時までの時間の比率(波形パラメータC)は0.1〜0.7の範囲が適当である(実施例6、3、7)。0.05ではピット発生が不十分であり(比較例5)、0.8ではピットの結合が進み過ぎ(比較例4)、いずれも静電容量の改善効果が小さい。
[Comparison of waveform parameter C]
The ratio of the time from the start of the half cycle to the peak time (waveform parameter C) with respect to the half cycle time is suitably in the range of 0.1 to 0.7 (Examples 6, 3, and 7). When 0.05, pit generation is insufficient (Comparative Example 5), and when 0.8, pit coupling is too advanced (Comparative Example 4), and the effect of improving the capacitance is small.

[波形パラメータDの比較]
そして、半周期時間に対する、ピーク時から低下終了時までの時間の比率(波形パラメータD)は0.4以下が適当である(実施例8、9、3)。0.5ではピットの結合が進み過ぎ(比較例6)、静電容量の改善効果が小さい。
[Comparison of waveform parameter D]
The ratio of the time from the peak time to the end of decrease (waveform parameter D) with respect to the half cycle time is suitably 0.4 or less (Examples 8, 9, and 3). At 0.5, the pit coupling is too advanced (Comparative Example 6), and the effect of improving the capacitance is small.

また、上記実施例では、エッチング溶液を、塩酸15.0wt%、リン酸2.0wt%、硝酸2.0wt%、硝酸1.0wt%からなる組成としたが、これに限定されるものではない。
そして、上記のエッチング波形は、エッチングを多段にして、そのうちの一部に使用することもできる。
In the above embodiment, the etching solution is composed of 15.0 wt% hydrochloric acid, 2.0 wt% phosphoric acid, 2.0 wt% nitric acid, and 1.0 wt% nitric acid. However, the present invention is not limited to this. .
The etching waveform described above can be used for some of the etching steps.

本発明の実施例による波形および波形を規定するパラメータを示す図である。It is a figure which shows the parameter which prescribes | regulates the waveform and the waveform by the Example of this invention. 比較例1によるエッチング波形を示す図である。6 is a diagram showing an etching waveform according to Comparative Example 1. FIG. 本発明の実施例1によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 1 of this invention. 本発明の実施例2によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 2 of this invention. 本発明の実施例3によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 3 of this invention. 本発明の実施例4によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 4 of this invention. 比較例2によるエッチング波形を示す図である。6 is a diagram showing an etching waveform according to Comparative Example 2. FIG. 比較例3によるエッチング波形を示す図である。10 is a diagram showing an etching waveform according to Comparative Example 3. FIG. 本発明の実施例5によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 5 of this invention. 比較例4によるエッチング波形を示す図である。It is a figure which shows the etching waveform by the comparative example 4. 本発明の実施例6によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 6 of this invention. 本発明の実施例7によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 7 of this invention. 比較例5によるエッチング波形を示す図である。10 is a diagram showing an etching waveform according to Comparative Example 5. FIG. 比較例6によるエッチング波形を示す図である。It is a figure which shows the etching waveform by the comparative example 6. 本発明の実施例8によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 8 of this invention. 本発明の実施例9によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 9 of this invention. 本発明の実施例10によるエッチング波形を示す図である。It is a figure which shows the etching waveform by Example 10 of this invention. 比較例7によるエッチング波形を示す図である。10 is a diagram showing an etching waveform according to Comparative Example 7. FIG. 従来例による三角波形を示す図である。It is a figure which shows the triangular waveform by a prior art example. 他の従来例による矩形波形を示す図である。It is a figure which shows the rectangular waveform by another prior art example.

符号の説明Explanation of symbols

1 ピーク時の電流値(a)
2 低下終了時の電流値(b)
3 半周期終了時の電流値(c)
4 低下開始時
5 低下終了時
6 半周期
T1 半周期時間
T2 半周期開始時からピーク時までの時間
T3 低下開始時から終了時までの時間


1 Current value at peak (a)
2 Current value at the end of decline (b)
3 Current value at end of half cycle (c)
4 At the start of decline 5 At the end of decline 6 Half cycle T1 Half cycle time T2 Time from half cycle start to peak time T3 Time from drop start to end time


Claims (5)

