JP2006324401A5 - - Google Patents

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Publication number
JP2006324401A5
JP2006324401A5 JP2005145355A JP2005145355A JP2006324401A5 JP 2006324401 A5 JP2006324401 A5 JP 2006324401A5 JP 2005145355 A JP2005145355 A JP 2005145355A JP 2005145355 A JP2005145355 A JP 2005145355A JP 2006324401 A5 JP2006324401 A5 JP 2006324401A5
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JP
Japan
Prior art keywords
mold resin
chip
resin
semiconductor element
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2005145355A
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English (en)
Japanese (ja)
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JP2006324401A (ja
JP4463146B2 (ja
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Priority to JP2005145355A priority Critical patent/JP4463146B2/ja
Priority claimed from JP2005145355A external-priority patent/JP4463146B2/ja
Publication of JP2006324401A publication Critical patent/JP2006324401A/ja
Publication of JP2006324401A5 publication Critical patent/JP2006324401A5/ja
Application granted granted Critical
Publication of JP4463146B2 publication Critical patent/JP4463146B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005145355A 2005-05-18 2005-05-18 半導体装置の製造方法 Expired - Lifetime JP4463146B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005145355A JP4463146B2 (ja) 2005-05-18 2005-05-18 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005145355A JP4463146B2 (ja) 2005-05-18 2005-05-18 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006324401A JP2006324401A (ja) 2006-11-30
JP2006324401A5 true JP2006324401A5 (enExample) 2007-11-29
JP4463146B2 JP4463146B2 (ja) 2010-05-12

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ID=37543865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005145355A Expired - Lifetime JP4463146B2 (ja) 2005-05-18 2005-05-18 半導体装置の製造方法

Country Status (1)

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JP (1) JP4463146B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101963271B1 (ko) * 2014-01-28 2019-07-31 삼성전기주식회사 파워모듈 패키지 및 그 제조방법
DE112014006660B4 (de) * 2014-05-12 2019-10-31 Mitsubishi Electric Corporation Leistungshalbleiteranordnung und Verfahren zum Herstellen derselben
CN108604578B (zh) * 2016-02-09 2021-07-16 三菱电机株式会社 电力用半导体装置及其制造方法
CN108701661A (zh) 2016-03-07 2018-10-23 三菱电机株式会社 半导体装置及半导体装置的制造方法
JP6667401B2 (ja) * 2016-08-19 2020-03-18 三菱電機株式会社 電力用半導体装置の製造方法
CN109300795B (zh) * 2018-09-27 2020-05-19 江苏矽智半导体科技有限公司 一种半导体功率器件封装及其制备方法
EP4080551B1 (en) * 2021-04-21 2025-07-09 Hitachi Energy Ltd Semiconductor power module and method for manufacturing a semiconductor power module and semiconductor power device
CN115763381B (zh) * 2022-11-17 2024-03-08 海信家电集团股份有限公司 智能功率模块和设备

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