JP2007062358A - 印刷板、印刷板を製造する方法及び印刷板を利用した平板表示装置の製造方法 - Google Patents
印刷板、印刷板を製造する方法及び印刷板を利用した平板表示装置の製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000007639 printing Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 104
- 238000012937 correction Methods 0.000 claims description 33
- 238000000059 patterning Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 13
- 238000005229 chemical vapour deposition Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 5
- 239000011147 inorganic material Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- -1 acrylic compound Chemical class 0.000 claims description 2
- 238000003618 dip coating Methods 0.000 claims description 2
- 238000007606 doctor blade method Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 150000004767 nitrides Chemical class 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000007645 offset printing Methods 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/006—Printing plates or foils; Materials therefor made entirely of inorganic materials other than natural stone or metals, e.g. ceramics, carbide materials, ferroelectric materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0537—Transfer of pre-fabricated insulating pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
【解決手段】本発明の印刷板の製造方法は、基板を提供する段階と、基板に金属層を形成する段階と、金属層上に、金属層の一部分を露出する微細パターンを有するレジストパターンを形成する段階と、露出した金属層をウエットエッチングして前記レジストパターンをとり除き、基板の一部分を露出する金属層パターンを形成する段階と、露出した基板をウエットエッチングして金属層パターンをとり除き、窪み(凹)パターンを形成する段階と、窪み(凹)パターンを含む基板に補正層を形成すると段階を含む。
【選択図】図2
Description
この時、窪み(凹)パターンの幅を減らすために窪み(凹)パターンの深さを小さく形成すれば、レジストパターンの厚さが薄くなって耐食性が落ち、従って、導電膜をパターニングして配線を形成する場合に希望する形状の配線を形成することができない。
また、微細なパターンの配線を含む平板表示装置の製造方法を提供することに他の目的がある。
又は、微細な密度の配線を容易に製造することができ、複雑な回路を構成する平板表示装置を容易に製造することができる。
以下では本発明の望ましい実施例を参照して説明するが、該当の技術分野の熟練された当業者は特許請求範囲に記載した本発明の思想及び領域から脱しない範囲内で本発明を多様に修正及び変更させることができることを理解することができるはずである。
20、120:補正層
200:ブルランケット
210:レジスト層
210’:レジストパターン
410:ゲート電極
430:アクティブ層
440a、 440b:ソース/ドレイン電極
450:保護層
460:画素電極
P:窪み(凹)パターン
Claims (23)
- 窪み(凹)パターンを有する基板、及び
前記窪み(凹)パターンを有する基板の表面上に形成された補正層を含む印刷板。 - 前記補正層が、前記窪み(凹)パターンを有する基板の全面に形成されることを特徴とする請求項1に記載の印刷板。
- 前記基板が、硝子、プラスチック及び金属からなる郡から選択された物質で形成されることを特徴とする請求項1に記載の印刷板。
- 前記補正層が無機物で形成される特徴とする請求項1に記載の印刷版。
- 前記無機物が、窒化シリコン、酸化シリコン、シリコン(Si)、クロム(Cr)、モリブデン(Mo)、アルミニウム(Al)及び銅(Cu)からなる郡から選択されることを特徴とする請求項4に記載の印刷板。
