JP2006295143A5 - - Google Patents
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- Publication number
- JP2006295143A5 JP2006295143A5 JP2006068847A JP2006068847A JP2006295143A5 JP 2006295143 A5 JP2006295143 A5 JP 2006295143A5 JP 2006068847 A JP2006068847 A JP 2006068847A JP 2006068847 A JP2006068847 A JP 2006068847A JP 2006295143 A5 JP2006295143 A5 JP 2006295143A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- film
- circuit pattern
- flexible film
- overlapped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000758 substrate Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006068847A JP2006295143A (ja) | 2005-03-16 | 2006-03-14 | フィルム回路基板およびその製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005074809 | 2005-03-16 | ||
| JP2006068847A JP2006295143A (ja) | 2005-03-16 | 2006-03-14 | フィルム回路基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006295143A JP2006295143A (ja) | 2006-10-26 |
| JP2006295143A5 true JP2006295143A5 (https=) | 2009-04-30 |
Family
ID=37415326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006068847A Withdrawn JP2006295143A (ja) | 2005-03-16 | 2006-03-14 | フィルム回路基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006295143A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5029086B2 (ja) * | 2007-03-22 | 2012-09-19 | セイコーエプソン株式会社 | フレキシブル基板の製造方法 |
| JP5992670B2 (ja) * | 2011-08-10 | 2016-09-14 | リンテック株式会社 | シート貼付装置及び貼付方法 |
| US9784438B2 (en) | 2012-09-28 | 2017-10-10 | Nichia Corporation | Connected body of a plurality of light emitting devices |
| JP2017188395A (ja) * | 2016-04-08 | 2017-10-12 | 株式会社半導体エネルギー研究所 | 積層体の加工装置および加工方法 |
| KR20200038814A (ko) | 2018-10-04 | 2020-04-14 | 주식회사 엘지화학 | 회로 기판 제조용 연속 시트의 제조 방법 및 이로부터 제조된 회로 기판 제조용 연속 시트 |
| CN116075047A (zh) * | 2021-10-29 | 2023-05-05 | 鹏鼎控股(深圳)股份有限公司 | 软式线路基板组的制造方法 |
-
2006
- 2006-03-14 JP JP2006068847A patent/JP2006295143A/ja not_active Withdrawn
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