JP2007036283A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2007036283A
JP2007036283A JP2006269552A JP2006269552A JP2007036283A JP 2007036283 A JP2007036283 A JP 2007036283A JP 2006269552 A JP2006269552 A JP 2006269552A JP 2006269552 A JP2006269552 A JP 2006269552A JP 2007036283 A JP2007036283 A JP 2007036283A
Authority
JP
Japan
Prior art keywords
electrode
electrodes
lead
protruding electrode
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006269552A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007036283A5 (enrdf_load_stackoverflow
Inventor
Kenji Toyosawa
健司 豊沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2006269552A priority Critical patent/JP2007036283A/ja
Publication of JP2007036283A publication Critical patent/JP2007036283A/ja
Publication of JP2007036283A5 publication Critical patent/JP2007036283A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)
JP2006269552A 2006-09-29 2006-09-29 半導体装置 Pending JP2007036283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006269552A JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269552A JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002357089A Division JP4271435B2 (ja) 2002-12-09 2002-12-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2007036283A true JP2007036283A (ja) 2007-02-08
JP2007036283A5 JP2007036283A5 (enrdf_load_stackoverflow) 2008-04-10

Family

ID=37795055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006269552A Pending JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2007036283A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8339561B2 (en) 2008-01-21 2012-12-25 Samsung Electronics Co., Ltd. Wiring substrate, tape package having the same, and display device having the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01217931A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd フリップチップ
JPH07335692A (ja) * 1994-06-10 1995-12-22 Toshiba Micro Comput Eng Corp 半導体集積回路装置
JP2000100851A (ja) * 1998-09-25 2000-04-07 Sony Corp 半導体部品及びその製造方法、半導体部品の実装構造及びその実装方法
JP2000269611A (ja) * 1999-03-16 2000-09-29 Casio Comput Co Ltd フレキシブル配線基板
JP2000286291A (ja) * 1999-03-30 2000-10-13 Kyocera Corp 半導体素子の実装構造体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01217931A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd フリップチップ
JPH07335692A (ja) * 1994-06-10 1995-12-22 Toshiba Micro Comput Eng Corp 半導体集積回路装置
JP2000100851A (ja) * 1998-09-25 2000-04-07 Sony Corp 半導体部品及びその製造方法、半導体部品の実装構造及びその実装方法
JP2000269611A (ja) * 1999-03-16 2000-09-29 Casio Comput Co Ltd フレキシブル配線基板
JP2000286291A (ja) * 1999-03-30 2000-10-13 Kyocera Corp 半導体素子の実装構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8339561B2 (en) 2008-01-21 2012-12-25 Samsung Electronics Co., Ltd. Wiring substrate, tape package having the same, and display device having the same
KR101457335B1 (ko) * 2008-01-21 2014-11-04 삼성전자주식회사 배선기판, 이를 갖는 테이프 패키지 및 표시장치

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