JP2007123513A - Precise substrate storing container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a precise substrate storing container capable of detecting a container body etc., regardless of whether a precise substrate is stored or not, dispensing with the necessity to allow the most part of the container body etc., to be opaque, and keeping the function of a sensor for detecting the precise substrate. <P>SOLUTION: The precise substrate storing container includes the transparent container body 1 for storing by arrayal the plurality of precise substrates composed of a semiconductor wafer, and a freely attachable/detachable lid body for opening/closing the open front of the container body 1 so as to be sealable. Light shielding areas 40 are respectively formed on the bottom surface and ceiling of the container body 1, by which the light transmittance of light 31 radiated to a light receiving element 33 from the light emitting element 32 of a photoelectric sensor 30 arranged in the division chamber 21 of a work device 20 is attenuated by not less than 10%. Since the light shielding areas 40 for shielding the light 31 are molded on the bottom surface and ceiling of the container body 1, there is no trouble in the detection of the photoelectric sensor 30 even when the container body 1 is transparent. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a precision substrate storage container for storing a precision substrate made of a semiconductor wafer, a glass substrate, a photomask, an aluminum disk or the like.

  Although not shown, a conventional precision substrate storage container includes a container main body for aligning and storing a plurality of precision substrates made of semiconductor wafers, a detachable lid for opening and closing the open front of the container main body, It is equipped with a locking mechanism that locks or unlocks the lid fitted to the open front of the container body by an external operation, and is used for loading and unloading precision substrates in the semiconductor production process (See Patent Documents 1, 2, and 3).

  The container body of the precision substrate storage container is molded using a transparent resin having light transmittance so that the precision substrate can be seen without removing the lid, and a rear retainer for supporting the rear portion of the precision substrate is provided on the back wall. A plurality of teeth are arranged in the vertical direction, and a pair of left and right teeth supporting the precision substrate are arranged in the vertical direction on both side walls. Further, a plurality of front retainers for supporting the front portion of the precision substrate are arranged in the vertical direction on the inner surface of the lid.

  The semiconductor production process includes, for example, a heat treatment process such as annealing, a film formation process by CVD, a resist coating process, an etching process, an exposure process, and the like. In these processes, various types of mounting a container body of a precision substrate storage container are provided. The processing equipment is used. In this processing apparatus, a photoelectric sensor (also referred to as a transmissive photosensor or a transmissive sensor) that detects the presence or absence of a precision substrate storage container by shielding the light beam between the light emitting section and the light receiving section by the container body. When the presence of the precision substrate storage container is detected by this photoelectric sensor, the precision substrate storage container is put into the next step.

For example, a light-emitting diode having a wavelength of 670 to 680 nm is used as the photoelectric sensor, and a light-emitting portion and a light-receiving portion facing each other at an interval are appropriately installed in the vertical direction, horizontal direction, or diagonal direction of the processing apparatus.
JP 2004-342844 A JP 2000-159288 A Japanese Patent Laid-Open No. 2003-174081

In the conventional precision substrate storage container, since the container body is formed using a transparent resin as described above, it interferes with the detection of the photoelectric sensor utilizing light shielding, and in particular, the precision substrate is provided on the container body. If it is not stored, it may not be detected.
In order to solve such a problem, it is sufficient to form an opaque region in the container body. However, since the installation location of the photoelectric sensor is not constant in the vertical direction, horizontal direction, or diagonal direction of the processing apparatus, most of the container body A new problem arises in that it must be formed opaque. Furthermore, if most of the container body is made opaque, a sensor in another factory that detects the presence or absence of a precision substrate may not function or may be difficult to detect.

  The present invention has been made in view of the above, and can detect a container body or the like regardless of whether or not a precision substrate is stored. Moreover, it is not necessary to make most of the container body opaque and detect a precision substrate. An object of the present invention is to provide a precision substrate storage container capable of maintaining the function of a sensor.

In order to solve the above-described problems, the present invention includes a container main body that stores a precision substrate and a lid that opens and closes the opening of the container main body, and at least the container main body of the container main body and the lid is light transmissive. The presence or absence of presence is detected by shielding the light beam between the light emitting part and the light receiving part of the sensor by a part of the container body or the lid,
The container main body or the lid is provided with a light shielding region that attenuates the light transmittance of light emitted from the light emitting part of the sensor by 10% or more.

