JP2006315695A - Fixing carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fixing carrier capable of adequately transporting a mounted article to be easily damaged, and a member required to be fixed. <P>SOLUTION: The fixing carrier is equipped with a base material 1, and a holding layer 10 which is laminated and covered on the surface of the base material 1, capable of attachably/detachably and adhesively holding a semi-conductor wafer, and deformable in an uneven manner. A plurality of projections are protruded from the surface except a peripheral edge of the base material 1 to bring their tip face into contact with a back surface of the holding layer 10. A feeding-discharging hole communicating with a partition space between the plurality of projections and the holding layer 10 is formed in the base material 1. A plurality of non-adhesive lines 12 are formed on a part of a deformation area 11 of the holding layer 10. Since the non-adhesive lines 12 not stuck to the semi-conductor wafer are formed, an air flowing passage is securely and rapidly formed between the surface of the holding layer 10 and the semi-conductor wafer during the deformation of the holding layer 10, enabling the detachment of the semi-conductor wafer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a fixed carrier for detachably holding a substrate typified by a semiconductor wafer or quartz glass, a printed wiring board, a chip component, a member that is difficult to handle by itself, a member that requires temporary fixing in the process, and the like. is there.

In recent years, the diameter of a semiconductor wafer has been increased from 200 mm to 300 mm. This 300 mm type semiconductor wafer has a laminated structure after a circuit is formed on the surface and a back grind tape is attached to the circuit forming surface. In view of package requirements, the back side is thin and back-ground.
In this way, the semiconductor wafer to which the back grind tape is adhered is transported to another factory, converted into an IC chip, and subjected to processing such as bonding and sealing while mounted on a dedicated carrier (see Patent Document 1). .
JP 59-227195 A

The conventional processing of semiconductor wafers and chips is as described above, and the back-ground semiconductor wafers are very easy to break and warp, so it is very difficult to transport them properly without damaging other factories. There's a problem. As a means for solving this problem, a method of using the above-described dedicated carrier can be considered, but this carrier is a dedicated product used for transportation in the factory to the last, taking into account harsh transportation conditions etc. It is not a thing. Therefore, it cannot be used for long-time transportation from factory to factory.

  Further, conventionally, if the back grind tape is adhered for a long time during transportation from factory to factory, there is a high possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit.

  The present invention has been made in view of the above, and an object thereof is to provide a fixed carrier capable of appropriately transporting an article to be mounted that is easily damaged or a member that needs to be fixed.

In the present invention, in order to solve the above-described problem, the substrate includes a base material and a deformable holding layer that is provided on the base material so as to detachably hold the article to be mounted.
The substrate is provided with a plurality of protrusions and the tip thereof is brought into contact with the holding layer, and a supply / discharge hole connected to a partition space between the plurality of protrusions and the holding layer is provided, so that at least one of the deformation regions of the holding layer is provided. It is characterized by non-adhesive treatment of the part.
In addition, it is preferable to make the deformation | transformation area | region of a holding layer into the surface in the non-contact part of the holding layer which does not contact the front-end | tip part of each processus | protrusion.

  Here, the base material and the fixed carrier in the claims can be formed in a substantially circular plane, a substantially elliptical shape, a substantially rectangular shape, a substantially polygonal shape, etc., and may be stored in a storage container for a substrate. It does n’t have to be. The mounted article includes at least one precision substrate, liquid crystal glass, quartz glass, photomask, circuit board, chip component, inspection lead frame, various types of paper, thin electronic components, and the like. When the article to be mounted is a precision substrate, semiconductor wafers (Si wafer or GaP wafer) having a diameter of 300 mm, 400 mm, or 450 mm are included. For the holding layer, various elastomers and rubbers having flexibility can be used.

  The protrusion can be formed in a cylindrical shape, a prismatic shape, a truncated cone shape, a truncated pyramid shape, etc., and is not particularly limited to a hollow shape or a solid shape. A single or a plurality of supply / discharge holes may be used. Further, at least a part of the deformation region of the holding layer is a single or plural straight line, cross shape, X shape, spiral shape, lattice shape, polka dot pattern, turtle shell connection type, scale connection type, universal connection type connection pattern, or these A non-adhesive process is performed on a pattern combining the above, or a non-adhesive process is performed to display a company name, a predetermined character, character, or the like.

