JP2006510224A5 - - Google Patents

Download PDF

Info

Publication number
JP2006510224A5
JP2006510224A5 JP2004560802A JP2004560802A JP2006510224A5 JP 2006510224 A5 JP2006510224 A5 JP 2006510224A5 JP 2004560802 A JP2004560802 A JP 2004560802A JP 2004560802 A JP2004560802 A JP 2004560802A JP 2006510224 A5 JP2006510224 A5 JP 2006510224A5
Authority
JP
Japan
Prior art keywords
trace
integrated circuit
circuit assembly
substrate
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004560802A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006510224A (ja
JP4452627B2 (ja
Filing date
Publication date
Priority claimed from US10/317,661 external-priority patent/US7550842B2/en
Application filed filed Critical
Publication of JP2006510224A publication Critical patent/JP2006510224A/ja
Publication of JP2006510224A5 publication Critical patent/JP2006510224A5/ja
Application granted granted Critical
Publication of JP4452627B2 publication Critical patent/JP4452627B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004560802A 2002-12-12 2003-12-12 集積回路アセンブリ Expired - Fee Related JP4452627B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/317,661 US7550842B2 (en) 2002-12-12 2002-12-12 Integrated circuit assembly
PCT/US2003/039537 WO2004055895A1 (en) 2002-12-12 2003-12-12 Integrated circuit assembly

Publications (3)

Publication Number Publication Date
JP2006510224A JP2006510224A (ja) 2006-03-23
JP2006510224A5 true JP2006510224A5 (enExample) 2009-11-05
JP4452627B2 JP4452627B2 (ja) 2010-04-21

Family

ID=32506187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004560802A Expired - Fee Related JP4452627B2 (ja) 2002-12-12 2003-12-12 集積回路アセンブリ

Country Status (8)

