JP2006269893A - Colored prepreg and colored printed wiring board using the same - Google Patents

Colored prepreg and colored printed wiring board using the same Download PDF

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JP2006269893A
JP2006269893A JP2005088102A JP2005088102A JP2006269893A JP 2006269893 A JP2006269893 A JP 2006269893A JP 2005088102 A JP2005088102 A JP 2005088102A JP 2005088102 A JP2005088102 A JP 2005088102A JP 2006269893 A JP2006269893 A JP 2006269893A
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colored
prepreg
wiring board
printed wiring
red
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JP4826115B2 (en
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Tsukasa Hayakawa
典 早川
Yukio Suzuki
幸雄 鈴木
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Toppan Inc
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Toppan Printing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a colored wiring board capable of adding design properties excellent in design and color to an information terminal device such as a hand-held game machine having a skeleton body, a mobile telephone, a personal computer, etc, and matching the design of a skeleton body. <P>SOLUTION: A colored prepreg is processed into an optional shape on the one surface of a printed wiring board 100w whose surface is formed of a white color prepreg 10W and formed with wiring layers 31a and 31b, respectively, a colored mosaic prepreg 10c on which a colored mosaic pattern is formed such as a red color mosaic pattern, a yellow color mosaic pattern, a blue color mosaic pattern, etc, is formed on one surface of the printed wiring board 100w, and a red color prepreg 10R is laminated on the other surface, wiring layers 34a and 34b are formed, and thus the four-layered multilayer colored printed wiring board can be obtained where the colored mosaic pattern is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯ゲーム機、携帯電話、パソコンなどの情報機器端末用などに用いられる着色プリント配線板に関し、特に、内部が見えるスケルトン型携帯ゲーム機、携帯電話、パソコンなどに使われる鮮やかな色彩を有する着色プリント配線板に関するものである。   The present invention relates to a colored printed wiring board used for information device terminals such as a portable game machine, a cellular phone, and a personal computer. It is related with the colored printed wiring board which has.

従来、携帯ゲーム機、携帯電話、パソコンなどの情報端末機器などは、内部構造が見えない様になっていたが、近年、内部構造の見える、例えばスケルトン調ボディのデザインのｉＭＡＣ（登録商標）、（アップルコンピューター株式会社製）やゲームボーイアドバンス（登録商標）、（任天堂株式会社製）が見られるようになってきた。   Conventionally, information terminal devices such as portable game machines, mobile phones, and personal computers have not been able to see the internal structure, but in recent years, the internal structure is visible, for example, iMAC (registered trademark) with a skeleton-like body design, (Apple Computer Co., Ltd.), Game Boy Advance (registered trademark), and (Nintendo Co., Ltd.) have come to be seen.

しかし、スケルトン調ボディのデザインにすると機器の内部で大きな面積を占めるプリント基板用積層板としては、ガラスクロスにエポキシ樹脂を含浸させた銅張り積層板が用いられ、銅張り積層板の樹脂層の色としては緑色などの特定の決まった色しかなかった。また、発光ダイオードが実装されたプリント配線板では、可視光波長領域、特に青色の反射率が高く、しかも加熱による変色が少ないプリント基板用白色積層板が提案されている（例えば、特許文献１参照。）。   However, when the skeleton-like body is designed, a copper-clad laminate in which glass cloth is impregnated with epoxy resin is used as a laminate for printed circuit boards, which occupies a large area inside the device. There were only certain fixed colors such as green. In addition, a printed wiring board on which a light emitting diode is mounted has been proposed as a white laminated board for printed circuit boards that has a high visible light wavelength region, particularly blue reflectance, and that is less likely to discolor due to heating (see, for example, Patent Document 1). .)

上記、プリント基板用白色積層板は、あくまでもプリント配線板に発光ダイオードを実装した場合に視認性を高めるための青色の反射率を高くするようにしたもので、スケルトン調ボディの携帯ゲーム機、携帯電話、パソコンなどの情報端末機器に用いられるプリント配線板をカラー表示して、色彩に優れた意匠性を持たせるという発想はない。   The above-mentioned white laminated board for printed circuit boards is designed to increase the blue reflectance for improving visibility when a light emitting diode is mounted on a printed wiring board. There is no idea that printed wiring boards used in information terminal devices such as telephones and personal computers are displayed in color to have excellent design characteristics in color.

そこで、スケルトン調ボディの携帯ゲーム機、携帯電話、パソコンなどの情報端末機器にデザイン、色彩に優れた意匠性を付加し、スケルトン調ボディのデザインとマッチするような着色プリント配線板が要望されるようになっている。
特開２００３−６０３２１号公報 Therefore, there is a demand for colored printed wiring boards that add design and color design to information terminal devices such as skeleton-like portable game machines, mobile phones, and personal computers, and match the design of skeleton-like bodies. It is like that.
Japanese Patent Laid-Open No. 2003-60321

本発明は上記要望に鑑み考案されたもので、スケルトン調ボディの携帯ゲーム機、携帯電話、パソコンなどの情報端末機器にデザイン、色彩に優れた意匠性を付加し、スケルトン調ボディのデザインとマッチするような着色プリント配線板を提供することを目的とする。   The present invention has been devised in view of the above demands, and is designed for information terminal devices such as skeleton-like portable game machines, mobile phones, personal computers, etc. An object of the present invention is to provide such a colored printed wiring board.

