JP2006352064A - Ｌｅｄランプ及びｌｅｄランプ装置 - Google Patents

Ｌｅｄランプ及びｌｅｄランプ装置 Download PDF

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Publication number
JP2006352064A
JP2006352064A JP2005379514A JP2005379514A JP2006352064A JP 2006352064 A JP2006352064 A JP 2006352064A JP 2005379514 A JP2005379514 A JP 2005379514A JP 2005379514 A JP2005379514 A JP 2005379514A JP 2006352064 A JP2006352064 A JP 2006352064A
Authority
JP
Japan
Prior art keywords
lead
led lamp
led
led chip
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005379514A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006352064A5 (enExample
Inventor
Kazuji Noda
和司 野田
Takayuki Kamiya
孝行 神谷
Yoshio Sano
良男 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005379514A priority Critical patent/JP2006352064A/ja
Priority to US11/435,278 priority patent/US20060261362A1/en
Publication of JP2006352064A publication Critical patent/JP2006352064A/ja
Publication of JP2006352064A5 publication Critical patent/JP2006352064A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2005379514A 2005-05-19 2005-12-28 Ｌｅｄランプ及びｌｅｄランプ装置 Withdrawn JP2006352064A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005379514A JP2006352064A (ja) 2005-05-19 2005-12-28 Ｌｅｄランプ及びｌｅｄランプ装置
US11/435,278 US20060261362A1 (en) 2005-05-19 2006-05-17 LED lamp and LED lamp apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005146280 2005-05-19
JP2005379514A JP2006352064A (ja) 2005-05-19 2005-12-28 Ｌｅｄランプ及びｌｅｄランプ装置

Publications (2)

Publication Number Publication Date
JP2006352064A true JP2006352064A (ja) 2006-12-28
JP2006352064A5 JP2006352064A5 (enExample) 2008-03-13

Family

ID=37447543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005379514A Withdrawn JP2006352064A (ja) 2005-05-19 2005-12-28 Ｌｅｄランプ及びｌｅｄランプ装置

Country Status (2)

Country Link
US (1) US20060261362A1 (enExample)
JP (1) JP2006352064A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087868A1 (ja) * 2007-01-15 2008-07-24 Showa Denko K.K. 発光ダイオードパッケージ及び発光ダイオードパッケージ用のリード群構造
JP2013115368A (ja) * 2011-11-30 2013-06-10 Rohm Co Ltd Ｌｅｄモジュール

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4946363B2 (ja) 2005-12-07 2012-06-06 豊田合成株式会社 Ｌｅｄランプ装置およびｌｅｄランプ装置用のメタル基板パッケージ
JP4840067B2 (ja) * 2006-10-11 2011-12-21 豊田合成株式会社 Ｌｅｄランプ装置
KR101346342B1 (ko) * 2007-03-30 2013-12-31 서울반도체 주식회사 낮은 열저항을 갖는 발광 다이오드 램프
CN101304059B (zh) * 2007-05-09 2010-09-08 富士迈半导体精密工业（上海）有限公司 发光二极管组件及发光二极管显示装置
CN201327829Y (zh) * 2008-12-03 2009-10-14 木林森电子有限公司 整流发光二极管装置
CN102769097A (zh) * 2012-05-21 2012-11-07 王定锋 带贴片电阻的led支架和led器件和制造方法
CN104566220A (zh) * 2015-01-04 2015-04-29 广东中电创成科技有限公司 新型led灯结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609475A (en) * 1970-05-04 1971-09-28 Hewlett Packard Co Light-emitting diode package with dual-colored plastic encapsulation
US4045814A (en) * 1973-08-15 1977-08-30 System Development Corporation Method and apparatus for scrambling and unscrambling communication signals
JPS5871671A (ja) * 1981-10-23 1983-04-28 Idec Izumi Corp 発光ダイオ−ドランプ
US4984057A (en) * 1989-05-01 1991-01-08 Adam Mii Semiconductor element string structure
JPH04365382A (ja) * 1991-06-13 1992-12-17 Toshiba Corp 半導体発光装置及びその駆動方法
DE19526313C2 (de) * 1995-07-19 2000-01-27 Preh Elektro Feinmechanik Diodenfassung für LED mit Steckverbindung und Vorwiderstand und Verfahren zu deren Herstellung
US6054716A (en) * 1997-01-10 2000-04-25 Rohm Co., Ltd. Semiconductor light emitting device having a protecting device
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
DE10260683B4 (de) * 2001-12-26 2008-10-02 Toyoda Gosei Co., Ltd. LED-Leuchtvorrichtung
JP2006286699A (ja) * 2005-03-31 2006-10-19 Toyoda Gosei Co Ltd Ｌｅｄランプ装置及びその製造方法。
TWM279026U (en) * 2005-07-01 2005-10-21 Wan-Shuen Jou Base for surface-mount-type LED

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087868A1 (ja) * 2007-01-15 2008-07-24 Showa Denko K.K. 発光ダイオードパッケージ及び発光ダイオードパッケージ用のリード群構造
JP2008172152A (ja) * 2007-01-15 2008-07-24 Showa Denko Kk 発光ダイオードパッケージ及び発光ダイオードパッケージ用のリード群構造
US7875899B2 (en) 2007-01-15 2011-01-25 Showa Denko K.K. Light-emitting diode package and lead group structure for light-emitting diode package
JP2013115368A (ja) * 2011-11-30 2013-06-10 Rohm Co Ltd Ｌｅｄモジュール

Also Published As

Publication number Publication date
US20060261362A1 (en) 2006-11-23

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