JP2007027559A5 - - Google Patents

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Publication number
JP2007027559A5
JP2007027559A5 JP2005210115A JP2005210115A JP2007027559A5 JP 2007027559 A5 JP2007027559 A5 JP 2007027559A5 JP 2005210115 A JP2005210115 A JP 2005210115A JP 2005210115 A JP2005210115 A JP 2005210115A JP 2007027559 A5 JP2007027559 A5 JP 2007027559A5
Authority
JP
Japan
Prior art keywords
electronic component
resin
light receiving
receiving element
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005210115A
Other languages
English (en)
Japanese (ja)
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JP2007027559A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005210115A priority Critical patent/JP2007027559A/ja
Priority claimed from JP2005210115A external-priority patent/JP2007027559A/ja
Publication of JP2007027559A publication Critical patent/JP2007027559A/ja
Publication of JP2007027559A5 publication Critical patent/JP2007027559A5/ja
Pending legal-status Critical Current

Links

JP2005210115A 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器 Pending JP2007027559A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005210115A JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005210115A JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Publications (2)

Publication Number Publication Date
JP2007027559A JP2007027559A (ja) 2007-02-01
JP2007027559A5 true JP2007027559A5 (enrdf_load_stackoverflow) 2007-05-17

Family

ID=37787898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005210115A Pending JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Country Status (1)

Country Link
JP (1) JP2007027559A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053546A (ja) * 2006-08-25 2008-03-06 Tdk Corp 受光素子
JP5216251B2 (ja) * 2007-05-16 2013-06-19 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 実装用に半導体発光デバイスを前処理するための方法
JP2009099680A (ja) * 2007-10-15 2009-05-07 Panasonic Corp 光学デバイスおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0480989A (ja) * 1990-07-23 1992-03-13 Nec Home Electron Ltd 封止樹脂の塞止め構造
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP3955487B2 (ja) * 2002-03-19 2007-08-08 松下電器産業株式会社 集積回路素子の実装方法
JP2005166870A (ja) * 2003-12-02 2005-06-23 Seiko Epson Corp 光素子及びその製造方法、光モジュール、光伝送装置
JP3936365B2 (ja) * 2004-09-14 2007-06-27 ソニーケミカル＆インフォメーションデバイス株式会社 機能素子実装モジュール及びその製造方法
JP4042993B2 (ja) * 2005-03-09 2008-02-06 パイオニア株式会社 光検出半導体装置の製造方法

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