The light-shielding region can be a textured or textured surface having a surface roughness of Ry (maximum height) of 35 to 150 μm.
Further, the light shielding region can be a grained surface having a surface roughness of Ry 35 to 70 μm.
Further, the light shielding region can be formed by laser marking.
Further, the light shielding region can be formed by applying markings having an uneven surface.
Furthermore, the light shielding region can be formed by attaching a light shielding base material to a part of the container body or the lid.

  Here, the precision substrate in the claims includes a plurality of semiconductor wafers (200 mm wafer, 300 mm wafer, 450 mm wafer, etc.), a glass substrate, a photomask, an aluminum disk, and the like. The precision substrate may be stored directly in the container body, but may be stored indirectly in a state of being mounted on a fixed carrier. Further, the lid does not particularly ask whether it is transparent or not and has a built-in locking mechanism. The light shielding region is preferably formed in a circular shape, an elliptical shape, a triangular shape, a rectangular shape, a polygonal shape, or the like by means that can be formed at an arbitrary location on the container body.

  The light-shielding region may be a light-scattering surface, a light scattering surface formed by ultrasonic waves or heat transfer, colored resin, talc, mica, glass fiber, carbon fiber, or the like. A plurality of the light shielding regions can be formed on the bottom surface, the ceiling, the front surface, the back surface, the side walls, and the like of the container body on condition that the light rays of the sensor can be appropriately attenuated and shielded. The base material includes various sheets and films. Further, the precision substrate storage container may be a front open box type corresponding to a 300 mm wafer, a FOUP type or a FOSB type, or a top open box type corresponding to a 200 mm wafer or the like.

  According to the present invention, since the light shielding region formed on the container body and / or lid of the precision substrate storage container attenuates the light beam emitted from the sensor, the detection of the sensor is hindered even if the container body and / or lid is transparent. Can be prevented.

According to the present invention, there is an effect that a container body or the like can be detected regardless of whether a precision substrate is stored. In addition, since it is not necessary to make most of the container body and the like opaque, it is possible to maintain the function of the sensor that detects the precision substrate.
Moreover, if the light-shielding area is a grained surface having a surface roughness Ry of 35 to 150 μm using a mold, a complicatedly shaped container body or lid body having the light-shielding area can be manufactured easily and in large quantities. .

In addition, if the light shielding region is formed by laser marking, it is not necessary to use a plate or the like, so that the cost can be reduced, and work efficiency, productivity, precision, and the like can be improved.
Moreover, if the marking having the uneven surface is formed by using an ultrasonic processing device or the like, since no sewage or smoke is generated, pollution-free processing can be realized, and the light shielding region can be reduced. It is possible to form beautifully.
Furthermore, if the light-shielding region is formed by attaching a light-shielding base material to a part of the container body or lid, it is possible to respond quickly to user specifications and diversify the manufacturing method. It becomes possible.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1 and FIG. 2, a precision substrate storage container in this embodiment includes a plurality of precision substrates made of semiconductor wafers (not shown). A transparent container body 1 to be arranged and stored, a detachable lid body 10 that opens and closes the front face of the container body 1 that can be sealed, and an opening of the container body 1 that is built in the lid body 10 and is operated from the outside. And a locking mechanism that locks or unlocks the lid 10 fitted to the front surface. The light receiving element 33 from the light emitting element 32 of the photoelectric sensor 30 installed in the processing apparatus 20 is provided on the bottom surface and the ceiling of the container body 1. A substantially rectangular light shielding region 40 is formed to attenuate the light transmittance of the irradiated light beam 31 by 20% or more.

  The precision substrate is made of, for example, a semiconductor wafer having a diameter of 300 mm (12 inches), specifically a silicon wafer, and the surface on which the circuit is formed is formed in a mirror surface. A notch is selectively formed.

  The container body 1 and the lid body 10 are preferably molded transparently using polycarbonate having good transparency, impact resistance and heat resistance so that the precision substrate can be visually recognized from the outside without removing the lid body 10. Alternatively, it may be formed transparently with a cycloolefin polymer, polyetherimide, or the like having excellent optical properties and transparency.

  The container body 1 is injection-molded into a light-transmitting front open box structure with an opening on the front, and a plurality of positioning tools 2 are arranged at intervals on the front and rear and rear portions of the bottom surface so as to draw a triangle. The flange 3 gripped by the transport robot is detachably attached to the center of the ceiling.