本発明は、上記課題を達成するために、まず請求項１においては、シート状のガラスクロスに着色熱硬化性樹脂を含浸したことを特徴とする着色プリプレグとしたものである。   In order to achieve the above object, the present invention is a colored prepreg characterized in that, in claim 1, a sheet-like glass cloth is impregnated with a colored thermosetting resin.

また、請求項２においては、前記着色熱硬化性樹脂は熱硬化性樹脂に対して３〜２０重量部の着色顔料を添加したことを特徴とする請求項１に記載の着色プリプレグとしたものである。   Further, in claim 2, the colored thermosetting resin is a colored prepreg according to claim 1, wherein 3 to 20 parts by weight of a coloring pigment is added to the thermosetting resin. is there.

また、請求項３においては、請求項１または２に記載の着色プリプレグの片面もしくは両面に配線層を形成したことを特徴とする着色プリント配線板としたものである。   According to a third aspect of the present invention, there is provided a colored printed wiring board in which a wiring layer is formed on one side or both sides of the colored prepreg according to the first or second aspect.

また、請求項４においては、請求項３に記載の着色プリント配線板の片面もしくは両面に請求項１または２に記載の着色プリプレグを積層し、配線層を形成したことを特徴とする着色プリント配線板としたものである。   Further, in claim 4, the colored printed wiring board according to claim 3, wherein the colored prepreg according to claim 1 or 2 is laminated on one side or both sides of the colored printed wiring board according to claim 3 to form a wiring layer. It is a board.

さらにまた、請求項５においては、請求項３に記載の着色プリント配線板の片面もしくは両面に請求項１または２に記載の着色プリプレグを任意の形状に加工して、着色モザイクパターンを形成した着色モザイクプリプレグを積層し、配線層を形成したことを特徴とする着色プリント配線板としたものである。   Furthermore, in claim 5, the colored prepreg according to claim 1 or 2 is processed into an arbitrary shape on one or both sides of the colored printed wiring board according to claim 3 to form a colored mosaic pattern. A colored printed wiring board is characterized in that a mosaic prepreg is laminated to form a wiring layer.

本発明に係わる着色プリプレグを用いて作製した着色プリント配線板は、スケルトン調ボディの携帯ゲーム機、携帯電話、パソコンなどの情報端末機器に内蔵することにより、スケルトン調ボディの携帯ゲーム機、携帯電話、パソコンなどの情報端末機器にデザイン、色彩に優れた意匠性を付加することができる。   A colored printed wiring board produced using the colored prepreg according to the present invention is incorporated in an information terminal device such as a skeleton-like portable game machine, a mobile phone, a personal computer, etc. Design information with excellent design and color can be added to information terminal devices such as personal computers.

以下、本発明の実施の形態につき説明する。
図１は、請求項１または２に係る本発明の着色プリプレグの一実施例を示す着色プリプレグ１０の模式構成断面図である。
着色プリプレグ１０は、熱硬化性樹脂に着色顔料を３〜２０重量部添加した着色熱硬化性樹脂をシート状のガラスクロスに含浸させた半硬化状態の着色プリプレグである。
着色プリプレグ１０は、プリント配線板を作製する際のコア基材、もしくは着色プリプレグを積層して、着色絶縁層を形成するためのものである。
また、ここでは着色熱硬化性樹脂をシート状のガラスクロスに含浸させた半硬化状態の着色プリプレグとしているが、着色熱硬化性樹脂をシート状にした着色プリプレグとしても良い。
着色コア基材及び着色絶縁層の色は、着色顔料及び配合を適宜設定することにより、ほぼ全ての色を再現することができる。 Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic cross-sectional view of a colored prepreg 10 showing an embodiment of the colored prepreg of the present invention according to claim 1 or 2.
The colored prepreg 10 is a semi-cured colored prepreg in which a sheet-shaped glass cloth is impregnated with a colored thermosetting resin obtained by adding 3 to 20 parts by weight of a color pigment to a thermosetting resin.
The colored prepreg 10 is for forming a colored insulating layer by laminating a core base material or a colored prepreg for producing a printed wiring board.
Further, here, a colored prepreg in a semi-cured state in which a colored thermosetting resin is impregnated into a sheet-like glass cloth is used, but a colored prepreg in which a colored thermosetting resin is formed into a sheet may be used.
As for the colors of the colored core substrate and the colored insulating layer, almost all colors can be reproduced by appropriately setting the coloring pigment and the composition.