- 前記補正層の厚さは、
- 前記補正層がスパッタリング工程又は化学気相蒸着工程で形成されることを特徴とする請求項1に記載の印刷板。
- 基板を提供する段階、
前記基板の表面に金属層を形成する段階、
前記金属層の一部分が露出した微細パターンを有するレジストパターンを前記金属層上に形成する段階、
前記レジストパターン上の微細パターンによって露出した前記金属層の一部をウエットエッチングして前記レジストパターンをとり除き、前記基板の一部分が露出する金属層パターンを形成する段階;
前記金属層パターンによって露出した基板の一部分をウエットエッチングして前記金属層パターンをとり除き、窪み(凹)パターンを形成する段階、及び
前記窪み(凹)パターンが形成された基板の表面に補正層を形成する段階を含む印刷板の製造方法。 - 前記補正層が、前記窪み(凹)パターンが形成された基板の全面に形成されることを特徴とする請求項8に記載の印刷板の製造方法。
- 前記補正層がスパッタリング法又は化学気相蒸着法(CVD)によって形成されることを特徴とする請求項8に記載の印刷板の製造方法。
- 前記基板が、ガラス、プラスチック、金属からなる群から選択された物質で形成されることを特徴とする請求項8に記載の印刷板の製造方法。
- 前記補正層が無機物で形成されることを特徴とする請求項8に記載の印刷板の製造方法。
- 前記補正層が、窒化シリコーン、酸化シリコーン、シリコン(Si)、クロム(Cr)、モリブデン(Mo)、アルミニウム(Al)及び銅(Cu)からなる郡から選択された物質で形成されることを特徴とする請求項8に記載の印刷板の製造方法。
- 前記補正層の厚さは、
- 基板を提供する段階、
前記基板上に第1導電性物質を蒸着する段階、
ゲート電極及びゲート配線を形成するために、前記基板上の前記第1導電性物質をパターニングする段階、
前記ゲート電極及びゲート配線が形成された前記基板の表面に基板ゲート絶縁膜を形成する段階、
前記ゲート電極に対応する前記ゲート絶縁膜上にアクティブ層を形成する段階、
前記アクティブ層に第2導電性物質を蒸着する段階、
ソース/ドレイン電極及びデータ配線を形成するために、前記アクティブ層上の前記第2導電性物質をパターニングする段階、
前記ソース/ドレイン電極及びデータ配線が形成された基板の表面に、前記ドレイン電極の一部分を露出するコンタクトホール有する保護層を形成する段階、
前記保護層上に第3導電性物質を蒸着する段階、
前記ドレイン電極と電気的に接続するように、前記保護層上の第3導電性物質をパターニングして画素電極を形成する段階、
前記ゲート電極、前記ゲート配線、前記アクティブ層、前記ソース/ドレイン電極、前記データ配線、前記保護層のコンタクトホール、または前記画素電極の少なくとも一つを、窪み(凹)パターンと突(凸)部とが形成された基板の表面上の補正層を有する印刷板を利用してレジストパターンを形成し、その結果物に対してエッチングすることで、形成することを特徴とする平板表示装置の製造方法。 - 前記補正層が、前記窪み(凹)パターンが形成された基板の全面に形成されることを特徴とする請求項15に記載の平板表示装置の製造方法。
- 前記レジストパターンを形成する工程は、
窪み(凹)パターンと、前記窪み(凹)パターンが形成された基板の表面上に形成された補正層とを有する印刷板を提供する段階;
レジスト層が塗布されているブランケットを提供する段階;
前記印刷板上で前記レジスト層の所定部分を転写して、前記ブランケットの表面に第2レジストパターンを形成する段階;
導電膜が形成された基板を提供する段階;及び
前記導電膜上に前記ブランケットの表面上の前記第2レジストパターンを転写して、前記導電膜上にレジストパターンを形成する段階を含むことを特徴とする請求項15に記載の平板表示装置の製造方法。 - 前記ブランケットの表面上の第2レジストパターンが、スピンコーティング、ディップコーティング、スプレーコーティング及びドクターブレイド法の何れか一つで形成されることを特徴とする請求項17に記載の平板表示装置の製造方法。
- 前記基板が、ガラス、プラスチック、金属からなる群から選択された物質で形成されることを特徴とする請求項15に記載の平板表示装置の製造方法。
- 前記補正層が無機物で形成されることを特徴とする請求項15に記載の平板表示装置の製造方法。
- 前記補正層が、窒化シリコン、酸化シリコン、 シリコン(Si)、クロム(Cr)、モリブデン(Mo)、アルミニウム(Al)及び銅(Cu)からなる郡から選択された一つの物質で形成されることを特徴とする請求項15に記載の平板表示装置の製造方法。
- 前記平板表示装置は液晶表示装置又は有機電界発光表示装置であることを特徴とする請求項15に記載の平板表示装置の製造方法。
- 前記基板の表面上の保護層が、窒化シリコン、酸化シリコン、アクリル係化合物、 BCB又はPFCBからなる群から選択された物質で形成されることを特徴とする請求項15に記載の平板表示装置の製造方法。
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US20070048667A1 (en) | 2007-03-01 |
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