  The open front of the container body 1 is projected outward in the width direction and bulged to the rim portion 4 for fitting the lid, and a pair of left and right locking holes are formed on the upper and lower inner peripheral surfaces of the rim portion 4. Perforated at intervals. On the inner surface of the back wall of the container body 1, a plurality of rear retainers that horizontally support the rear peripheral edge of the precision substrate are arranged in parallel in the vertical direction, and a pair of left and right teeth that horizontally support the precision substrate are disposed on the inner surfaces of both side walls. Are juxtaposed in the vertical direction.

  The lid 10 includes a substantially rectangular casing having a dish-shaped cross section that fits into the rim portion 4 of the container body 1 and a substantially rectangular cover plate 11 that covers the front surface of the casing that is open. An endless seal gasket that presses and seals against the inner peripheral surface of the rim portion 4 is fitted to the outer surface, and an elastic front retainer that horizontally supports the front peripheral edge of the precision substrate on the rear surface of the housing. Are arranged in parallel in the vertical direction.

  Although not shown, for example, the locking mechanism is pivotally supported on the front surface of the housing of the lid 10, for example, a pair of left and right rotating plates that are rotated by an external operation, and rotatably coupled to each rotating plate. A pair of upper and lower advancing and retracting plates that move forward and backward in the vertical direction of the casing based on the rotation, and a pivotally connected pivotally supported at the tip of each of the advancing and retracting plates, and locking the rim portion 4 through a through-hole in the peripheral wall of the casing It has a plurality of retractable locking claws that interfere with the hole, and is configured in accordance with SEMI standard E62.

  The processing device 20 includes a device that performs various processings on a precision substrate in, for example, a heat treatment process, a film forming process, a resist coating process, an etching process, an exposure process, and the like, and includes a partition chamber 21 that partitions a transfer area and a clean area. An opener for attaching / detaching the lid body 10 to / from the container body 1 is attached to the vertical wall 22 of the compartment 21, and a rectangular through-hole 23 communicating with the open front of the container body 1 is provided. Formed (see FIG. 2). A substantially plate-shaped stage 24 that horizontally mounts the container body 1 protrudes horizontally from the elevation wall 22 of the compartment 21 in the direction of the transfer area. On the stage 24, a plurality of positioning tools 2 of the container body 1 and A plurality of positioning pins 25 to be fitted are erected.

  As shown in FIG. 2, the photoelectric sensor 30 has a light emitting element 32 such as a light emitting diode that irradiates a light beam 31 and a light receiving element 33 that receives the light beam 31 from the light emitting element 32 in an oblique vertical direction. It is installed in the compartment 21 of the processing apparatus 20 in preparation for the facing state. The photoelectric sensor 30 includes an infrared type and an optical fiber type, and any type may be used.

  The light emitting element 32 is installed obliquely downward on the vertical wall 22 of the processing apparatus 20 and irradiates the light receiving element 33 with the light beam 31 from the front of the ceiling of the container body 1 through the rear of the bottom. The light receiving element 33 is embedded in the stage 24 of the processing apparatus 20 obliquely upward, and when the container main body 1 is mounted on the stage 24, the light receiving element 33 is close to the vicinity of the rear portion of the bottom surface.

  As shown in FIG. 1 and FIG. 2, the plurality of light shielding regions 40 have a surface roughness of, for example, Ry (maximum height (the height from the lowest valley bottom to the highest mountain peak for each reference length)) of 35 to 150 μm. The container body 1 is partly integrally formed with the front part of the ceiling and the rear part of the bottom surface when the container body 1 is formed. The light transmittance of the light beam 31 emitted from the light emitting element 32 of the photoelectric sensor 30 is 10% or more. Preferably, it is attenuated by 20% or more, particularly 30% or more from the viewpoint of stabilization of detection, and functions to ensure detection of the photoelectric sensor 30.

  The surface roughness of the light shielding region 40 is in the range of Ry35 to 150 μm. If the surface roughness is less than 35, the light beam 31 of the photoelectric sensor 30 cannot be sufficiently reduced, and the detection of the precision substrate storage container may be hindered. Because there is. On the other hand, when the thickness exceeds 150 μm, it is damaged at the time of releasing from the mold, or it becomes difficult to release, and particles are likely to adhere, and it takes time for the drying process after cleaning.