ここで、熱硬化性樹脂としては、エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ポリイミド樹脂、フェノール樹脂等が使用できる。
また、着色顔料としては、黄色系としてアンスラキノン、モノアゾ、ジスアゾ、ベンズイミダゾロン、イソインドリノン、アンスラキノン、酸化鉄およびこれらの混合物。赤系としてジケトピロロピロール、ポリアゾ、モノアゾ、キナクリドン、酸化鉄およびこれらの混合物。青系としてフタロシアニン、コバルトブルー、白系として酸化チタン、アルミナ、黒系はカーボン、酸化鉄などを使用することができる。
着色顔料の配合比は、発色性、隠蔽性等を考慮して、熱硬化性樹脂に対して３〜２０重量部の範囲で適宜設定することができる。
また、着色プリプレグ１０を積層して絶縁層とした場合絶縁層の熱膨張係数を抑えたり、ビア加工性を良くするために、フィラー（例えば、シリカ、炭酸カルシウム等）を適当量添加しても良い。 Here, as the thermosetting resin, epoxy resin, bisphenol A type epoxy resin, polyimide resin, phenol resin, or the like can be used.
As the color pigment, yellowish anthraquinone, monoazo, disazo, benzimidazolone, isoindolinone, anthraquinone, iron oxide and mixtures thereof. Diketopyrrolopyrrole, polyazo, monoazo, quinacridone, iron oxide and mixtures thereof as red systems. Phthalocyanine and cobalt blue can be used for the blue system, and titanium and alumina can be used for the white system, and carbon and iron oxide can be used for the black system.
The blending ratio of the color pigments can be appropriately set in the range of 3 to 20 parts by weight with respect to the thermosetting resin in consideration of color developability, concealability and the like.
Further, when the colored prepreg 10 is laminated to form an insulating layer, an appropriate amount of filler (for example, silica, calcium carbonate, etc.) may be added in order to suppress the thermal expansion coefficient of the insulating layer or improve via processability. good.

図２は、請求項３に係る本発明の着色プリント配線板の一実施例を示す着色プリント配線板１００の模式構成断面図である。
着色プリント配線板１００は、請求項１または２に記載の赤色プリプレグ１０Ｒをコア基材とし、赤色プリプレグ１０Ｒの両面に配線層３１ａ及び配線層３１ｂを形成し、両面着色プリント配線板としたものである。
ここで、着色プリント配線板１００の表面は、配線層３１ａ及び３１ｂの無い部分は赤色に見え、全体として赤色のプリント配線板となるようになっている。 FIG. 2 is a schematic cross-sectional view of a colored printed wiring board 100 showing an embodiment of the colored printed wiring board according to the third aspect of the present invention.
The colored printed wiring board 100 is a double-sided colored printed wiring board in which the red prepreg 10R according to claim 1 or 2 is used as a core base material, and a wiring layer 31a and a wiring layer 31b are formed on both sides of the red prepreg 10R. is there.
Here, on the surface of the colored printed wiring board 100, the portions without the wiring layers 31a and 31b appear red, and the whole is a red printed wiring board.

図３は、請求項４に係る本発明の着色プリント配線板の一実施例を示す着色プリント配線板２００の模式構成断面図である。
着色プリント配線板２００は、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂを形成した白色プリント配線板１００Ｗの一方の面に赤色プリプレグ１０Ｒを、他方の面に青色プリプレグ１０Ｂをそれぞれ積層し、配線層３２ａ及び配線層３２ｂを形成し、４層の多層着色プリント配線板としたものである。
ここで、着色プリント配線板２００の一方の面の配線層３２ａの無い部分は赤色に、他方の面の配線層３２ｂの無い部分は青色に見え、赤と青のカラフルな着色プリント配線板を得ることができる。 FIG. 3 is a schematic sectional view of a colored printed wiring board 200 showing an embodiment of the colored printed wiring board according to the fourth aspect of the present invention.
The colored printed wiring board 200 is formed by laminating a red prepreg 10R on one surface of a white printed wiring board 100W in which wiring layers 31a and 31b are formed on both surfaces of the white prepreg 10W, and a blue prepreg 10B on the other surface. 32a and a wiring layer 32b are formed to form a multilayer colored printed wiring board having four layers.
Here, the portion without the wiring layer 32a on one side of the colored printed wiring board 200 looks red, and the portion without the wiring layer 32b on the other side looks blue, and a colorful colored printed wiring board of red and blue is obtained. be able to.

図４（ａ）及び（ｂ）は、請求項５に係る本発明の着色プリント配線板の一実施例を示す着色プリント配線板３００の模式構成断面図である。
着色プリント配線板３００は、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂを形成した両面白色プリント配線板１００ｗの一方の面に着色プリプレグを任意の形状に加工して、着色モザイクパターンを形成した着色モザイクプリプレグ１０ｃを、他方の面に赤色プリプレグ１０Ｒをそれぞれ積層し、配線層３４ａ及び配線層３４ｂを形成し、表面に着色モザイクパターンが形成された４層の多層着色プリント配線板としたものである。ここで、着色プリント配線板３００の一方の面の配線層３４ａの無い部分は図４（ａ）に示すような着色モザイクパターンが、他方の面の配線層３４ｂの無い部分は赤色に見え、カラフルで、デザイン、意匠性に富んだ着色プリント配線板を得ることができる。 4A and 4B are schematic cross-sectional views of a colored printed wiring board 300 showing an embodiment of the colored printed wiring board according to the fifth aspect of the present invention.
The colored printed wiring board 300 has a colored mosaic pattern formed by processing the colored prepreg into an arbitrary shape on one side of the double-sided white printed wiring board 100w in which the wiring layers 31a and 31b are formed on both sides of the white prepreg 10W. The mosaic prepreg 10c and the red prepreg 10R are laminated on the other surface to form a wiring layer 34a and a wiring layer 34b, and a four-layer multilayer colored printed wiring board having a colored mosaic pattern formed on the surface is obtained. . Here, the colored mosaic pattern as shown in FIG. 4 (a) appears in the portion without the wiring layer 34a on one side of the colored printed wiring board 300, and the portion without the wiring layer 34b on the other side looks red and colorful. Thus, a colored printed wiring board rich in design and design can be obtained.

