JP2007036165A - ウエハ検査装置の載置台 - Google Patents
ウエハ検査装置の載置台 Download PDFInfo
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- JP2007036165A JP2007036165A JP2005237991A JP2005237991A JP2007036165A JP 2007036165 A JP2007036165 A JP 2007036165A JP 2005237991 A JP2005237991 A JP 2005237991A JP 2005237991 A JP2005237991 A JP 2005237991A JP 2007036165 A JP2007036165 A JP 2007036165A
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- conductive film
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- mounting table
- wafer mounting
- ceramic
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title abstract 4
- 239000000919 ceramic Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000007689 inspection Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000007772 electroless plating Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 238000007733 ion plating Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000000994 depressogenic effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- -1 sialon Inorganic materials 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 65
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【課題】 絶縁性が高く低コストのウエハ載置台を、導電膜を有するセラミックで形成すること。さらに、セラミックの絶縁性を高く保つために導電膜の形成過程でセラミック表面に微細な凸凹が発生しないようにすること。
【解決手段】 ウエハ検査器のウエハ載置台において、ウエハ載置台の基材をセラミックとしその表面と電気配線を取り付けるための側面の一部に導電膜を有し電気配線を固定するためのねじ孔を有し、その表面と側面の一部の導電膜は連続し、側面の一部の導電膜を有する部分は他の側面より陥没させ、導電膜を全面に形成後、不要な部分を機械的に除去しセラミック基材の表面を荒らす化学的なエッチングを行わない。
【選択図】 図2
Description
1a セラミック基材の加工面
2 リフトピン孔
3 ねじ孔
4 マスク
5 導電膜
6 切り欠き部
7 逆円錐の窪み
100 従来例によるウエハ載置台
200 本発明によるウエハ載置台
Claims (6)
- ウエハ検査装置のウエハ載置台において、前記ウエハ載置台の基材をセラミックとし、その表面と電気配線を取り付けるための側面の一部に導電膜を有し電気配線を固定するためのねじ孔を有し、その表面と側面の一部の導電膜は連続し、側面の一部の導電膜を有する部分は他の側面より陥没していることを特徴とする、ウエハ検査装置のウエハ載置台。
- 請求項1のセラミックは、アルミナ、サイアロン、窒化珪素の中から選ばれる一種以上の材質からなる、請求項1に記載のウエハ検査装置のウエハ載置台。
- 請求項2のアルミナは、純度が99.5%以上で二酸化珪素の割合が0.15%以下であることを特徴とする、請求項1〜2に記載のウエハ検査装置のウエハ載置台。
- 請求項1の導電膜はニッケル、銅、チタン、クロム、金、銀、白金、タングステン、モリブデン、パラジウムから選ばれる一種以上の金属からなり、その成膜方法が無電解メッキ、スパッタリングあるいはイオンプレーティングで形成する、請求項1のウエハ検査装置のウエハ載置台。
- 請求項1の導電膜は炭化チタン、窒化チタン、炭窒化チタンから選ばれる一種以上の導電性セラミックからなることを特徴とする、請求項1のウエハ検査装置のウエハ載置台。
- ウエハ載置台製造方法は、載置台側面のねじ孔の周囲を一部切り欠き、セラミック基材全面に導電膜を形成し、側面の導電膜を機械加工により切り欠き部の導電膜を残して削り取ることを含む、請求項1〜5に記載のウエハ載置台製造方法。
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JP2005237991A JP5187472B2 (ja) | 2005-07-22 | 2005-07-22 | ウエハ検査装置の載置台 |
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JP2005237991A JP5187472B2 (ja) | 2005-07-22 | 2005-07-22 | ウエハ検査装置の載置台 |
Publications (2)
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JP2007036165A true JP2007036165A (ja) | 2007-02-08 |
JP5187472B2 JP5187472B2 (ja) | 2013-04-24 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011196708A (ja) * | 2010-03-17 | 2011-10-06 | Mitsubishi Electric Corp | 外形検出装置および外形検出方法 |
JP2012049510A (ja) * | 2010-07-29 | 2012-03-08 | Kyocera Corp | プローバ用チャック、プローバ用チャックの製造方法および検査装置 |
US9995786B2 (en) | 2015-11-17 | 2018-06-12 | Mitsubishi Electric Corporation | Apparatus and method for evaluating semiconductor device |
CN111918605A (zh) * | 2018-03-29 | 2020-11-10 | 创意科技股份有限公司 | 吸着垫 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291937A (ja) * | 1986-06-12 | 1987-12-18 | Matsushita Electric Ind Co Ltd | プロ−バ |
JPH03225844A (ja) * | 1990-01-30 | 1991-10-04 | Mitsubishi Electric Corp | ウエハチヤック |
-
2005
- 2005-07-22 JP JP2005237991A patent/JP5187472B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62291937A (ja) * | 1986-06-12 | 1987-12-18 | Matsushita Electric Ind Co Ltd | プロ−バ |
JPH03225844A (ja) * | 1990-01-30 | 1991-10-04 | Mitsubishi Electric Corp | ウエハチヤック |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011196708A (ja) * | 2010-03-17 | 2011-10-06 | Mitsubishi Electric Corp | 外形検出装置および外形検出方法 |
JP2012049510A (ja) * | 2010-07-29 | 2012-03-08 | Kyocera Corp | プローバ用チャック、プローバ用チャックの製造方法および検査装置 |
US9995786B2 (en) | 2015-11-17 | 2018-06-12 | Mitsubishi Electric Corporation | Apparatus and method for evaluating semiconductor device |
CN111918605A (zh) * | 2018-03-29 | 2020-11-10 | 创意科技股份有限公司 | 吸着垫 |
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