  The surface roughness can be measured according to JIS B0601-1994, for example, using a measuring machine (trade name: Surf Test 501) manufactured by Mitutoyo Corporation. The transmittance can be measured according to JIS K7105 using a spectrocolorimeter manufactured by Konica Minolta.

  The light-shielding region 40 is transferred and formed by a fine embossed surface that has been concavo-convex processed on the mold for the container body 1. The formation range of the light shielding region 40 is preferably set as appropriate according to the spot diameter, type, arrangement state, and detection limit of the light beam 31 of the photoelectric sensor 30 that has been previously determined. Considering the dimensional difference when mounted, the size / range obtained by multiplying the detection range of the light receiving element 33 by a safety factor (for example, 1.5) is optimal.

  In the above configuration, when the container body 1 of the precision substrate storage container is set on the stage 24 of the processing apparatus 20, the container body 1 is interposed between the light emitting element 32 and the light receiving element 33 of the photoelectric sensor 30. Since the light beam 31 is shielded or reduced by the light shielding region 40 of the container body 1, the presence or absence of the precision substrate storage container is clearly detected.

  According to the said structure, since the light-shielding area | region 40 which shields the light ray 31 is partially shape | molded in the bottom face and ceiling of the container main body 1, even if the container main body 1 is transparent, it may interfere with the detection of the photoelectric sensor 30. Not at all. In addition, the precision substrate storage container can be reliably detected regardless of whether the precision substrate is stored. Further, it is not necessary to make most of the container body 1 opaque, and it is possible to effectively prevent the functional failure of a sensor in another factory that detects the presence or absence of a precision substrate. Furthermore, since the light-shielding region 40 is formed by a texture formed into a mold for injection-molding the container body 1, significant improvements in productivity, quality stability, applicability, and the like can be expected.

  In addition, if the surface of the light shielding area 40 is provided on one of the inner wall surface and the outer wall surface of the container main body 1 and the lid body 10, a light blocking effect can be obtained, but it is preferable to provide the surface on the light emitting side which is the outer wall surface side. . Further, if the inner wall surface and the outer wall surface that face each other are subjected to the bobbing process, a greater effect can be obtained.

  Next, FIGS. 3 to 6 show a second embodiment of the present invention. In this case, opposite light shielding regions 40 are formed at the lower portions of both side walls of the container body 1. The light transmittance of the photoelectric sensors 30 that are respectively formed in a rectangular shape and are opposed to each other in the horizontal direction at an interval is attenuated by 10% or more, preferably 20% or more, and 30% or more from the viewpoint of stabilization of detection. I have to.

The light shielding region 40 is formed by roughening the surface of the container body 1 by laser marking. At the time of this formation, a bar code (see FIG. 6) 41, a numerical value, a logo, a pattern, and the like are appropriately formed. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In this embodiment, the same effect as the above embodiment can be expected, and it is possible to respond quickly to user specifications and diversify the manufacturing method. In addition, there is no need for a composition for printing, so the cost is reduced. Obviously, it is possible to significantly improve work efficiency, productivity, and precision.

Next, FIG. 7 shows a third embodiment of the present invention. In this case, by applying a marking having a concavo-convex surface using an ultrasonic transfer jig 51 or a thermal welding machine, A light shielding region 40 is partially formed in a part of the container body 1.
The light shielding region 40 has an uneven surface, and the uneven surface has various shapes that diffusely reflect the light beam 31 of the photoelectric sensor 30, for example, a continuous triangular pyramid pattern or a quadrangular pyramid pattern. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In the present embodiment, the same effects as those in the above-described embodiment can be expected, and it is possible to respond quickly to user specifications and to diversify the manufacturing method. Further, if the transfer jig 51 using ultrasonic waves is used, no sewage or smoke is generated, so that pollution-free processing can be realized, and the light-shielding region 40 can be formed beautifully or the accuracy can be improved. Obviously you can.

  Next, FIG. 8 shows a fourth embodiment of the present invention. In this case, a light shielding region 40 is attached to a part of the container body 1 and a separate base material 42 having light shielding properties is attached. It is made to form by.