以下、着色プリント配線板の製造法について説明する。
図５（ａ）〜（ｅ）は、着色プリント配線板１００の製造方法を工程順に示す模式構成断面図である。
まず、シート状のガラスクロスに赤色に着色した熱硬化性樹脂を含浸させて、赤色プリプレグ１０Ｒを作製する（図５（ａ）参照）。 Hereinafter, the manufacturing method of a colored printed wiring board is demonstrated.
FIG. 5A to FIG. 5E are schematic cross-sectional views showing a method for manufacturing the colored printed wiring board 100 in the order of steps.
First, a red prepreg 10R is manufactured by impregnating a sheet-shaped glass cloth with a thermosetting resin colored in red (see FIG. 5A).

次に、赤色プリプレグ１０Ｒの両面に銅箔３１を加圧、加熱して積層し、両面銅貼り赤色積層板を作製する（図５（ｂ）参照）。
次に、感光性のドライフィルムをラミネートする等の方法でレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、レジストパターン４１ａ及び４１ｂを形成する（図５（ｃ）参照）。 Next, the copper foil 31 is pressed and heated on both sides of the red prepreg 10R and laminated to produce a double-sided copper-clad red laminate (see FIG. 5B).
Next, a resist layer is formed by a method such as laminating a photosensitive dry film, and a series of patterning processes such as pattern exposure and development are performed to form resist patterns 41a and 41b (see FIG. 5C). ).

次に、レジストパターン４１ａ及び４１ｂをマスクにして塩化第２鉄等のエッチング液で銅箔３１をエッチングし（図５（ｄ）参照）、レジストパターン４１ａ及び４１ｂを専用の剥離液で剥離処理し、赤色プリプレグ１０Ｒの両面に配線層３１ａ及び３１ｂが形成された両面着色プリント配線板１００を得ることができる（図５（ｅ）参照）。
ここで、配線層３１ａ及び３１ｂのパターン形成方法として、サブトラクティブ法で説明したが、これに限定されるものではない。
さらに、配線層を両面に形成した両面着色プリント配線板を例にして説明したが、片面着色プリント配線板でも良い。 Next, using the resist patterns 41a and 41b as a mask, the copper foil 31 is etched with an etching solution such as ferric chloride (see FIG. 5D), and the resist patterns 41a and 41b are stripped with a dedicated stripping solution. The double-sided colored printed wiring board 100 in which the wiring layers 31a and 31b are formed on both surfaces of the red prepreg 10R can be obtained (see FIG. 5E).
Here, although the subtractive method has been described as the pattern forming method of the wiring layers 31a and 31b, the present invention is not limited to this.
Furthermore, although a double-sided colored printed wiring board having a wiring layer formed on both sides has been described as an example, a single-sided colored printed wiring board may be used.

図６（ａ）〜（ｆ）は、着色プリント配線板２００の製造方法を工程順に示す模式構成断面図である。
まず、白色に着色した熱硬化性樹脂をシート状のガラスクロスに含浸させた白色プリプレグ１０Ｗを作製し、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂを形成して、両面白色プリント配線板１００Ｗを作製する（図６（ａ）参照）。 6A to 6F are schematic configuration cross-sectional views illustrating a method of manufacturing the colored printed wiring board 200 in the order of steps.
First, a white prepreg 10W in which a sheet-shaped glass cloth is impregnated with a white-colored thermosetting resin is prepared, wiring layers 31a and 31b are formed on both sides of the white prepreg 10W, and the double-sided white printed wiring board 100W is formed. It is manufactured (see FIG. 6A).

次に、両面着色プリント配線板１００Ｗの一方の面に、赤色に着色した熱硬化性樹脂をシート状のガラスクロスに含浸させた赤色プリプレグ１０Ｒを、他方の面に青色に着色し
た熱硬化性樹脂をシート状のガラスクロスに含浸させた青色プリプレグ１０Ｂを加圧、加熱して積層し、赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａを形成する（図６（ｂ）参照）。 Next, a red prepreg 10R in which a sheet-like glass cloth is impregnated with a red-colored thermosetting resin on one surface of the double-sided colored printed wiring board 100W, and a blue-colored thermosetting resin on the other surface A blue prepreg 10B impregnated with a sheet-like glass cloth is pressed and heated and laminated to form a red insulating layer 10Ra and a blue insulating layer 10Ba (see FIG. 6B).