  The non-adhesive treatment may be performed at least in a size and range that triggers removal of the article to be mounted. Furthermore, the fixed carrier according to the present invention can be used not only when transporting from a factory to another factory, but also when transporting an article to be mounted in the factory.

  According to the present invention, if the article to be mounted is mounted on the holding layer of the fixed carrier and pressed, the article to be mounted can be held on the holding layer on the substrate. At this time, since the article to be mounted is in close contact with the fixed carrier, even if it is thin, it is less likely to bend and warp downward.

According to the present invention, it is possible to appropriately move, transport, transport, transport, etc., an article to be mounted that is easily damaged.
Further, if the deformation region of the holding layer is the surface of the non-contact portion of the holding layer that does not contact the tip of each protrusion, and at least a part of the deformation region is subjected to non-adhesive treatment, the holding layer is deformed when the holding layer is deformed. An air flow path can be quickly formed between the non-adhesive treatment portion and the mounted article, and can be used as a trigger for removing the mounted article.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 14, a fixed carrier in the present embodiment includes a planar circular base material 1 having rigidity, and the base material. And a holding layer 10 which is elastically deformed into irregularities for detachably sticking and holding a 300 mm (12 inch) type thin semiconductor wafer 20 that is laminated and coated on the surface 3 of the substrate 1. Stored.

  The total thickness of the fixed carrier is in the range of 0.3 to 2.5 mm, preferably in the range of 0.5 to 1.2 mm. As long as the thickness of the fixed carrier falls within the range, sufficient reinforcement can be secured with respect to the semiconductor wafer 20, and when stored in the substrate storage container 30 or taken out, the fork of a dedicated robot (not shown) can be used. This is because a sufficient insertion interval can be secured. In addition, it is possible to reduce the weight of the fixed carrier.

  As shown in FIGS. 1 to 4, the substrate 1 is formed into a thin plate having rigidity using a predetermined material so that the substrate 1 can be securely stored in the substrate storage container 30, and has the same size as the semiconductor wafer 20. On the other hand, it is a slightly enlarged disk. The material of the substrate 1 is not particularly limited, and examples thereof include polycarbonate, polypropylene, polyethylene, acrylic resin, vinyl chloride, aluminum alloy, magnesium alloy, glass, stainless steel and the like which are excellent in impact resistance.

  The surface 3 excluding the peripheral edge 2 of the substrate 1 is formed to be shallow and recessed, and a plurality of projections 4 protrude upward from the recessed surface 3 so that the flat front end surface 5 contacts the back surface of the holding layer 10. A partition space 6 for air flow is formed between the plurality of protrusions 4 and the back surface of the holding layer 10 (see FIGS. 4 and 6). The plurality of protrusions 4 are aligned to a height of 0.05 mm or more, which is substantially the same as the peripheral edge 2 of the substrate 1, and each protrusion 4 is formed in a rigid columnar shape or a truncated cone shape. Support indirectly through 10.

  The height of the protrusion 4 is set to 0.05 mm or more. However, when the height is less than 0.05 mm, the sufficient partition space 6 cannot be formed, which hinders the deformation of the holding layer 10. Because there is a risk of coming.

  In the thickness direction of the substrate 1, a supply / discharge hole 7 for removing the semiconductor wafer 20 communicating with the partition space 6 is drilled, and the supply / discharge hole 7 positioned between the plurality of protrusions 4 includes 6 is detachably connected. Then, the vacuum device 8 is operated, and the holding layer 10 is deformed according to the pattern of the plurality of protrusions 4, and an air inflow gap is generated between the uneven holding layer 10 and the semiconductor wafer 20. As a result, the semiconductor wafer 20 adhered and held on the holding layer 10 can be removed (see FIGS. 4 and 6).

  As shown in FIG. 1 and FIG. 4, the holding layer 10 is made of, for example, a urethane, fluorine, or silicone thin elastomer that is excellent in flexibility, flexibility, heat resistance, elasticity, adhesiveness, and the like. 1, a plurality of non-adhesive lines 12 are formed in a part of the deformation region 11, and are adhered to the peripheral edge 2 of the surface 3 of the substrate 1 via an adhesive. The rear surface of the semiconductor wafer 20 is detachably adhered. The holding layer 10 is formed into a thin film by a calendering method, a pressing method, or the like by adding a reinforcing filler, hydrophobic silica or the like to the elastomer as necessary at the time of molding.