Country Link
US (1) US7550842B2 (enExample)
EP (1) EP1573815A1 (enExample)
JP (1) JP4452627B2 (enExample)
KR (1) KR101062260B1 (enExample)
CN (1) CN100530640C (enExample)
AU (1) AU2003299608A1 (enExample)
TW (1) TWI339435B (enExample)
WO (1) WO2004055895A1 (enExample)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7750446B2 (en) 2002-04-29 2010-07-06 Interconnect Portfolio Llc IC package structures having separate circuit interconnection structures and assemblies constructed thereof
EP1506568B1 (en) * 2002-04-29 2016-06-01 Samsung Electronics Co., Ltd. Direct-connect signaling system
US8324725B2 (en) * 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
US7663216B2 (en) * 2005-11-02 2010-02-16 Sandisk Corporation High density three dimensional semiconductor die package
US20070241441A1 (en) * 2006-04-17 2007-10-18 Stats Chippac Ltd. Multichip package system
US7569421B2 (en) * 2007-05-04 2009-08-04 Stats Chippac, Ltd. Through-hole via on saw streets
US7723157B2 (en) * 2007-12-28 2010-05-25 Walton Advanced Engineering, Inc. Method for cutting and molding in small windows to fabricate semiconductor packages
TWI370714B (en) * 2008-01-09 2012-08-11 Ind Tech Res Inst Circuit structure and menufacturing method thereof
US7643305B2 (en) * 2008-03-07 2010-01-05 Qualcomm Mems Technologies, Inc. System and method of preventing damage to metal traces of flexible printed circuits
JP2010287733A (ja) * 2009-06-11 2010-12-24 Elpida Memory Inc 半導体装置
KR20110082643A (ko) * 2010-01-12 2011-07-20 삼성전자주식회사 반도체 칩의 실장 기판 및 이를 갖는 반도체 패키지
JP2011155203A (ja) * 2010-01-28 2011-08-11 Elpida Memory Inc 半導体装置
US8786083B2 (en) * 2010-09-16 2014-07-22 Tessera, Inc. Impedance controlled packages with metal sheet or 2-layer RDL
US9136197B2 (en) 2010-09-16 2015-09-15 Tessera, Inc. Impedence controlled packages with metal sheet or 2-layer RDL
US9153530B2 (en) * 2011-06-16 2015-10-06 Broadcom Corporation Thermal enhanced high density flip chip package
US8823165B2 (en) 2011-07-12 2014-09-02 Invensas Corporation Memory module in a package
US8513817B2 (en) 2011-07-12 2013-08-20 Invensas Corporation Memory module in a package
US8502390B2 (en) 2011-07-12 2013-08-06 Tessera, Inc. De-skewed multi-die packages
US8917532B2 (en) 2011-10-03 2014-12-23 Invensas Corporation Stub minimization with terminal grids offset from center of package
US8659139B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
US8610260B2 (en) 2011-10-03 2013-12-17 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
US8513813B2 (en) 2011-10-03 2013-08-20 Invensas Corporation Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
KR20140085497A (ko) 2011-10-03 2014-07-07 인벤사스 코포레이션 직교 윈도가 있는 멀티-다이 와이어본드 어셈블리를 위한 스터브 최소화
US8659142B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization for wirebond assemblies without windows
US8436457B2 (en) * 2011-10-03 2013-05-07 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
US8441111B2 (en) * 2011-10-03 2013-05-14 Invensas Corporation Stub minimization for multi-die wirebond assemblies with parallel windows
KR101894823B1 (ko) 2011-10-03 2018-09-04 인벤사스 코포레이션 평행한 윈도우를 갖는 다중-다이 와이어 본드 어셈블리를 위한 스터브 최소화
TWI528500B (zh) 2012-03-20 2016-04-01 鈺創科技股份有限公司 包裹式記憶體和用於製造具有一外部輸入輸出匯流排的包裹式記憶體 的製造方法
US8848392B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support module and microelectronic assembly
US8787034B2 (en) 2012-08-27 2014-07-22 Invensas Corporation Co-support system and microelectronic assembly
US9368477B2 (en) 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
US8848391B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support component and microelectronic assembly
US9019710B2 (en) 2012-10-11 2015-04-28 Apple Inc. Devices having flexible printed circuits with bent stiffeners
US9601557B2 (en) 2012-11-16 2017-03-21 Apple Inc. Flexible display
US20140191403A1 (en) * 2013-01-07 2014-07-10 Lsi Corporation Multi-die semiconductor package and method of manufacturing thereof
US9070423B2 (en) 2013-06-11 2015-06-30 Invensas Corporation Single package dual channel memory with co-support
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판
US9123555B2 (en) 2013-10-25 2015-09-01 Invensas Corporation Co-support for XFD packaging
US9281296B2 (en) 2014-07-31 2016-03-08 Invensas Corporation Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design
US10153238B2 (en) * 2014-08-20 2018-12-11 Samsung Display Co., Ltd. Electrical channel including pattern voids
US9691437B2 (en) 2014-09-25 2017-06-27 Invensas Corporation Compact microelectronic assembly having reduced spacing between controller and memory packages
US9600112B2 (en) * 2014-10-10 2017-03-21 Apple Inc. Signal trace patterns for flexible substrates
US10154583B1 (en) 2015-03-27 2018-12-11 Flex Ltd Mechanical strain reduction on flexible and rigid-flexible circuits
US9484080B1 (en) 2015-11-09 2016-11-01 Invensas Corporation High-bandwidth memory application with controlled impedance loading
US9992880B2 (en) 2015-11-12 2018-06-05 Multek Technologies Limited Rigid-bend printed circuit board fabrication
US9679613B1 (en) 2016-05-06 2017-06-13 Invensas Corporation TFD I/O partition for high-speed, high-density applications
US9747934B1 (en) * 2016-09-13 2017-08-29 Seagate Technology Llc Flexible dynamic loop with back-side impedance control structures
KR102708773B1 (ko) 2016-12-26 2024-09-23 엘지디스플레이 주식회사 플렉서블 표시장치
TWI652983B (zh) 2018-04-16 2019-03-01 緯創資通股份有限公司 電子裝置及電磁遮蔽裝置
KR102620865B1 (ko) * 2018-12-03 2024-01-04 에스케이하이닉스 주식회사 반도체 패키지
KR102538705B1 (ko) * 2018-12-04 2023-06-01 에스케이하이닉스 주식회사 반도체 패키지
WO2023059519A2 (en) * 2021-10-04 2023-04-13 Formfactor, Inc. Thermal management techniques for high power integrated circuits operating in dry cryogenic environments
US12489061B2 (en) * 2022-06-27 2025-12-02 Texas Instruments Incorporated Semiconductor device with multiple dies