次に、レーザー加工等によりビアを形成するための孔明け加工して、赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａの所定位置にビア用孔１３を形成する（図６（ｃ）参照）。
さらに、ビア用孔１３のデスミア処理及び赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａ上の活性化処理を行って、無電解銅めっき等を行って、めっき下地導電層（特に、図示せず）を形成する。 Next, a hole for forming a via is formed by laser processing or the like to form a via hole 13 at a predetermined position of the red insulating layer 10Ra and the blue insulating layer 10Ba (see FIG. 6C).
Further, a desmear process of the via hole 13 and an activation process on the red insulating layer 10Ra and the blue insulating layer 10Ba are performed, and electroless copper plating or the like is performed to form a plating base conductive layer (not shown in particular). To do.

次に、感光性のドライフィルムをラミネートする等の方法でレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、めっきレジストパターン４２ａ及び４２ｂを形成する（図６（ｄ）参照）。   Next, a resist layer is formed by a method such as laminating a photosensitive dry film, and a series of patterning processes such as pattern exposure and development are performed to form plating resist patterns 42a and 42b (FIG. 6D). reference).

次に、めっき下地導電層を電極にして電解銅めっきを行い、所定厚の導体層３２及びビア３３を形成する（図６（ｅ）参照）。   Next, electrolytic copper plating is performed using the plating base conductive layer as an electrode to form a conductor layer 32 and a via 33 having a predetermined thickness (see FIG. 6E).

最後に、専用の剥離液でめっきレジストパターン４２ａ及び４２ｂを剥離処理し、めっきレジストパターン４２ａ及び４２ｂ下部にあっためっき下地導電層をクイックエッチングで除去し、両面着色プリント配線板１００Ｗの両面に配線層３２ａ及び３２ｂを形成し、配線層３２ａ及び３２ｂと配線層３１ａ及び３１ｂとがビア３３にて電気的に接続された４層の着色プリント配線板２００を得る（図６（ｆ）参照）。
ここでは、配線層３２ａ及び３２ｂの形成法については、セミアディティブ法で、説明したが、これに限定されるものではない。 Finally, the plating resist patterns 42a and 42b are stripped with a special stripping solution, the plating base conductive layer under the plating resist patterns 42a and 42b is removed by quick etching, and wiring is performed on both sides of the double-sided colored printed wiring board 100W. The layers 32a and 32b are formed, and a four-layer colored printed wiring board 200 in which the wiring layers 32a and 32b and the wiring layers 31a and 31b are electrically connected through the vias 33 is obtained (see FIG. 6F).
Here, the method of forming the wiring layers 32a and 32b has been described by the semi-additive method, but is not limited thereto.

図７（ａ）〜（ｆ）は、着色プリント配線板３００の製造方法を工程順に示す模式構成断面図である。
まず、白色に着色した熱硬化性樹脂をシート状のガラスクロスに含浸させて、白色プリプレグ１０Ｗを作製し、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂを形成した両面白色プリント配線板１００Ｗを作製する（図７（ａ）参照）。 FIGS. 7A to 7F are schematic configuration cross-sectional views illustrating the method of manufacturing the colored printed wiring board 300 in the order of steps.
First, a sheet-shaped glass cloth is impregnated with a white colored thermosetting resin to produce a white prepreg 10W, and a double-sided white printed wiring board 100W in which wiring layers 31a and 31b are formed on both sides of the white prepreg 10W is produced. (See FIG. 7A).

次に、両面白色プリント配線板１００Ｗの一方の面に、図８（ａ）及び（ｂ）に示すような着色モザイクプレプレグ１０Ｃを、他方の面に赤色プリプレグ１０Ｒを加圧、加熱して積層し、着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａを形成する（図７（ｂ）参照）。
ここで、着色モザイクプレプレグ１０Ｃは、図８（ａ）に示すモザイクパターンが型抜きされた白色プリプレグ１０ＤＷに、赤色モザイクパターン１０ＭＲ、黄色モザイクパターン１０ＭＹ及び青色モザイクパターン１０ＭＢを埋め込んで、図８（ｂ）に示す１枚の着色モザイクプレプレグを形成したものである。 Next, a colored mosaic prepreg 10C as shown in FIGS. 8A and 8B is applied to one surface of the double-sided white printed wiring board 100W, and a red prepreg 10R is pressed and heated on the other surface and laminated. Then, the colored mosaic insulating layer 10Ca and the red insulating layer 10Ra are formed (see FIG. 7B).
Here, the colored mosaic prepreg 10C embeds the red mosaic pattern 10MR, the yellow mosaic pattern 10MY, and the blue mosaic pattern 10MB in the white prepreg 10DW from which the mosaic pattern shown in FIG. One colored mosaic prepreg shown in b) is formed.

次に、レーザー加工等によりビアを形成するための孔明け加工して、着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａの所定位置にビア用孔１３を形成する（図７（ｃ）参照）。
さらに、ビア用孔１３のデスミア処理及び着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａ上の活性化処理を行って、無電解銅めっき等を行って、めっき下地導電層（特に、図示せず）を形成する。 Next, drilling for forming vias by laser processing or the like is performed to form via holes 13 at predetermined positions of the colored mosaic insulating layer 10Ca and the red insulating layer 10Ra (see FIG. 7C).
Further, a desmear process of the via hole 13 and an activation process on the colored mosaic insulating layer 10Ca and the red insulating layer 10Ra are performed, and electroless copper plating or the like is performed to form a plating base conductive layer (not shown in particular). Form.