  The plurality of non-adhesive lines 12 are partly subjected to non-adhesive treatment on the surface of the deformation region 11 of the holding layer 10, in other words, the non-contact portion (depressed portion) of the holding layer 10 that does not contact the tip surface 5 of each projection 4 As a result, a pattern is formed in a planar cross shape passing through the center of the holding layer 10, and each end portion extends to the peripheral portion of the holding layer 10, and functions to trigger removal of the semiconductor wafer 20. Examples of the non-adhesion treatment for the holding layer 10 include UV treatment, roughening treatment, lamination of non-adhesive rubber, and coating with a non-adhesive adhesive.

  As shown in FIGS. 4 and 5, the semiconductor wafer 20 is basically made of a round silicon wafer, a circuit is formed on the mirror surface, and the back surface is thinly back-ground. Sticked to the surface. As shown in FIG. 5, an orientation flat 21 and a notch 22 for discriminating and aligning the crystal orientation are appropriately formed on the peripheral edge of the semiconductor wafer 20.

  As shown in FIGS. 7 to 14, the substrate storage container 30 is a front open box type including a container main body 31 for storing a fixed carrier and a detachable lid 50 for opening and closing the front surface of the container main body 31. Composed. The container body 31 is formed into a transparent front open box using a predetermined resin made of polycarbonate or the like, and functions to store a plurality of (25 or 26) fixed carriers in a line in the vertical direction.

  As shown in FIGS. 7 to 9, the opened front surface of the container body 31 is bent outwardly in a substantially L-shaped cross section to form a horizontally long rim portion 32, and the upper and lower sides of the inner peripheral surface of the rim portion 32. On both sides, a locking hole 33 for locking the lid is formed in a recess. A plurality of rear retainers 34 that hold the rear periphery of the base material 1 via a holding groove are juxtaposed in the vertical direction on the inner surface of the back wall of the container body 31 at predetermined intervals. Teeth 35 for horizontally supporting the base material 1 are formed so as to protrude from the inner surface of each of the two teeth, and the pair of left and right teeth 35 are arranged in parallel in the vertical direction at a predetermined interval.

  As shown in FIG. 12 and the like, each of the teeth 35 is formed in a substantially plane shape or a semicircular arc shape, and is integrally formed on a flat plate 36 along the peripheral edge of the base 1 and on the inner side of the front portion of the flat plate 36. The substantially flat front middle region 37 that supports the base material 1 and the front outer side of the flat plate 36 are formed integrally with the outer side of the front middle region 37, in other words, closer to the side wall of the container body 31. A front thick region 38, a rear middle region 39 that is formed in the rear portion of the flat plate 36 and supports the base material 1, and a rear portion that is formed in the rear portion of the flat plate 36 and is located in front of the rear thick portion region 39. It is formed with a flat rear thick region 40 located in a small area near the side wall of the main body 31.

  Between the front middle thickness region 37 and the front thick region 38 of the tooth 35, a vertical step 41 that contacts the side edge of the substrate 1 is slightly formed. The front thick region 38 is formed to a height obtained by adding the thickness of the semiconductor wafer 20 to the thickness of the fixed carrier, specifically, a height of about 0.3 to 2.5 mm + α. It functions to prevent the base material 1 from protruding forward from the container body 31 as a stopper.

  A slightly recessed thin region is formed between the front middle region 37 and the rear middle region 39, and this thin region is opposed to the peripheral edge of the side of the substrate 1 with a slight gap. The teeth 35 having such a configuration horizontally support the side periphery of the back surface of the base material on the flat front middle region 37 and rear middle region 39 while maintaining high accuracy.

  As shown in FIG. 13, positioning tools 42 that fit the positioning pins of the processing apparatus on which the substrate storage container 30 is mounted are disposed on the front side and the rear center of the bottom surface of the container body 31. A substantially Y-shaped bottom plate 43 is detachably attached to the substantially central portion of the, and an identification body detachably fitted to the rear portion of the bottom plate 43 is detected by a sensor of the processing apparatus. Thus, the type of the substrate storage container 30 and the number of the semiconductor wafers 20 are grasped.

  A flat rectangular robotic flange 44 gripped by the automatic transfer machine is detachably attached to the center of the ceiling of the container main body 31, and thick cylindrical or substantially flat outer surfaces on both side walls of the container main body 31. U-shaped handles 45 are detachably mounted, and the substrate storage container 30 is transported when the pair of handles 45 are gripped by an operator.

