JP2007036656A5 - - Google Patents
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- Publication number
- JP2007036656A5 JP2007036656A5 JP2005216876A JP2005216876A JP2007036656A5 JP 2007036656 A5 JP2007036656 A5 JP 2007036656A5 JP 2005216876 A JP2005216876 A JP 2005216876A JP 2005216876 A JP2005216876 A JP 2005216876A JP 2007036656 A5 JP2007036656 A5 JP 2007036656A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film
- thin
- integrated
- resonator element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 238000000137 annealing Methods 0.000 claims 1
- 230000005284 excitation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005216876A JP4904737B2 (ja) | 2005-07-27 | 2005-07-27 | Ｉｃ一体型薄膜振動片の製造方法。 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005216876A JP4904737B2 (ja) | 2005-07-27 | 2005-07-27 | Ｉｃ一体型薄膜振動片の製造方法。 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007036656A JP2007036656A (ja) | 2007-02-08 |
| JP2007036656A5 true JP2007036656A5 (cg-RX-API-DMAC7.html) | 2008-08-21 |
| JP4904737B2 JP4904737B2 (ja) | 2012-03-28 |
Family
ID=37795365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005216876A Expired - Fee Related JP4904737B2 (ja) | 2005-07-27 | 2005-07-27 | Ｉｃ一体型薄膜振動片の製造方法。 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4904737B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105794107B (zh) | 2013-12-27 | 2018-12-25 | 株式会社村田制作所 | 弹性波装置以及其制造方法 |
| CN107615658B (zh) | 2015-06-25 | 2020-12-11 | 株式会社村田制作所 | 弹性波装置 |
| KR101929333B1 (ko) * | 2015-06-25 | 2018-12-14 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| CN107615657B (zh) | 2015-06-25 | 2020-12-01 | 株式会社村田制作所 | 弹性波装置 |
| JP6432558B2 (ja) * | 2015-06-25 | 2018-12-05 | 株式会社村田製作所 | 弾性波装置 |
| CN106841383B (zh) * | 2016-12-27 | 2019-06-18 | 华中科技大学 | 一种集成式阻抗负载声表面波气体传感器 |
| KR102292154B1 (ko) | 2017-08-29 | 2021-08-23 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치 |
| JP7364196B2 (ja) * | 2021-09-24 | 2023-10-18 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイス、モジュール |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2836375B2 (ja) * | 1992-04-28 | 1998-12-14 | 日本電気株式会社 | 半導体弾性表面波複合装置 |
| US5838089A (en) * | 1997-02-18 | 1998-11-17 | Kobe Steel Usa Inc. | Acoustic wave devices on diamond with an interlayer |
| KR100316383B1 (ko) * | 1998-10-30 | 2002-02-19 | 윤덕용 | 모노리딕직접회로위에박막또는후막단결정압전소자를집적한단일칩라디오구조및그제조방법 |
| JP4385607B2 (ja) * | 2003-01-29 | 2009-12-16 | セイコーエプソン株式会社 | 表面弾性波素子、周波数フィルタ、発振器、電子回路並びに電子機器 |
| JP2004297359A (ja) * | 2003-03-26 | 2004-10-21 | Seiko Epson Corp | 表面弾性波素子、周波数フィルタ、発振器、電子回路、及び電子機器 |
| JP2004312309A (ja) * | 2003-04-04 | 2004-11-04 | Seiko Epson Corp | 半導体振動子複合装置、電子デバイスおよび電子機器 |
| JP4428064B2 (ja) * | 2004-01-21 | 2010-03-10 | セイコーエプソン株式会社 | 薄膜弾性表面波デバイス |
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2005
- 2005-07-27 JP JP2005216876A patent/JP4904737B2/ja not_active Expired - Fee Related