次に、感光性のドライフィルムをラミネートする等の方法でレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、めっきレジストパターン４３ａ及び４３ｂを形成する（図７（ｄ）参照）。   Next, a resist layer is formed by a method such as laminating a photosensitive dry film, and a series of patterning processes such as pattern exposure and development are performed to form plating resist patterns 43a and 43b (FIG. 7D). reference).

次に、めっき下地導電層を電極にして電解銅めっきを行い、所定厚の導体層３４及びビア３５を形成する（図７（ｅ）参照）。   Next, electrolytic copper plating is performed using the plating base conductive layer as an electrode to form a conductor layer 34 and a via 35 having a predetermined thickness (see FIG. 7E).

最後に、専用の剥離液でめっきレジストパターン４３ａ及び４３ｂを剥離処理し、めっきレジストパターン４３ａ及び４３ｂ下部にあっためっき下地導電層をクイックエッチングで除去し、両面着色プリント配線板１００Ｗの両面に配線層３４ａ及び３４ｂを形成し、配線層３４ａ及び３４ｂと配線層３１ａ及び３１ｂとがビア３５にて電気的に接続され、表面に着色モザイクパターンが形成された４層の着色プリント配線板３００を得る（図７（ｆ）参照）。
ここでは、配線層３４ａ及び３４ｂの形成法については、セミアディティブ法で、説明したが、これに限定されるものではない。 Finally, the plating resist patterns 43a and 43b are stripped with a special stripping solution, and the plating base conductive layer under the plating resist patterns 43a and 43b is removed by quick etching, and wiring is performed on both sides of the double-sided colored printed wiring board 100W. The layers 34a and 34b are formed, and the wiring layers 34a and 34b and the wiring layers 31a and 31b are electrically connected by the vias 35, and a four-layer colored printed wiring board 300 having a colored mosaic pattern formed on the surface is obtained. (Refer FIG.7 (f)).
Here, the method for forming the wiring layers 34a and 34b has been described by the semi-additive method, but is not limited thereto.

エポキシ樹脂に４重量部の赤色有機顔料ジケトピロロピロールを添加した赤色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて、赤色プリプレグ１０Ｒを作製した（図５（ａ）参照）。 A red epoxy resin obtained by adding 4 parts by weight of a red organic pigment diketopyrrolopyrrole to an epoxy resin was impregnated into a plain weave glass cloth having a basis weight of 60 g / m 2 to produce a red prepreg 10R (see FIG. 5A). .

まず、実施例１の赤色プリプレグ１０Ｒの両面に１６μｍ厚の銅箔３１を加圧、加熱して積層し、両面銅貼り赤色積層板を作製した（図５（ｂ）参照）。
次に、感光性のドライフィルムをラミネートしてレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、レジストパターン４１ａ及び４１ｂを形成した（図５（ｃ）参照）。 First, a 16 μm thick copper foil 31 was pressed and heated on both sides of the red prepreg 10R of Example 1 to produce a red laminated plate with double-sided copper bonding (see FIG. 5B).
Next, a photosensitive dry film was laminated to form a resist layer, and a series of patterning processes such as pattern exposure and development were performed to form resist patterns 41a and 41b (see FIG. 5C).

次に、レジストパターン４１ａ及び４１ｂをマスクにして塩化第２鉄液で銅箔３１をエッチングし（図５（ｄ）参照）、レジストパターン４１ａ及び４１ｂを専用の剥離液で剥離処理し、赤色プリプレグ１０Ｒの両面に配線層３１ａ及び３１ｂが形成された両面着色プリント配線板１００を得た（図５（ｅ）参照）。   Next, using the resist patterns 41a and 41b as a mask, the copper foil 31 is etched with a ferric chloride solution (see FIG. 5 (d)), and the resist patterns 41a and 41b are stripped with a special stripping solution to obtain a red prepreg. A double-sided colored printed wiring board 100 having wiring layers 31a and 31b formed on both sides of 10R was obtained (see FIG. 5E).

まず、エポキシ樹脂に１５重量部の酸化チタンを添加した白色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて、白色プリプレグ１０Ｗを作製した。
次に、白色プリプレグ１０Ｗの両面に１６μｍ厚の銅箔３１を加圧、加熱して積層し、実施例２と同様な方法で、銅箔３１をパターニング処理して、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂが形成された両面白色プリント配線板１００ｗを作製した（図６（ａ）参照）。 First, a white prepreg 10W was prepared by impregnating a plain epoxy glass cloth having a weight of 60 g / m 2 with a white epoxy resin obtained by adding 15 parts by weight of titanium oxide to an epoxy resin.
Next, 16 μm thick copper foil 31 is pressed and heated on both sides of the white prepreg 10W and laminated, and the copper foil 31 is patterned by the same method as in Example 2 so that wiring is provided on both sides of the white prepreg 10W. A double-sided white printed wiring board 100w on which the layers 31a and 31b were formed was produced (see FIG. 6A).

