JP2006276014A - 検出器アセンブリおよびその製造方法 - Google Patents
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- JP2006276014A JP2006276014A JP2006082220A JP2006082220A JP2006276014A JP 2006276014 A JP2006276014 A JP 2006276014A JP 2006082220 A JP2006082220 A JP 2006082220A JP 2006082220 A JP2006082220 A JP 2006082220A JP 2006276014 A JP2006276014 A JP 2006276014A
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- 238000004519 manufacturing process Methods 0.000 title 1
- 230000005855 radiation Effects 0.000 claims abstract description 80
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- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 238000003384 imaging method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007689 inspection Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
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- 238000002601 radiography Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
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- 229910003016 Lu2SiO5 Inorganic materials 0.000 description 1
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- CMIHHWBVHJVIGI-UHFFFAOYSA-N gadolinium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Gd+3].[Gd+3] CMIHHWBVHJVIGI-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20185—Coupling means between the photodiode and the scintillator, e.g. optical couplings using adhesives with wavelength-shifting fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
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Abstract
【解決手段】検出器アセンブリ10は、放射線変換層12とピクセルアレイ14とを直接結合するか、または任意の中間光生成層16を介在させた構成でもよい。放射線変換層12が、対象物を透過する放射線5を受けるようになされ、一次X線、非減衰X線、蛍光X線および2次電子に変換する。ピクセルアレイ14は、放射線変換層12、または任意の中間光生成層16からの対応する光信号によって直接放出される放射線のうち1つを受けるようになされ、さらに、対象物に対応する画像を形成するように構成される。
【選択図】図2
Description
10 検出器アセンブリ
12 放射線変換層
14 ピクセルアレイ
15 金属層
16 光生成層
18 接触層
30 X線システム
32 X線源
34 対象物
36 X線検出器
38 処理装置
40 コンピュータ
42 操作卓
44 表示ユニット
46 記憶装置
48 供給源制御装置
Claims (10)
- 検出器アセンブリ(10)であって、
対象物(34)を透過する放射線(5)を受け、放射線を複数の信号に変換するように構成された放射線変換層(12)と、
前記放射線のうちの1つと複数の対応する光電子とを受けるように構成され、前記対象物の対応する画像を形成するように構成されたピクセルアレイ(14)とを備え、
前記放射線変換層が前記ピクセルアレイに直接結合されたことを特徴とする検出器アセンブリ。 - 前記放射線変換層を透過した前記放射線を受け、前記対応する光信号を生成するように構成された少なくとも1つの光生成層(16)を備え、前記光生成層が、前記放射線変換層と前記ピクセルアレイの間に配置され、前記ピクセルアレイが、前記光信号を受けるように構成された光電性のピクセルアレイを備えることを特徴とする請求項1記載の検出器アセンブリ。
- 前記光生成層が、前記放射線変換層および前記ピクセルアレイのうち少なくとも1つを被覆する請求項2記載の検出器アセンブリ。
- 前記光生成層が、前記放射線変換層に直接結合されることを特徴とする請求項2記載の検出器アセンブリ。
- 前記光生成層が、前記放射線変換層または前記ピクセルアレイのうち一方の上に成長した複数のニードルを備えることを特徴とする請求項2記載の検出器アセンブリ。
- 前記ピクセルアレイが、前記放射線変換層内で生成される前記放射線を受けるように構成された直接変換ピクセルアレイを備えることを特徴とする請求項1記載の検出器アセンブリ。
- 検出器アセンブリ(10)であって、
対象物(34)を透過する放射線(5)を受けるように構成された放射線変換層(12)と、
前記放射線を対応する複数の光信号に変換するように構成された光生成層(16)と、
前記光生成層に直接結合され、前記光信号を受けるように構成され、さらに、前記対象物の対応する画像を形成するように構成されたピクセルアレイ(14)と、
前記光生成層と前記ピクセルアレイとの間に配置された接触層(18)とを備え、前記接触層の厚さが前記放射線変換層の厚さより大きい検出器アセンブリ。 - 前記ピクセルアレイが、前記光信号を受けるように構成された光電性ピクセルアレイであることを特徴とする請求項7記載の検出器アセンブリ。
- 検出器アセンブリ(10)を形成するための方法であって、
前記検出器アセンブリを形成するために、ピクセルアレイを覆って放射線変換層を堆積させることを含み、前記放射線変換層が前記ピクセルアレイと直接接触する方法。 - 前記放射線変換層と前記ピクセルアレイとの間に、光生成層を堆積させることをさらに含むことを特徴とする請求項9記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/090,675 US7214947B2 (en) | 2005-03-25 | 2005-03-25 | Detector assembly and method of manufacture |
US11/090,675 | 2005-03-25 |
Publications (2)
Publication Number | Publication Date |
