JP2006332269A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2006332269A
JP2006332269A JP2005152753A JP2005152753A JP2006332269A JP 2006332269 A JP2006332269 A JP 2006332269A JP 2005152753 A JP2005152753 A JP 2005152753A JP 2005152753 A JP2005152753 A JP 2005152753A JP 2006332269 A JP2006332269 A JP 2006332269A
Authority
JP
Japan
Prior art keywords
light
emission
wavelength
emitting device
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005152753A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006332269A5 (enExample
Inventor
Takayoshi Yajima
孝義 矢嶋
Takemasa Yasukawa
武正 安川
Ryoichi Toumon
領一 東門
Takashi Nonokawa
貴志 野々川
Makoto Ishida
真 石田
Akio Namiki
明生 並木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005152753A priority Critical patent/JP2006332269A/ja
Publication of JP2006332269A publication Critical patent/JP2006332269A/ja
Publication of JP2006332269A5 publication Critical patent/JP2006332269A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2005152753A 2005-05-25 2005-05-25 発光装置 Withdrawn JP2006332269A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005152753A JP2006332269A (ja) 2005-05-25 2005-05-25 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005152753A JP2006332269A (ja) 2005-05-25 2005-05-25 発光装置

Publications (2)

Publication Number Publication Date
JP2006332269A true JP2006332269A (ja) 2006-12-07
JP2006332269A5 JP2006332269A5 (enExample) 2007-12-06

Family

ID=37553655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005152753A Withdrawn JP2006332269A (ja) 2005-05-25 2005-05-25 発光装置

Country Status (1)

Country Link
JP (1) JP2006332269A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007191680A (ja) * 2005-09-01 2007-08-02 Sharp Corp 発光装置
JP2008166825A (ja) * 2007-01-02 2008-07-17 Samsung Electro Mech Co Ltd 白色発光装置及びこれを用いたｌｃｄバックライト用光源モジュール
JP2008243904A (ja) * 2007-03-26 2008-10-09 Toshiba Corp 半導体発光素子およびその製造方法ならびに発光装置
JP2008270781A (ja) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp 発光装置
JP2009198544A (ja) * 2008-02-19 2009-09-03 Toyoda Gosei Co Ltd 光デバイス及びその製造方法
WO2009144922A1 (ja) * 2008-05-30 2009-12-03 株式会社 東芝 白色ｌｅｄおよびそれを用いたバックライトならびに液晶表示装置
JP2011238973A (ja) * 2011-08-26 2011-11-24 Toshiba Corp 半導体発光素子および発光装置
US8513872B2 (en) 2010-08-05 2013-08-20 Sharp Kabushiki Kaisha Light emitting apparatus and method for manufacturing thereof
US8663498B2 (en) 2006-11-24 2014-03-04 Sharp Kabushiki Kaisha Phosphor, method of producing the same, and light emitting apparatus
US8729788B2 (en) 2005-05-30 2014-05-20 Sharp Kabushiki Kaisha Light emitting device provided with a wavelength conversion unit incorporating plural kinds of phosphors
KR101538333B1 (ko) * 2014-04-10 2015-07-22 (주)씨티엘 칩 스케일 led 패키지
US9624426B2 (en) 2011-08-04 2017-04-18 Philips Lighting Holding B.V. Light converter and lighting unit comprising such light converter
US11380825B2 (en) 2018-05-22 2022-07-05 Ushio Denki Kabushiki Kaisha Light emitting element

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008644B2 (en) 2005-05-30 2018-06-26 Sharp Kabushiki Kaisha Light emitting device and fabricating method thereof
US9281456B2 (en) 2005-05-30 2016-03-08 Sharp Kabushiki Kaisha Light emitting device and fabricating method thereof
US9722149B2 (en) 2005-05-30 2017-08-01 Sharp Kabushiki Kaisha Light emitting device and fabricating method thereof
US8729788B2 (en) 2005-05-30 2014-05-20 Sharp Kabushiki Kaisha Light emitting device provided with a wavelength conversion unit incorporating plural kinds of phosphors
JP2007191680A (ja) * 2005-09-01 2007-08-02 Sharp Corp 発光装置
US8663498B2 (en) 2006-11-24 2014-03-04 Sharp Kabushiki Kaisha Phosphor, method of producing the same, and light emitting apparatus
US9624427B2 (en) 2006-11-24 2017-04-18 Ge Phosphors Technology, Llc Phosphor, method of producing the same, and light emitting apparatus
US9884990B2 (en) 2006-11-24 2018-02-06 Ge Phosphors Technology, Llc Phosphor, method of producing the same, and light emitting apparatus
US10259997B2 (en) 2006-11-24 2019-04-16 Ge Phosphors Technology, Llc Phosphor, method of producing the same, and light emitting apparatus
KR100946015B1 (ko) * 2007-01-02 2010-03-09 삼성전기주식회사 백색 발광장치 및 이를 이용한 ｌｃｄ 백라이트용 광원모듈
CN101834266A (zh) * 2007-01-02 2010-09-15 三星电机株式会社 发光装置、用于液晶显示器背光的光源模块及液晶显示器
JP2008166825A (ja) * 2007-01-02 2008-07-17 Samsung Electro Mech Co Ltd 白色発光装置及びこれを用いたｌｃｄバックライト用光源モジュール
JP2008270781A (ja) * 2007-03-23 2008-11-06 Toshiba Lighting & Technology Corp 発光装置
JP2008243904A (ja) * 2007-03-26 2008-10-09 Toshiba Corp 半導体発光素子およびその製造方法ならびに発光装置
JP2009198544A (ja) * 2008-02-19 2009-09-03 Toyoda Gosei Co Ltd 光デバイス及びその製造方法
WO2009144922A1 (ja) * 2008-05-30 2009-12-03 株式会社 東芝 白色ｌｅｄおよびそれを用いたバックライトならびに液晶表示装置
US8288937B2 (en) 2008-05-30 2012-10-16 Kabushiki Kaisha Toshiba White LED, and backlight and liquid crystal display device using the same
US8513872B2 (en) 2010-08-05 2013-08-20 Sharp Kabushiki Kaisha Light emitting apparatus and method for manufacturing thereof
US9624426B2 (en) 2011-08-04 2017-04-18 Philips Lighting Holding B.V. Light converter and lighting unit comprising such light converter
JP2011238973A (ja) * 2011-08-26 2011-11-24 Toshiba Corp 半導体発光素子および発光装置
KR101538333B1 (ko) * 2014-04-10 2015-07-22 (주)씨티엘 칩 스케일 led 패키지
US11380825B2 (en) 2018-05-22 2022-07-05 Ushio Denki Kabushiki Kaisha Light emitting element

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