次に、両面白色プリント配線板１００Ｗの一方の面に、エポキシ樹脂に４重量部の赤色有機顔料ジケトピロロピロールを添加した赤色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した赤色プリプレグ１０Ｒを、他方の面に、エポキシ樹脂に８重量部の有機顔料銅フラロシアニンブルーを添加した青色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した青色プリプレグ１０Ｂを加圧、加熱して積層し、赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａを形成した（図６（ｂ）参照）。 Next, one side of the double-sided white printed wiring board 100W is impregnated into a plain weave glass cloth having a weight of 60 g / m 2 with a red epoxy resin obtained by adding 4 parts by weight of a red organic pigment diketopyrrolopyrrole to an epoxy resin. The blue prepreg 10R produced was impregnated into a plain woven glass cloth having a weight of 60 g / m 2 with a blue epoxy resin obtained by adding 8 parts by weight of an organic pigment copper phthalocyanine blue to the epoxy resin on the other side. The prepreg 10B was pressed and heated to form a red insulating layer 10Ra and a blue insulating layer 10Ba (see FIG. 6B).

次に、レーザー加工にて、赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａの所定位置にビア用孔１３を形成した（図６（ｃ）参照）。
さらに、ビア用孔１３のデスミア処理及び赤色絶縁層１０Ｒａ及び青色絶縁層１０Ｂａ上の活性化処理を行って、無電解銅めっき等を行って、めっき下地導電層（特に、図示せず）を形成した。 Next, via holes 13 were formed at predetermined positions of the red insulating layer 10Ra and the blue insulating layer 10Ba by laser processing (see FIG. 6C).
Further, a desmear process of the via hole 13 and an activation process on the red insulating layer 10Ra and the blue insulating layer 10Ba are performed, and electroless copper plating or the like is performed to form a plating base conductive layer (not shown in particular). did.

次に、感光性のドライフィルムをラミネートしてレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、めっきレジストパターン４２ａ及び４２ｂを形成した（図６（ｄ）参照）。   Next, a photosensitive dry film was laminated to form a resist layer, and a series of patterning processes such as pattern exposure and development were performed to form plating resist patterns 42a and 42b (see FIG. 6D).

次に、めっき下地導電層を電極にして電解銅めっきを行い、１６μｍ厚の導体層３２及びビア３３を形成した（図６（ｅ）参照）。   Next, electrolytic copper plating was performed using the plating base conductive layer as an electrode to form a conductor layer 32 and a via 33 having a thickness of 16 μm (see FIG. 6E).

最後に、専用の剥離液でめっきレジストパターン４２ａ及び４２ｂを剥離処理し、めっきレジストパターン４２ａ及び４２ｂ下部にあっためっき下地導電層をクイックエッチングで除去し、両面白色プリント配線板１００Ｗの両面に配線層３２ａ及び３２ｂを形成し、配線層３２ａ及び３２ｂと配線層３１ａ及び３１ｂとがビア３３にて電気的に接続された４層の着色プリント配線板２００を得た（図６（ｆ）参照）。   Finally, the plating resist patterns 42a and 42b are stripped with a special stripping solution, the plating base conductive layer under the plating resist patterns 42a and 42b is removed by quick etching, and wiring is performed on both sides of the double-sided white printed wiring board 100W. Layers 32a and 32b were formed, and a four-layer colored printed wiring board 200 in which the wiring layers 32a and 32b and the wiring layers 31a and 31b were electrically connected through the vias 33 was obtained (see FIG. 6F). .

まず、エポキシ樹脂に１５重量部の酸化チタンを添加した白色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて、白色プリプレグ１０Ｗを作製した。
次に、白色プリプレグ１０Ｗの両面に１６μｍ厚の銅箔３１を加圧、加熱して積層し、実施例２と同様な方法で、銅箔３１をパターニング処理して、白色プリプレグ１０Ｗの両面に配線層３１ａ及び３１ｂが形成された両面着色プリント配線板１００ｗを作製した（図７（ａ）参照）。 First, a white prepreg 10W was prepared by impregnating a plain epoxy glass cloth having a weight of 60 g / m 2 with a white epoxy resin obtained by adding 15 parts by weight of titanium oxide to an epoxy resin.
Next, 16 μm thick copper foil 31 is pressed and heated on both sides of the white prepreg 10W and laminated, and the copper foil 31 is patterned by the same method as in Example 2 so that wiring is provided on both sides of the white prepreg 10W. A double-sided colored printed wiring board 100w formed with layers 31a and 31b was produced (see FIG. 7A).

次に、白色プリプレグ１０Ｗの型抜き等を行って、モザイクパターン（ここでは、ＴＯＰという文字）が型抜きされた白色プリプレグ１０ＤＷを作成した（図８（ａ）参照）。   Next, the white prepreg 10 </ b> W was die-cut to create a white prepreg 10 </ b> DW in which a mosaic pattern (here, “TOP”) was cut (see FIG. 8A).