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JP2006276014A true JP2006276014A (ja) | 2006-10-12 |
JP5247988B2 JP5247988B2 (ja) | 2013-07-24 |
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JP2006082220A Expired - Fee Related JP5247988B2 (ja) | 2005-03-25 | 2006-03-24 | 検出器アセンブリおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7214947B2 (ja) |
EP (1) | EP1705708A3 (ja) |
JP (1) | JP5247988B2 (ja) |
CN (1) | CN1837795B (ja) |
Cited By (1)
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WO2020218033A1 (ja) * | 2019-04-24 | 2020-10-29 | 富士フイルム株式会社 | 放射線画像撮影装置 |
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US7708968B2 (en) | 2007-03-26 | 2010-05-04 | General Electric Company | Nano-scale metal oxide, oxyhalide and oxysulfide scintillation materials and methods for making same |
US7625502B2 (en) * | 2007-03-26 | 2009-12-01 | General Electric Company | Nano-scale metal halide scintillation materials and methods for making same |
US7915591B2 (en) * | 2007-09-12 | 2011-03-29 | Morpho Detection, Inc. | Mask for coded aperture systems |
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CN102667579A (zh) * | 2009-09-15 | 2012-09-12 | 恩迪斯外科影像有限公司 | 用于图像的修正、测量和显示的方法和系统 |
US8693613B2 (en) * | 2010-01-14 | 2014-04-08 | General Electric Company | Nuclear fuel pellet inspection |
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US10914847B2 (en) * | 2011-01-18 | 2021-02-09 | Minnesota Imaging And Engineering Llc | High resolution imaging system for digital dentistry |
US9429521B2 (en) * | 2012-05-30 | 2016-08-30 | Board Of Trustees Of Michigan State University | Plant phenometrics systems and methods and devices related thereto |
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US9442261B2 (en) * | 2014-07-09 | 2016-09-13 | Toshiba Medical Systems Corporation | Devices for coupling a light-emitting component and a photosensing component |
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US11156727B2 (en) * | 2015-10-02 | 2021-10-26 | Varian Medical Systems, Inc. | High DQE imaging device |
JP6321703B2 (ja) * | 2016-03-04 | 2018-05-09 | ファナック株式会社 | ワイヤ放電加工機の検査システム |
US10365383B2 (en) | 2016-09-09 | 2019-07-30 | Minnesota Imaging And Engineering Llc | Structured detectors and detector systems for radiation imaging |
US11054530B2 (en) * | 2017-11-24 | 2021-07-06 | Saint-Gobain Ceramics & Plastics, Inc. | Substrate including scintillator materials, system including substrate, and method of use |
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2005
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-
2006
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- 2006-03-24 JP JP2006082220A patent/JP5247988B2/ja not_active Expired - Fee Related
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Cited By (4)
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WO2020218033A1 (ja) * | 2019-04-24 | 2020-10-29 | 富士フイルム株式会社 | 放射線画像撮影装置 |
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Also Published As
Publication number | Publication date |
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CN1837795B (zh) | 2012-05-16 |
US7214947B2 (en) | 2007-05-08 |
US20060214109A1 (en) | 2006-09-28 |
EP1705708A3 (en) | 2010-08-04 |
JP5247988B2 (ja) | 2013-07-24 |
EP1705708A2 (en) | 2006-09-27 |
CN1837795A (zh) | 2006-09-27 |
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