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423497A (en) * 1965-12-03 1995-06-13 Shorts Missile Systems Limited Control systems for moving bodies
DE3911711A1 (de) 1989-04-10 1990-10-11 Ibm Modul-aufbau mit integriertem halbleiterchip und chiptraeger
GB8918482D0 (en) 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US6219908B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
US5243497A (en) 1992-09-29 1993-09-07 Texas Instruments Chip on board assembly
JPH06151685A (ja) 1992-11-04 1994-05-31 Mitsubishi Electric Corp Ｍｃｐ半導体装置
US5602421A (en) * 1995-01-31 1997-02-11 Hughes Aircraft Company Microwave monolithic integrated circuit package with improved RF ports
KR0177395B1 (ko) * 1995-04-27 1999-05-15 문정환 반도체소자를 칩 상태로 장착시켜서 된 전자회로 보드 및 그 제조방법
KR0144164B1 (ko) * 1995-05-12 1998-07-01 문정환 엘오씨 반도체 패키지 및 반도체 장치를 패키징하는 방법
US5818698A (en) 1995-10-12 1998-10-06 Micron Technology, Inc. Method and apparatus for a chip-on-board semiconductor module
US6667560B2 (en) 1996-05-29 2003-12-23 Texas Instruments Incorporated Board on chip ball grid array
US5723907A (en) * 1996-06-25 1998-03-03 Micron Technology, Inc. Loc simm
US5811879A (en) 1996-06-26 1998-09-22 Micron Technology, Inc. Stacked leads-over-chip multi-chip module
US6017776A (en) * 1997-04-29 2000-01-25 Micron Technology, Inc. Method of attaching a leadframe to singulated semiconductor dice
US5899705A (en) * 1997-11-20 1999-05-04 Akram; Salman Stacked leads-over chip multi-chip module
US6049129A (en) * 1997-12-19 2000-04-11 Texas Instruments Incorporated Chip size integrated circuit package
US5998860A (en) * 1997-12-19 1999-12-07 Texas Instruments Incorporated Double sided single inline memory module
US6249052B1 (en) * 1998-06-01 2001-06-19 Paul T. Lin Substrate on chip (SOC) multiple-chip module (MCM) with chip-size-package (CSP) ready configuration
TW368707B (en) * 1998-10-27 1999-09-01 Tech Field Co Ltd Packaging method for semiconductor die and the product of the same
US6455354B1 (en) 1998-12-30 2002-09-24 Micron Technology, Inc. Method of fabricating tape attachment chip-on-board assemblies
US6351028B1 (en) * 1999-02-08 2002-02-26 Micron Technology, Inc. Multiple die stack apparatus employing T-shaped interposer elements
US6856013B1 (en) * 1999-02-19 2005-02-15 Micron Technology, Inc. Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit
JP2000315776A (ja) 1999-05-06 2000-11-14 Hitachi Ltd 半導体装置
US6387732B1 (en) * 1999-06-18 2002-05-14 Micron Technology, Inc. Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
US6825550B2 (en) * 1999-09-02 2004-11-30 Micron Technology, Inc. Board-on-chip packages with conductive foil on the chip surface
US6534861B1 (en) 1999-11-15 2003-03-18 Substrate Technologies Incorporated Ball grid substrate for lead-on-chip semiconductor package
KR20010064907A (ko) * 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
US6404660B1 (en) 1999-12-23 2002-06-11 Rambus, Inc. Semiconductor package with a controlled impedance bus and method of forming same
JP2001223324A (ja) * 2000-02-10 2001-08-17 Mitsubishi Electric Corp 半導体装置
JP2001274323A (ja) * 2000-03-24 2001-10-05 Hitachi Ltd 半導体装置とそれを搭載した半導体モジュール、および半導体装置の製造方法
US6522018B1 (en) 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
US6683377B1 (en) * 2000-05-30 2004-01-27 Amkor Technology, Inc. Multi-stacked memory package
KR100608608B1 (ko) * 2000-06-23 2006-08-09 삼성전자주식회사 혼합형 본딩패드 구조를 갖는 반도체 칩 패키지 및 그제조방법
JP2002074985A (ja) 2000-08-29 2002-03-15 Mitsubishi Electric Corp メモリモジュールおよびその製造方法ならびにそれに使用するテストコネクタ
US20020043709A1 (en) * 2000-10-13 2002-04-18 Yeh Nai Hua Stackable integrated circuit
JP3652598B2 (ja) 2000-11-22 2005-05-25 本田技研工業株式会社 内燃機関
US6680212B2 (en) * 2000-12-22 2004-01-20 Lucent Technologies Inc Method of testing and constructing monolithic multi-chip modules
US6680213B2 (en) * 2001-04-02 2004-01-20 Micron Technology, Inc. Method and system for fabricating contacts on semiconductor components
US6706624B1 (en) * 2001-10-31 2004-03-16 Lockheed Martin Corporation Method for making multichip module substrates by encapsulating electrical conductors
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
US6987031B2 (en) * 2002-08-27 2006-01-17 Micron Technology, Inc. Multiple chip semiconductor package and method of fabricating same
US7323772B2 (en) * 2002-08-28 2008-01-29 Micron Technology, Inc. Ball grid array structures and tape-based method of manufacturing same
US6879030B2 (en) * 2002-09-30 2005-04-12 Ultratera Corporation Strengthened window-type semiconductor package

