JP2007027248A - p型III族窒化物半導体層の製造方法および発光素子 - Google Patents
p型III族窒化物半導体層の製造方法および発光素子 Download PDFInfo
- Publication number
- JP2007027248A JP2007027248A JP2005204188A JP2005204188A JP2007027248A JP 2007027248 A JP2007027248 A JP 2007027248A JP 2005204188 A JP2005204188 A JP 2005204188A JP 2005204188 A JP2005204188 A JP 2005204188A JP 2007027248 A JP2007027248 A JP 2007027248A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- group iii
- nitride semiconductor
- iii nitride
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Abstract
【解決手段】 成膜装置内に設置した基板上に、Al,Ga,Inの少なくともいずれか1種の原料ガス、p型不純物原料ガス、窒素原料ガス及びキャリアガスを用いてp型III族窒化物半導体層を成長させるp型III族窒化物半導体層の製造方法において、p型不純物を含むIII族窒化物半導体層を成長させる工程Aと、各原料ガスの供給を停止してIII族窒化物半導体層の成長を中断して成膜装置内の雰囲気ガスを不活性ガスに置換し、基板の温度を成長温度から降温させる工程Bと、再び基板の温度を昇温して、成膜装置内に原料ガス及びキャリアガスを供給し、III族窒化物半導体層の成長を再開する工程Cをとを具備し、工程A〜Cを複数回繰り返してp型III族窒化物半導体層を形成する。
【選択図】 図2
Description
102:GaNバッファ層
103:アンドープGaN層
104,104a〜104c:p型III族窒化物半導体層(p型GaN層)
105,105a,105b:p型III族窒化物半導体層(p型GaN層)
106:n型GaN層
107:InGaN層
108:InGaN層/GaN層(量子井戸層)
109:AlGaNキャップ層
110:GaNクラッド層
111:GaNコンタクト層
112:p型電極
113:n型電極
Claims (2)
- 成膜装置内に設置した基板上に、Al,Ga,Inの少なくともいずれか1種の原料ガス、p型不純物原料ガス、窒素原料ガス及びキャリアガスを用いてp型III族窒化物半導体層を成長させるp型III族窒化物半導体層の製造方法において、p型不純物を含むIII族窒化物半導体層を成長させる工程Aと、前記各原料ガスの供給を停止して前記III族窒化物半導体層の成長を中断して前記成膜装置内の雰囲気ガスを不活性ガスに置換し、前記基板の温度を成長温度から降温させる工程Bと、再び前記基板の温度を昇温して前記成膜装置内に前記原料ガス及び前記キャリアガスを供給し、前記III族窒化物半導体層の成長を再開する工程Cとを具備しており、これらの工程A〜Cを複数回繰り返して前記p型III族窒化物半導体層を形成することを特徴とするp型III族窒化物半導体層の製造方法。
- 請求項1記載のp型III族窒化物半導体層の製造方法によって製造したp型III族窒化物半導体層を含む半導体層を有していることを特徴とする発光素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005204188A JP2007027248A (ja) | 2005-07-13 | 2005-07-13 | p型III族窒化物半導体層の製造方法および発光素子 |
US11/485,232 US20070015306A1 (en) | 2005-07-13 | 2006-07-11 | Manufacturing method of P type group III nitride semiconductor layer and light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005204188A JP2007027248A (ja) | 2005-07-13 | 2005-07-13 | p型III族窒化物半導体層の製造方法および発光素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007027248A true JP2007027248A (ja) | 2007-02-01 |
Family
ID=37662141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005204188A Pending JP2007027248A (ja) | 2005-07-13 | 2005-07-13 | p型III族窒化物半導体層の製造方法および発光素子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070015306A1 (ja) |
JP (1) | JP2007027248A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009071034A (ja) * | 2007-09-13 | 2009-04-02 | Kaneka Corp | 薄膜光電変換装置及びその製造方法 |
WO2011004890A1 (ja) * | 2009-07-10 | 2011-01-13 | 昭和電工株式会社 | 半導体発光素子の製造方法およびランプ、電子機器、及び機械装置 |
JP2011018852A (ja) * | 2009-07-10 | 2011-01-27 | Showa Denko Kk | 半導体素子の製造方法およびランプ、電子機器、機械装置 |
JP2011023482A (ja) * | 2009-07-14 | 2011-02-03 | Showa Denko Kk | 半導体発光素子の製造方法およびランプ、電子機器、機械装置 |
KR20140137208A (ko) * | 2013-05-22 | 2014-12-02 | 서울바이오시스 주식회사 | 발광 소자 및 그것을 제조하는 방법 |
WO2016126912A1 (en) * | 2015-02-06 | 2016-08-11 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Defects annealing and impurities activation in semiconductors at thermodynamically non-stable conditions |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307458A (ja) * | 1998-04-23 | 1999-11-05 | Matsushita Electron Corp | 窒化物系化合物半導体の製造方法 |
JP2001320084A (ja) * | 2000-03-02 | 2001-11-16 | Ricoh Co Ltd | Iii族窒化物半導体およびその作製方法および半導体装置 |
JP2003031845A (ja) * | 2001-04-30 | 2003-01-31 | Lumileds Lighting Us Llc | 低抵抗率p型窒化ガリウムの形成 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4166885B2 (ja) * | 1998-05-18 | 2008-10-15 | 富士通株式会社 | 光半導体装置およびその製造方法 |
