JP2007036283A5 - - Google Patents

Download PDF

Info

Publication number
JP2007036283A5
JP2007036283A5 JP2006269552A JP2006269552A JP2007036283A5 JP 2007036283 A5 JP2007036283 A5 JP 2007036283A5 JP 2006269552 A JP2006269552 A JP 2006269552A JP 2006269552 A JP2006269552 A JP 2006269552A JP 2007036283 A5 JP2007036283 A5 JP 2007036283A5
Authority
JP
Japan
Prior art keywords
edge
electrode
side protruding
semiconductor chip
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006269552A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007036283A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006269552A priority Critical patent/JP2007036283A/ja
Priority claimed from JP2006269552A external-priority patent/JP2007036283A/ja
Publication of JP2007036283A publication Critical patent/JP2007036283A/ja
Publication of JP2007036283A5 publication Critical patent/JP2007036283A5/ja
Pending legal-status Critical Current

Links

JP2006269552A 2006-09-29 2006-09-29 半導体装置 Pending JP2007036283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006269552A JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006269552A JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002357089A Division JP4271435B2 (ja) 2002-12-09 2002-12-09 半導体装置

Publications (2)

Publication Number Publication Date
JP2007036283A JP2007036283A (ja) 2007-02-08
JP2007036283A5 true JP2007036283A5 (enrdf_load_stackoverflow) 2008-04-10

Family

ID=37795055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006269552A Pending JP2007036283A (ja) 2006-09-29 2006-09-29 半導体装置

Country Status (1)

Country Link
JP (1) JP2007036283A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101457335B1 (ko) 2008-01-21 2014-11-04 삼성전자주식회사 배선기판, 이를 갖는 테이프 패키지 및 표시장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01217931A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd フリップチップ
JPH07335692A (ja) * 1994-06-10 1995-12-22 Toshiba Micro Comput Eng Corp 半導体集積回路装置
JP2000100851A (ja) * 1998-09-25 2000-04-07 Sony Corp 半導体部品及びその製造方法、半導体部品の実装構造及びその実装方法
JP3986199B2 (ja) * 1999-03-16 2007-10-03 カシオ計算機株式会社 フレキシブル配線基板
JP3537699B2 (ja) * 1999-03-30 2004-06-14 京セラ株式会社 半導体素子の実装構造体

Similar Documents

Publication Publication Date Title
JP5250656B2 (ja) バー型ｌｅｄライトの製造方法、および、この方法で製造されたバー型ｌｅｄライト
JP2010093109A5 (enrdf_load_stackoverflow)
CN103874311B (zh) 复合线路结构
JP2020108109A5 (ja) 振動デバイスおよび振動モジュール
KR20140025851A (ko) 칩 온 필름
WO2019080630A1 (zh) 驱动电路板和显示装置
JP2007036283A5 (enrdf_load_stackoverflow)
JP2008159655A5 (enrdf_load_stackoverflow)
CN112270907B (zh) 一种驱动电路载体和显示装置
JP2006221761A5 (enrdf_load_stackoverflow)
JP3350352B2 (ja) 配線パターンを有する半導体装置の支持基体
JP2009071046A (ja) 半導体装置、その製造方法及びワイヤボンディング方法
JP2020205335A5 (enrdf_load_stackoverflow)
JP6006527B2 (ja) 半導体装置
JP2012527715A5 (enrdf_load_stackoverflow)
US9872388B2 (en) Printed wiring board
JP2022141882A5 (enrdf_load_stackoverflow)
JPWO2018211680A1 (ja) 電子モジュール
JP2023127609A5 (enrdf_load_stackoverflow)
JP2016503990A5 (enrdf_load_stackoverflow)
JP2006229186A (ja) 半導体集積回路およびその製造方法
JP5874552B2 (ja) 接合部材
TWI549576B (zh) 軟性電子元件模組及其拼接結構
JP6006528B2 (ja) 半導体装置
JP2009283873A (ja) 半導体装置