塩酸水溶液に、リン酸、硝酸、硫酸、シュウ酸のうち少なくとも1種を混合した水溶液中で、アルミニウム箔を一対の電極の間に通過させて交流電流を印加する電解コンデンサ用エッチング箔の製造方法において、
上記交流電流の正の半周期における波形が、ピーク時から大きく低下する部分と、低下終了直後から半周期終了時まで一定、または緩やかに上昇若しくは下降する部分とを含むことを特徴とする電解コンデンサ用エッチング箔の製造方法。
A method for producing an etching foil for electrolytic capacitors, wherein an alternating current is applied by passing an aluminum foil between a pair of electrodes in an aqueous solution in which at least one of phosphoric acid, nitric acid, sulfuric acid, and oxalic acid is mixed with an aqueous hydrochloric acid solution In
The electrolytic capacitor characterized in that the waveform in the positive half cycle of the alternating current includes a portion that greatly decreases from the peak time, and a portion that rises or falls gradually or immediately after the end of the decrease until the end of the half cycle. Method for producing etching foils.
請求項1記載の波形において、ピーク時の電流値に対する、低下終了時の電流値の比率が、0.2〜0.7であることを特徴とする電解コンデンサ用エッチング箔の製造方法。   2. The method of manufacturing an etching foil for an electrolytic capacitor according to claim 1, wherein the ratio of the current value at the end of the reduction to the current value at the peak is 0.2 to 0.7. 請求項1記載の波形において、低下終了直後の電流値に対する、以後の半周期終了時の電流値の比率が、0.7〜1.2であることを特徴とする電解コンデンサ用エッチング箔の製造方法。   2. The manufacturing method of an etching foil for an electrolytic capacitor according to claim 1, wherein the ratio of the current value at the end of the subsequent half cycle to the current value immediately after the end of the decrease is 0.7 to 1.2. Method. 請求項1記載の波形において、半周期時間に対する、半周期開始時からピーク時までの時間の比率が、0.1〜0.7であることを特徴とする電解コンデンサ用エッチング箔の製造方法。   2. The method of manufacturing an etching foil for an electrolytic capacitor according to claim 1, wherein the ratio of the time from the start of the half cycle to the peak time with respect to the half cycle time is 0.1 to 0.7. 請求項1記載の波形において、半周期時間に対する、ピーク時から低下終了時までの時間の比率が、0.4以下であることを特徴とする電解コンデンサ用エッチング箔の製造方法。
2. The method of manufacturing an etching foil for an electrolytic capacitor according to claim 1, wherein the ratio of the time from the peak time to the end of the decrease with respect to the half cycle time is 0.4 or less.
JP2005313665A 2005-10-28 2005-10-28 Manufacturing method for etching foil for electrolytic capacitor Pending JP2007123552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005313665A JP2007123552A (en) 2005-10-28 2005-10-28 Manufacturing method for etching foil for electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005313665A JP2007123552A (en) 2005-10-28 2005-10-28 Manufacturing method for etching foil for electrolytic capacitor

Publications (1)

Publication Number Publication Date
JP2007123552A true JP2007123552A (en) 2007-05-17

Family

ID=38147067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005313665A Pending JP2007123552A (en) 2005-10-28 2005-10-28 Manufacturing method for etching foil for electrolytic capacitor

Country Status (1)

Country Link
JP (1) JP2007123552A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121420A (en) * 1984-11-19 1986-06-09 松下電器産業株式会社 Manufacture of aluminum electrolytic capacitor
JPH0382800A (en) * 1989-08-24 1991-04-08 Fuji Photo Film Co Ltd Electrolytic treatment
JP2005251884A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Method for manufacturing electrode foil for aluminum electrolytic capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121420A (en) * 1984-11-19 1986-06-09 松下電器産業株式会社 Manufacture of aluminum electrolytic capacitor
JPH0382800A (en) * 1989-08-24 1991-04-08 Fuji Photo Film Co Ltd Electrolytic treatment
JP2005251884A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Method for manufacturing electrode foil for aluminum electrolytic capacitor

Similar Documents

Publication Publication Date Title
JP2008140904A (en) Manufacturing method of aluminum electrode foil for electrolytic capacitor
JP2007324252A (en) Method of manufacturing electrode foil for electrolytic capacitor
JP4653644B2 (en) Method for producing aluminum electrode foil for electrolytic capacitor
JP2007123552A (en) Manufacturing method for etching foil for electrolytic capacitor
JP2009146984A (en) Method of manufacturing electrode foil for electrolytic capacitor
JP2802730B2 (en) Etching method of aluminum foil for electrolytic capacitor
JP3582451B2 (en) Manufacturing method of anode foil for aluminum electrolytic capacitor
JP4811939B2 (en) Formation method of electrode foil for electrolytic capacitor
JP4690171B2 (en) Method for producing aluminum electrode foil for electrolytic capacitor
JP2005268427A (en) Method for manufacturing etching foil for aluminum electrode capacitor
JPH06275475A (en) Production of electrode foil for aluminum electrolytic capacitor
JP4089333B2 (en) Manufacturing method of electrode foil for aluminum electrolytic capacitor
JP4428037B2 (en) Manufacturing method of electrode foil for aluminum electrolytic capacitor
JP4662268B2 (en) Method for producing electrode foil for electrolytic capacitor
JP2009290084A (en) Method for manufacturing electrode foil for electrolytic capacitor
JP4695966B2 (en) Method for producing aluminum electrode foil for electrolytic capacitor
JP2008091374A (en) Manufacturing method of etching foil for electrolytic capacitor
JP2018125322A (en) Method for manufacturing electrode foil for electrolytic capacitor
JP2007067172A (en) Manufacturing method of aluminum electrode foil for electrolytic capacitor
JP2008112877A (en) Manufacturing method of electrode foil for electrolytic capacitor
JP2005203529A (en) Method for manufacturing electrode foil for aluminum electrolytic capacitor
JP2009231517A (en) Method of manufacturing etching foil for electrolytic capacitor
JP2009094376A (en) Method for manufacturing aluminum electrode foil for use of electrolytic capacitor
JP4547919B2 (en) Manufacturing method of electrode foil for aluminum electrolytic capacitor
JP2847717B2 (en) Method for etching electrode foil for aluminum electrolytic capacitor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080423

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101005

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110308