-
2005
- 2005-07-13 JP JP2005204188A patent/JP2007027248A/ja active Pending
-
2006
- 2006-07-11 US US11/485,232 patent/US20070015306A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307458A (ja) * | 1998-04-23 | 1999-11-05 | Matsushita Electron Corp | 窒化物系化合物半導体の製造方法 |
JP2001320084A (ja) * | 2000-03-02 | 2001-11-16 | Ricoh Co Ltd | Iii族窒化物半導体およびその作製方法および半導体装置 |
JP2003031845A (ja) * | 2001-04-30 | 2003-01-31 | Lumileds Lighting Us Llc | 低抵抗率p型窒化ガリウムの形成 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009071034A (ja) * | 2007-09-13 | 2009-04-02 | Kaneka Corp | 薄膜光電変換装置及びその製造方法 |
WO2011004890A1 (ja) * | 2009-07-10 | 2011-01-13 | 昭和電工株式会社 | 半導体発光素子の製造方法およびランプ、電子機器、及び機械装置 |
JP2011018852A (ja) * | 2009-07-10 | 2011-01-27 | Showa Denko Kk | 半導体素子の製造方法およびランプ、電子機器、機械装置 |
US8896085B2 (en) | 2009-07-10 | 2014-11-25 | Toyoda Gosei Co., Ltd. | Semiconductor light-emitting element manufacturing method, lamp, electronic equipment, and mechanical apparatus |
JP2011023482A (ja) * | 2009-07-14 | 2011-02-03 | Showa Denko Kk | 半導体発光素子の製造方法およびランプ、電子機器、機械装置 |
KR20140137208A (ko) * | 2013-05-22 | 2014-12-02 | 서울바이오시스 주식회사 | 발광 소자 및 그것을 제조하는 방법 |
KR102160068B1 (ko) | 2013-05-22 | 2020-09-25 | 서울바이오시스 주식회사 | 발광 소자 및 그것을 제조하는 방법 |
WO2016126912A1 (en) * | 2015-02-06 | 2016-08-11 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Defects annealing and impurities activation in semiconductors at thermodynamically non-stable conditions |
US9543168B2 (en) | 2015-02-06 | 2017-01-10 | The United States Of America, As Represented By The Secretary Of The Navy | Defects annealing and impurities activation in semiconductors at thermodynamically non-stable conditions |
Also Published As
Publication number | Publication date |
---|---|
US20070015306A1 (en) | 2007-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10283671B2 (en) | Method of producing III nitride semiconductor light-emitting device | |
JP5995302B2 (ja) | 窒化物半導体発光素子の製造方法 | |
KR101399250B1 (ko) | 질소 화합물 반도체 발광 소자 및 그 제조 방법 | |
KR100867518B1 (ko) | 질화물계 반도체 발광소자의 제조방법 | |
JP2011238971A (ja) | 窒化物半導体発光素子の製造方法 | |
JP2010080955A (ja) | 半導体装置 | |
JP2007027248A (ja) | p型III族窒化物半導体層の製造方法および発光素子 | |
JP2005159341A (ja) | III族窒化物p型半導体の製造方法およびIII族窒化物半導体発光素子 | |
JPH11112030A (ja) | 3−5族化合物半導体の製造方法 | |
JP2008235758A (ja) | 化合物半導体エピタキシャル基板の製造方法 | |
US8815621B2 (en) | Method of forming p-type gallium nitride based semiconductor, method of forming nitride semiconductor device, and method of forming epitaxial wafer | |
JP2004356522A (ja) | 3−5族化合物半導体、その製造方法及びその用途 | |
JP4720519B2 (ja) | p型窒化物半導体の製造方法 | |
JP2017117844A (ja) | 半導体発光素子およびその製造方法 | |
JP2005129923A (ja) | 窒化物半導体、それを用いた発光素子、発光ダイオード、レーザー素子およびランプ並びにそれらの製造方法 | |
JP2001102633A (ja) | 窒化物系化合物半導体発光素子の製造方法 | |
JP2007189028A (ja) | p型窒化ガリウム系半導体の製造方法及びAlGaInN系発光素子の製造方法 | |
JP2006128653A (ja) | 3−5族化合物半導体、その製造方法及びその用途 | |
JP2004363401A (ja) | 半導体素子の製造方法 | |
JP2005277342A (ja) | カーボンドープ半導体膜、半導体素子、及びこれらの製造方法 | |
JP4137223B2 (ja) | 化合物半導体の製造方法 | |
JP2013016863A (ja) | p型化合物半導体層の形成方法 | |
JP2008277650A (ja) | 窒化物系化合物半導体装置の製造方法 | |
JP5240171B2 (ja) | 窒化ガリウム系半導体、半導体光素子、半導体レーザ、発光ダイオード | |
JP2017117845A (ja) | 半導体発光素子およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080314 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101012 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101227 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110322 |