JP2006518104A5 - - Google Patents

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Publication number
JP2006518104A5
JP2006518104A5 JP2006502270A JP2006502270A JP2006518104A5 JP 2006518104 A5 JP2006518104 A5 JP 2006518104A5 JP 2006502270 A JP2006502270 A JP 2006502270A JP 2006502270 A JP2006502270 A JP 2006502270A JP 2006518104 A5 JP2006518104 A5 JP 2006518104A5
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JP
Japan
Prior art keywords
alloy
buffer structure
buffer
target material
structure according
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JP2006502270A
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English (en)
Japanese (ja)
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JP2006518104A (ja
JP4493646B2 (ja
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Priority claimed from GB0303784A external-priority patent/GB2398672A/en
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Publication of JP2006518104A publication Critical patent/JP2006518104A/ja
Publication of JP2006518104A5 publication Critical patent/JP2006518104A5/ja
Application granted granted Critical
Publication of JP4493646B2 publication Critical patent/JP4493646B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006502270A 2003-02-19 2004-02-16 後続のターゲット材堆積のためのシリコン基板を改質するバッファ構造および該バッファ構造を形成する方法 Expired - Fee Related JP4493646B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0303784A GB2398672A (en) 2003-02-19 2003-02-19 Group IIIA nitride buffer layers
PCT/GB2004/000560 WO2004075249A2 (en) 2003-02-19 2004-02-16 Buffer structure for modifying a silicon substrate

Publications (3)

Publication Number Publication Date
JP2006518104A JP2006518104A (ja) 2006-08-03
JP2006518104A5 true JP2006518104A5 (enExample) 2007-03-15
JP4493646B2 JP4493646B2 (ja) 2010-06-30

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ID=9953280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006502270A Expired - Fee Related JP4493646B2 (ja) 2003-02-19 2004-02-16 後続のターゲット材堆積のためのシリコン基板を改質するバッファ構造および該バッファ構造を形成する方法

Country Status (8)

Country Link
US (1) US7323764B2 (enExample)
EP (1) EP1595280B8 (enExample)
JP (1) JP4493646B2 (enExample)
CN (1) CN100382244C (enExample)
AT (1) ATE349774T1 (enExample)
DE (1) DE602004003910T2 (enExample)
GB (2) GB2398672A (enExample)
WO (1) WO2004075249A2 (enExample)

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EP1883103A3 (en) * 2006-07-27 2008-03-05 Interuniversitair Microelektronica Centrum Deposition of group III-nitrides on Ge
US7494911B2 (en) 2006-09-27 2009-02-24 Intel Corporation Buffer layers for device isolation of devices grown on silicon
US8106381B2 (en) * 2006-10-18 2012-01-31 Translucent, Inc. Semiconductor structures with rare-earths
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
US7799600B2 (en) 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
US8039738B2 (en) * 2007-07-26 2011-10-18 Translucent, Inc. Active rare earth tandem solar cell
US8039737B2 (en) * 2007-07-26 2011-10-18 Translucent, Inc. Passive rare earth tandem solar cell
US8049100B2 (en) * 2007-07-26 2011-11-01 Translucent, Inc. Multijunction rare earth solar cell
CA2742128C (en) * 2008-01-28 2016-11-29 Amit Goyal Semiconductor-based large-area flexible electronic devices
DE102009000514A1 (de) * 2009-01-30 2010-08-26 Robert Bosch Gmbh Verbundbauteil sowie Verfahren zum Herstellen eines Verbundbauteil
WO2010110489A1 (ja) * 2009-03-27 2010-09-30 Ｄｏｗａホールディングス株式会社 Iii族窒化物半導体成長用基板、iii族窒化物半導体エピタキシャル基板、iii族窒化物半導体素子およびiii族窒化物半導体自立基板、ならびに、これらの製造方法
GB2469448A (en) * 2009-04-14 2010-10-20 Qinetiq Ltd Strain Control in Semiconductor Devices
JP5614531B2 (ja) * 2010-03-12 2014-10-29 セイコーエプソン株式会社 液体噴射ヘッド及びそれを用いた液体噴射装置並びに圧電素子
WO2012074524A1 (en) 2010-12-01 2012-06-07 Alliance For Sustainable Energy, Llc Coincident site lattice-matched growth of semiconductors on substrates using compliant buffer layers
WO2012074523A1 (en) 2010-12-01 2012-06-07 Alliance For Sustainable Energy, Llc Methods of producing free-standing semiconductors using sacrificial buffer layers and recyclable substrates
KR101883840B1 (ko) * 2011-08-31 2018-08-01 엘지이노텍 주식회사 발광소자
US9178114B2 (en) 2011-09-29 2015-11-03 Manutius Ip, Inc. P-type doping layers for use with light emitting devices
US8853668B2 (en) 2011-09-29 2014-10-07 Kabushiki Kaisha Toshiba Light emitting regions for use with light emitting devices
US8698163B2 (en) 2011-09-29 2014-04-15 Toshiba Techno Center Inc. P-type doping layers for use with light emitting devices
US20130082274A1 (en) 2011-09-29 2013-04-04 Bridgelux, Inc. Light emitting devices having dislocation density maintaining buffer layers
US8664679B2 (en) 2011-09-29 2014-03-04 Toshiba Techno Center Inc. Light emitting devices having light coupling layers with recessed electrodes
US9012921B2 (en) 2011-09-29 2015-04-21 Kabushiki Kaisha Toshiba Light emitting devices having light coupling layers
US20130099357A1 (en) * 2011-10-21 2013-04-25 Rytis Dargis Strain compensated reo buffer for iii-n on silicon
US8394194B1 (en) * 2012-06-13 2013-03-12 Rytis Dargis Single crystal reo buffer on amorphous SiOx
CN104641453B (zh) * 2012-10-12 2018-03-30 住友电气工业株式会社 Iii族氮化物复合衬底及其制造方法以及制造iii族氮化物半导体器件的方法
CN103794460B (zh) * 2012-10-29 2016-12-21 中微半导体设备(上海)有限公司 用于半导体装置性能改善的涂层
TWI491068B (zh) * 2012-11-08 2015-07-01 Ind Tech Res Inst 氮化物半導體結構
KR101590309B1 (ko) * 2013-07-22 2016-01-29 엔지케이 인슐레이터 엘티디 복합 기판, 그 제조 방법, 기능 소자 및 종결정 기판
WO2017210629A1 (en) * 2016-06-02 2017-12-07 IQE, plc Rare earth interlayers for mechanically bonding dissimilar semiconductor wafers
KR102098572B1 (ko) * 2018-12-26 2020-04-08 한국세라믹기술원 에피택시 성장을 위한 기판 소재의 탐색 장치 및 방법 그리고 이를 구현하기 위한 프로그램을 기록한 기록매체
EP3786321A3 (de) 2019-08-27 2021-03-17 Albert-Ludwigs-Universität Freiburg Verfahren und vorrichtung zur herstellung einer schicht und damit versehenes substrat
US20240084479A1 (en) * 2021-01-19 2024-03-14 Alliance For Sustainable Energy, Llc Dynamic hvpe of compositionally graded buffer layers

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JP3813740B2 (ja) * 1997-07-11 2006-08-23 Ｔｄｋ株式会社 電子デバイス用基板
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JP3853942B2 (ja) * 1997-11-12 2006-12-06 昭和電工株式会社 エピタキシャルウェハ
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JP2002222803A (ja) * 2001-12-03 2002-08-09 Kyocera Corp 半導体製造用耐食性部材

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