The light-shielding base material 42 is made of, for example, a sheet, a film, paper, a label, or the like that shields the light beam 31 of the photoelectric sensor 30 and does not particularly ask for coloring or logos. Such a base material 42 is partially adhered directly to the container main body 1 using the adhesive layer 43, or is provided at an arbitrary position of the container main body 1 by an ultrasonic welding machine, a heat welding machine or the like. The other parts are the same as those in the above embodiment, and the description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those of the above embodiment can be expected, and that it is possible to respond quickly to user specifications and to diversify the manufacturing method.

  In the above-described embodiment, the locking mechanism is provided on the lid body 10, but a plurality of locking members may be provided on the container body 1 and the lid body 10, and the locking mechanism may be omitted. Further, the advance / retreat plate of the locking mechanism and the locking claw may be integrated. Further, in the above embodiment, the light shielding region 40 is transferred and formed by the crease processed into the mold for the container body 1. However, the proof can be replaced with a mold having a nested structure or having no crease. A mold having a ground may be prepared and replaced as necessary.

  In addition, the shading area 40 is not transferred and formed by a crease processed into a mold for the container body 1, but is post-processed by an etching method or a sand blast method, or a squeeze having a predetermined roughness is formed on an adhesive sheet. And you may adhere this adhesive sheet to the arbitrary locations of the container main body 1. FIG. In this way, there is no need to perform any processing on the mold, and a quick response corresponding to the user's specifications can be greatly expected.

  It is also possible to insert the paper for the light shielding region 40 and the base material 42 into the mold for the container main body 1 so that the container main body 1 and the light shielding region 40 are integrally formed. It is also possible to form the container body 1 by first forming the light-shielding region 40 and then insert-molding regions other than the light-shielding region 40 or two-color molding. Moreover, it is also possible to provide each of the container body 1 and the lid 10 with a light shielding region 40 that attenuates the light transmittance of the light emitted from the light emitting element 32 of the photoelectric sensor 30 by 10% or more.

  In the above embodiment, the light shielding region 40 is formed in the container body 1, but the invention is not limited to this, and the light shielding region 40 can be formed in the lid 10. The light shielding region 40 can also be formed of a material that can absorb the wavelength region of the light beam 31 emitted from the light emitting element 32 of the photoelectric sensor 30. Furthermore, the light shielding region 40 of the container body 1 and the lid 10 can be formed of a material that can absorb the wavelength region of the light beam 31 emitted from the light emitting element 32 of the photoelectric sensor 30.

It is a perspective explanatory view showing an embodiment of a precision substrate storage container concerning the present invention. It is side explanatory drawing which shows embodiment of the precision substrate storage container which concerns on this invention. It is perspective explanatory drawing which shows 2nd Embodiment of the precision substrate storage container which concerns on this invention. It is back surface explanatory drawing which shows 2nd Embodiment of the precision substrate storage container which concerns on this invention. It is explanatory drawing which shows the laser marking apparatus in 2nd Embodiment of the precision substrate storage container which concerns on this invention. It is explanatory drawing which shows the light-shielding area | region with a barcode in 2nd Embodiment of the precision substrate storage container which concerns on this invention. It is explanatory drawing which shows 3rd Embodiment of the precision substrate storage container which concerns on this invention. It is explanatory drawing which shows 4th Embodiment of the precision substrate storage container which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container body 4 Rim part 10 Lid 20 Processing apparatus 21 Compartment room 24 Stage 30 Photoelectric sensor (sensor)
31 Light 32 Light emitting element (light emitting part)
33 Light receiving element (light receiving part)
40 light shielding area 41 bar code 42 base material 43 adhesive layer

Claims (5)

A container main body for storing the precision substrate; and a lid for opening and closing the opening of the container main body. The light emitting unit and the light receiving unit of the sensor are provided to provide light transparency to at least the container main body of the container main body and the lid. Is a precision substrate storage container in which the presence or absence of presence is detected by shielding the light beam between and a part of the container body or the lid,
A precision substrate storage container, wherein a light shielding region for attenuating light transmittance of light emitted from a light emitting part of a sensor by 10% or more is provided in a container main body or a lid.   The precision substrate storage container according to claim 1, wherein the light-shielding area is a grained surface having a surface roughness of Ry 35 to 150 μm.   The precision substrate storage container according to claim 1, wherein the light shielding region is formed by laser marking. The precision substrate storage container according to claim 1, wherein the light shielding region is formed by applying markings having an uneven surface. 2. The precision substrate storage container according to claim 1, wherein the light shielding region is formed by attaching a light shielding base material to a part of the container main body or the lid.

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