JP2007042668A5 - - Google Patents

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Publication number
JP2007042668A5
JP2007042668A5 JP2005221817A JP2005221817A JP2007042668A5 JP 2007042668 A5 JP2007042668 A5 JP 2007042668A5 JP 2005221817 A JP2005221817 A JP 2005221817A JP 2005221817 A JP2005221817 A JP 2005221817A JP 2007042668 A5 JP2007042668 A5 JP 2007042668A5
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JP
Japan
Prior art keywords
light
led chip
phosphor
led
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005221817A
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English (en)
Japanese (ja)
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JP2007042668A (ja
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Publication date
Application filed filed Critical
Priority to JP2005221817A priority Critical patent/JP2007042668A/ja
Priority claimed from JP2005221817A external-priority patent/JP2007042668A/ja
Publication of JP2007042668A publication Critical patent/JP2007042668A/ja
Publication of JP2007042668A5 publication Critical patent/JP2007042668A5/ja
Withdrawn legal-status Critical Current

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JP2005221817A 2005-07-29 2005-07-29 Ｌｅｄ発光装置 Withdrawn JP2007042668A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Publications (2)

Publication Number Publication Date
JP2007042668A JP2007042668A (ja) 2007-02-15
JP2007042668A5 true JP2007042668A5 (https=) 2007-11-15

Family

ID=37800407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005221817A Withdrawn JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Country Status (1)

Country Link
JP (1) JP2007042668A (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
KR100996918B1 (ko) 2008-05-16 2010-11-26 (주) 아모엘이디 전자부품 패키지
KR100996919B1 (ko) 2008-07-08 2010-11-26 (주) 아모엘이디 반도체 패키지
KR100954453B1 (ko) * 2008-07-04 2010-04-27 (주) 아모엘이디 엘이디 패키지
JP5360370B2 (ja) * 2008-11-14 2013-12-04 独立行政法人物質・材料研究機構 発光装置
JP2010177329A (ja) * 2009-01-28 2010-08-12 Sharp Corp 樹脂複合リードフレームとその製造方法、及びその実装体
JP5385685B2 (ja) * 2009-05-28 2014-01-08 三菱樹脂株式会社 カバーレイフィルム、発光素子搭載用基板及び光源装置
DE102009025266B4 (de) * 2009-06-17 2015-08-20 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
US8547009B2 (en) * 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
DE102009055786A1 (de) * 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
JP5585829B2 (ja) * 2010-08-24 2014-09-10 スタンレー電気株式会社 車両用灯具
JP5585830B2 (ja) * 2010-08-24 2014-09-10 スタンレー電気株式会社 車両用灯具
EP2500623A1 (en) 2011-03-18 2012-09-19 Koninklijke Philips Electronics N.V. Method for providing a reflective coating to a substrate for a light-emitting device
JP2014011029A (ja) * 2012-06-29 2014-01-20 Toshiba Lighting & Technology Corp 照明装置
JP2013041950A (ja) 2011-08-12 2013-02-28 Sharp Corp 発光装置
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
WO2015060289A1 (ja) * 2013-10-24 2015-04-30 東レ株式会社 蛍光体組成物、蛍光体シート、蛍光体シート積層体ならびにそれらを用いたｌｅｄチップ、ｌｅｄパッケージおよびその製造方法
KR102413224B1 (ko) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자, 발광 소자 제조방법 및 발광 모듈

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307506A (ja) * 2000-04-17 2001-11-02 Hitachi Ltd 白色発光装置および照明器具
JP3655267B2 (ja) * 2002-07-17 2005-06-02 株式会社東芝 半導体発光装置
JP4366981B2 (ja) * 2003-04-21 2009-11-18 日亜化学工業株式会社 半導体発光装置およびその形成方法
JP4774201B2 (ja) * 2003-10-08 2011-09-14 日亜化学工業株式会社 パッケージ成形体及び半導体装置

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