JP2007042668A5 - - Google Patents

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Publication number
JP2007042668A5
JP2007042668A5 JP2005221817A JP2005221817A JP2007042668A5 JP 2007042668 A5 JP2007042668 A5 JP 2007042668A5 JP 2005221817 A JP2005221817 A JP 2005221817A JP 2005221817 A JP2005221817 A JP 2005221817A JP 2007042668 A5 JP2007042668 A5 JP 2007042668A5
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JP
Japan
Prior art keywords
light
led chip
phosphor
led
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005221817A
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Japanese (ja)
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JP2007042668A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005221817A priority Critical patent/JP2007042668A/en
Priority claimed from JP2005221817A external-priority patent/JP2007042668A/en
Publication of JP2007042668A publication Critical patent/JP2007042668A/en
Publication of JP2007042668A5 publication Critical patent/JP2007042668A5/ja
Withdrawn legal-status Critical Current

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Claims (3)

ＬＥＤチップと、
白色系樹脂からなる基体であって、前記ＬＥＤチップを囲繞する部分を備える基体と、
光反射性フィラーを含有するシリコーンである樹脂層であって、前記ＬＥＤチップに近い領域ほど前記樹脂層が厚く、これによって前記樹脂層の表面が前記ＬＥＤチップの光軸に対して傾斜する面となり、前記基体の前記部分の内周面を被覆する樹脂層と、
前記ＬＥＤチップを被覆するように、前記樹脂層が囲繞する空間に充填されるシリコーンからなる封止部材と、
を備えるＬＥＤ発光装置。 An LED chip;
A substrate made of a white resin, the substrate including a portion surrounding the LED chip;
A resin layer made of silicone containing a light-reflective filler, wherein the region closer to the LED chip is thicker, and the surface of the resin layer is inclined with respect to the optical axis of the LED chip. A resin layer covering the inner peripheral surface of the portion of the base;
A sealing member made of silicone filled in a space surrounded by the resin layer so as to cover the LED chip;
An LED light emitting device comprising: 前記ＬＥＤチップが青色発光ＬＥＤチップであり、
前記封止部材が、青色系の光を受けて黄色系の光を放射する蛍光体を含有する、
請求項１に記載のＬＥＤ発光装置。 The LED chip is a blue light emitting LED chip;
The sealing member contains a phosphor that receives blue light and emits yellow light.
The LED light-emitting device according to claim 1 . 前記ＬＥＤチップが紫外発光ＬＥＤチップであり、
前記封止部材が、紫外光を受けて赤色系の光を放出する蛍光体と、紫外光を受けて緑色色系の光を放出する蛍光体と、及び紫外光を受けて青色系の光を放出する蛍光体とを含有する、
請求項１に記載のＬＥＤ発光装置。 The LED chip is an ultraviolet light emitting LED chip;
The sealing member receives a phosphor that emits red light upon receiving ultraviolet light, a phosphor that emits green light upon receiving ultraviolet light, and a blue light upon receiving ultraviolet light. A phosphor that emits,
The LED light-emitting device according to claim 1 .
JP2005221817A 2005-07-29 2005-07-29 Led light emitting device Withdrawn JP2007042668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (en) 2005-07-29 2005-07-29 Led light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (en) 2005-07-29 2005-07-29 Led light emitting device

Publications (2)

Publication Number Publication Date
JP2007042668A JP2007042668A (en) 2007-02-15
JP2007042668A5 true JP2007042668A5 (en) 2007-11-15

Family

ID=37800407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005221817A Withdrawn JP2007042668A (en) 2005-07-29 2005-07-29 Led light emitting device

Country Status (1)

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JP (1) JP2007042668A (en)

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KR100954453B1 (en) * 2008-07-04 2010-04-27 (주) 아모엘이디 ??? package
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
KR100996919B1 (en) 2008-07-08 2010-11-26 (주) 아모엘이디 Semiconductor package
KR100996918B1 (en) 2008-05-16 2010-11-26 (주) 아모엘이디 Electronic component package
JP5360370B2 (en) * 2008-11-14 2013-12-04 独立行政法人物質・材料研究機構 Light emitting device
JP2010177329A (en) * 2009-01-28 2010-08-12 Sharp Corp Resin composite lead frame, manufacturing method thereof, and package thereof
JP5385685B2 (en) * 2009-05-28 2014-01-08 三菱樹脂株式会社 Cover-lay film, light-emitting element mounting substrate, and light source device
DE102009025266B4 (en) * 2009-06-17 2015-08-20 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
US8547009B2 (en) * 2009-07-10 2013-10-01 Cree, Inc. Lighting structures including diffuser particles comprising phosphor host materials
DE102009055786A1 (en) 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Housing, optoelectronic component and method for producing a housing
JP5585830B2 (en) * 2010-08-24 2014-09-10 スタンレー電気株式会社 Vehicle lighting
JP5585829B2 (en) * 2010-08-24 2014-09-10 スタンレー電気株式会社 Vehicle lighting
EP2500623A1 (en) 2011-03-18 2012-09-19 Koninklijke Philips Electronics N.V. Method for providing a reflective coating to a substrate for a light-emitting device
JP2014011029A (en) * 2012-06-29 2014-01-20 Toshiba Lighting & Technology Corp Lighting apparatus
JP2013041950A (en) 2011-08-12 2013-02-28 Sharp Corp Light emitting device
JP2013033976A (en) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd Semiconductor light-emitting device and vehicle headlight
CN105765744B (en) * 2013-10-24 2019-01-22 东丽株式会社 Fluorescencer composition, fluorophor sheet material, fluorophor sheet material lamilate and the LED chip, LED package and its manufacturing method that have used them
KR102413224B1 (en) * 2015-10-01 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device, manufacturing method for light emittin device, and lighting module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307506A (en) * 2000-04-17 2001-11-02 Hitachi Ltd White light emitting device and illuminator
JP3655267B2 (en) * 2002-07-17 2005-06-02 株式会社東芝 Semiconductor light emitting device
JP4366981B2 (en) * 2003-04-21 2009-11-18 日亜化学工業株式会社 Semiconductor light emitting device and method for forming the same
JP4774201B2 (en) * 2003-10-08 2011-09-14 日亜化学工業株式会社 Package molded body and semiconductor device

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