  As shown in FIGS. 7, 8, and 14, the lid 50 has a substantially dish-shaped casing 51 that is detachably fitted to the rim portion 32 of the container body 31, and a surface of the casing 51. A cover 52 having a substantially rectangular front surface and a pair of left and right locking mechanisms 53 that are interposed between the casing 51 and the cover 52 and lock the lid 50 fitted to the front surface of the container body 31 are provided. Composed.

  The casing 51 is formed into a substantially rectangular front surface with four corners chamfered, and an elastic front retainer that sandwiches the front peripheral edge of the base material 1 via a clamping groove is arranged in parallel in the vertical direction at the center of the back surface. The An endless seal gasket that is pressed against the rim portion 32 of the container main body 31 is deformably fitted to the peripheral wall of the casing 51, and the locking holes 33 of the container main body 31 are provided on both upper and lower sides of the peripheral wall. Corresponding through holes are respectively drilled.

  As shown in FIG. 14, each locking mechanism 53 is supported by, for example, a surface side portion of a housing 51 and is rotated by an operation key that passes through a cover 52 of a lid opening / closing device of the processing apparatus, A pair of advancing / retracting plates 55 inserted into a pair of slots drilled on the outer periphery of the rotating plate 54 and sliding linearly in the up / down direction of the lid 50 as the rotating plate 54 rotates, and each advancing / retracting plate And a locking claw 56 that is connected to and supported by the distal end portion of the 55 and that fits and locks into the locking hole 33 of the container body 31 by protruding from the through hole of the lid 50 as the rotating plate 54 rotates. The

  In the above, when manufacturing a fixed carrier, a plurality of protrusions 4 and supply / discharge holes 7 are integrally formed on the base material 1 by molding a thermoplastic resin sheet, for example, and at least the peripheral edge of the surface 3 of the base material 1 A thin carrier holding layer 10 is adhered to the portion 2 to cover the flat front end surface 5 of each protrusion 4, and a partition space 6 is formed between the plurality of protrusions 4 and the holding layer 10 to manufacture a fixed carrier. can do. During this manufacturing operation, a plurality of non-adhesive lines 12 are formed in advance in a part of the deformation region 11 of the holding layer 10.

  In the above, when the back-ground semiconductor wafer 20 is transported to another factory, first, the semiconductor wafer 20 is pressed and held in contact with the holding layer 10 of the fixed carrier by a robot, and the fixed carrier is held in the substrate storage container. 30 is accommodated in a container body 31 via a robot, and a lid 50 is fitted to the front surface of the container body 31, and then the locking mechanism 53 is operated to lock the lid 50. 20 can be transported to other factories.

  At the time of storage, the semiconductor wafer 20 is mounted in close contact with the fixed carrier without gaps, so that even if it is thin, the semiconductor wafer 20 does not bend and warp downward, and is securely stored in the container body 31 of the substrate storage container 30. The

  Next, when it is desired to take out the transported semiconductor wafer 20 and perform bonding or sealing processing, first, the locking mechanism 53 of the lid 50 is unlocked to remove the lid 50 from the container main body 31. After the fixed carrier is taken out from the container body 31 via the robot, the semiconductor device 20 is removed from the holding layer 10 deformed by the fixed carrier by connecting the vacuum device 8 to the supply / discharge hole 7 of the fixed carrier and performing a suction operation. Can be easily adsorbed and removed.

  According to the above configuration, the fragile semiconductor wafer 20 that is easily cracked, warped, and fragile is not directly stored in the container body 31 but is indirectly stored by being held by a fixed carrier, so that it can be safely and appropriately stored in other factories. Can be transported. In particular, the fixed carrier has excellent strength and rigidity, and can withstand severe transportation conditions such as atmospheric pressure changes, so it can be transported safely even if it takes a long time to transport from factory to factory. it can. Further, since the adhesion time of the back grind tape can be shortened or omitted, there is very little possibility that the adhesive of the back grind tape is transferred to the bumps of the circuit.

  Further, since the non-adhesive line 12 that does not adhere to the back surface of the semiconductor wafer 20 is formed in a part of the deformation region 11 of the holding layer 10, the non-adhesive line of the holding layer 10 that deforms regardless of the adhesive strength of the holding layer 10. The air flow path can be quickly and reliably formed between the semiconductor wafer 20 and the semiconductor wafer 20, and air can be immediately introduced to trigger removal of the semiconductor wafer 20. Therefore, a quick removal of the semiconductor wafer 20 can be greatly expected as compared with the case where the non-adhesive line 12 is not formed in the deformation region 11 of the holding layer 10 and it takes a long time to remove the closely adhered semiconductor wafer 20.