Similar Documents

Publication Publication Date Title
JP2006510224A5 (enExample)
EP1501340A3 (en) Flexible substrate and electronic device
JP2004063767A5 (enExample)
JP2007525842A5 (enExample)
EP1577942A3 (en) Device with through-hole interconnection and method for manufacturing the same
MY122959A (en) Stacked microelectronic packages
EP1580568A3 (en) Semiconductor device, magnetic sensor, and magnetic sensor unit
CN1050452C (zh) 机动车控制装置
DE602006011380D1 (de) Sensor und Führungsdraht zur intravaskulären Druckmessung
EP1881365A3 (en) Display substrate and display device having the same
EP2261970A3 (en) Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
EP1381042A3 (en) Recording / reproducing head and method of producing the same
EP1868422A3 (en) Electronic component built-in substrate and method of manufacturing the same
WO2009050843A1 (ja) 電子デバイス
DE602005021779D1 (de) Biegsame druckkopfleiterplatte
EP1498948A3 (en) A reconnectable chip interface and chip package
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
JP2004507834A5 (enExample)
EP1164661A3 (en) Connecting structure of flat circuit member
WO2009069253A1 (ja) 圧電デバイスとこれを用いた電子機器、及び自動車
EP1926144A3 (en) Semiconductor device and manufacturing method thereof
WO2005045997A3 (en) An electrical circuit assembly with improved shock resistance
JP2570584B2 (ja) 半導体装置
ATE551878T1 (de) Leiterplatte oder platine mit heizdraht
EP1387606A3 (en) Device for controlling a vehicle