  In addition, since the side edge of the back surface of the fixed carrier is horizontally supported while maintaining high accuracy in the front middle region 37 and the rear middle region 39 of the teeth 35, the fixed carrier tilts in the vertical direction and the robot It becomes possible to prevent the fork from being taken in and out. Furthermore, since the fixed carrier and its base material 1 are approximately the same size and thin as the semiconductor wafer 20, the dimensions, shape, etc. of the existing substrate storage container 30 on the premise of storing the semiconductor wafer 20 not back-ground are particularly changed. It is possible to automatically store and take out without doing so.

  In addition, in the said embodiment, although the base material 1, the some processus | protrusion 4, and the supply / exhaust hole 7 were integrally formed, it is not limited to this at all. For example, the peripheral edge 2 and the plurality of protrusions 4 can be formed by laminating a photoresist layer on the substrate 1 and etching. Further, after the base material 1 and the plurality of protrusions 4 are integrated, the supply / discharge hole 7 can be drilled with a drill or the like. Further, the holding layer 10 may be bonded to the peripheral edge 2 of the substrate 1, but the back surface of the holding layer 10 may be bonded to the peripheral edge 2 of the substrate 1 and the tip surface 5 of each protrusion 4.

  Moreover, the base material 1 and the holding layer 10 may have the same diameter or not. Further, a plurality of non-adhesive lines 12 may be provided in most of the deformation region 11. Further, the plurality of non-adhesive lines 12 may or may not have the same length and width, and does not particularly ask whether or not they are intermittent or continuous. Furthermore, the shape, length, width, and the like of the non-adhesive line 12 may be designed according to the size of the member to be closely held.

It is a plane explanatory view showing an embodiment of a fixed carrier concerning the present invention. It is plane explanatory drawing which shows the adhesion holding state of the semiconductor wafer in embodiment of the fixed carrier which concerns on this invention. It is a fragmentary sectional view showing a substrate etc. in an embodiment of a fixed carrier concerning the present invention. It is a fragmentary sectional view showing the adhesion holding state of the semiconductor wafer in the embodiment of the fixed carrier according to the present invention. It is a plane explanatory view showing a semiconductor wafer in an embodiment of a fixed carrier concerning the present invention. It is a fragmentary sectional view showing the deformation state of the retention layer in the embodiment of the fixed carrier according to the present invention. It is a whole perspective explanatory view showing a substrate storage container in an embodiment of a fixed carrier concerning the present invention. It is front explanatory drawing which shows the board | substrate storage container in embodiment of the fixed carrier which concerns on this invention. It is a cross-sectional side view which shows the container main body of the substrate storage container in embodiment of the fixed carrier based on this invention. It is sectional explanatory drawing which shows the state which accommodated the semiconductor wafer in the container main body in embodiment of the fixed carrier which concerns on this invention. It is a section explanatory view showing the container main part of the substrate storage container in the embodiment of the fixed carrier concerning the present invention. It is a perspective view showing the teeth of the substrate storage container in the embodiment of the fixed carrier according to the present invention. It is bottom explanatory drawing which shows the container main body of the substrate storage container in embodiment of the fixed carrier which concerns on this invention. It is a plane explanatory view showing a locking mechanism of a substrate storage container in an embodiment of a fixed carrier concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Peripheral part 3 Surface 4 Protrusion 5 Tip surface (tip part)
6 compartment space 7 supply / discharge hole 8 vacuum device 10 holding layer 11 deformation region 12 non-adhesion line (at least a part of the non-adhesion-treated deformation region)
20 Semiconductor wafer (mounted article)
30 Substrate storage container 31 Container body 50 Lid

Claims (2)

A fixed carrier comprising a base material and a deformable holding layer that is laid on the base material and detachably holds an article to be mounted,
The substrate is provided with a plurality of protrusions and the tip thereof is brought into contact with the holding layer, and a supply / discharge hole connected to a partition space between the plurality of protrusions and the holding layer is provided, so that at least one of the deformation regions of the holding layer is provided. A fixed carrier characterized in that the part is non-adhesive-treated.   The fixed carrier according to claim 1, wherein the deformation region of the holding layer is a surface in a non-contact portion of the holding layer that is not in contact with the tip of each protrusion.

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