次に、エポキシ樹脂に４重量部の赤色有機顔料ジケトピロロピロールを添加した赤色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した赤色プリプレグ１０Ｒを型抜き等の抜き加工して、赤色モザイクパターン１０ＭＲを作成した。
次に、エポキシ樹脂に６重量部の黄色有機顔料ジスアゾを添加した黄色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した黄色プリプレグ１０Ｙを型抜き等の抜き加工して、黄色モザイクパターン１０ＭＹを作成した。
次に、エポキシ樹脂に８重量部の有機顔料銅フラロシアニンブルーを添加した青色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した青色プリプレグ１０Ｂを型抜き等の抜き加工して、青色モザイクパターン１０ＭＢを作成した。 Next, a red prepreg 10R produced by impregnating a plain epoxy glass cloth having a weight of 60 g / m 2 with a red epoxy resin obtained by adding 4 parts by weight of the red organic pigment diketopyrrolopyrrole to the epoxy resin is subjected to a punching process such as die cutting. Thus, a red mosaic pattern 10MR was created.
Next, a yellow prepreg 10Y produced by impregnating a plain weave glass cloth having a weight of 60 g / m 2 with a yellow epoxy resin obtained by adding 6 parts by weight of a yellow organic pigment disazo to an epoxy resin is subjected to a punching process such as die cutting. A yellow mosaic pattern 10MY was created.
Next, the blue prepreg 10B produced by impregnating a plain weave glass cloth having a weight of 60 g / m 2 with a blue epoxy resin obtained by adding 8 parts by weight of an organic pigment copper phthalocyanine blue to an epoxy resin is subjected to a punching process such as die cutting. Thus, a blue mosaic pattern 10MB was created.

上記赤色モザイクパターン１０ＭＲ、黄色モザイクパターン１０ＭＹ及び青色モザイクパターン１０ＭＢをモザイクパターンが型抜きされた白色プリプレグ１０ＤＷの所定位置にはめ込み、着色モザイクプレプレグ１０Ｃを作製した（図８（ｂ）及び（ｃ）参照）。   The red mosaic pattern 10MR, the yellow mosaic pattern 10MY, and the blue mosaic pattern 10MB were fitted into a predetermined position of the white prepreg 10DW from which the mosaic pattern was stamped to produce a colored mosaic prepreg 10C (FIGS. 8B and 8C). reference).

次に、両面着色プリント配線板１００Ｗの一方の面に、上記着色モザイクプレプレグ１０Ｃを、他方の面に、エポキシ樹脂に４重量部の赤色有機顔料ジケトピロロピロールを添加した赤色エポキシ樹脂を米坪６０ｇ／ｍ2の平織りガラスクロスに含浸させて作製した赤色プリプレグ１０Ｒを加圧、加熱して積層し、着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａを形成した（図７（ｂ）参照）。 Next, the above-mentioned colored mosaic prepreg 10C is applied to one side of the double-sided colored printed wiring board 100W, and the red epoxy resin obtained by adding 4 parts by weight of the red organic pigment diketopyrrolopyrrole to the epoxy resin is added to the other side. A red prepreg 10R produced by impregnating a plain weave glass cloth having a basis weight of 60 g / m 2 was pressed and heated to form a colored mosaic insulating layer 10Ca and a red insulating layer 10Ra (see FIG. 7B).

次に、レーザー加工にて、着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａの所定位置にビア用孔１３を形成した（図７（ｃ）参照）。
さらに、ビア用孔１３のデスミア処理及び着色モザイク絶縁層１０Ｃａ及び赤色絶縁層１０Ｒａ上の活性化処理を行って、無電解銅めっき等を行って、めっき下地導電層（特に、図示せず）を形成した。 Next, via holes 13 were formed at predetermined positions of the colored mosaic insulating layer 10Ca and the red insulating layer 10Ra by laser processing (see FIG. 7C).
Further, a desmear process of the via hole 13 and an activation process on the colored mosaic insulating layer 10Ca and the red insulating layer 10Ra are performed, and electroless copper plating or the like is performed to form a plating base conductive layer (not shown in particular). Formed.

次に、感光性のドライフィルムをラミネートしてレジスト層を形成し、パターン露光、現像等の一連のパターニング処理を行って、めっきレジストパターン４３ａ及び４３ｂを形成した（図７（ｄ）参照）。   Next, a photosensitive dry film was laminated to form a resist layer, and a series of patterning processes such as pattern exposure and development were performed to form plating resist patterns 43a and 43b (see FIG. 7D).

次に、めっき下地導電層を電極にして電解銅めっきを行い、１６μｍ厚の導体層３４及びビア３５を形成した（図７（ｅ）参照）。   Next, electrolytic copper plating was performed using the plating base conductive layer as an electrode to form a conductor layer 34 and a via 35 having a thickness of 16 μm (see FIG. 7E).

最後に、専用の剥離液でめっきレジストパターン４３ａ及び４３ｂを剥離処理し、めっきレジストパターン４３ａ及び４３ｂ下部にあっためっき下地導電層をクイックエッチングで除去し、両面白色プリント配線板１００Ｗの両面に配線層３４ａ及び３４ｂを形成し、配線層３４ａ及び３４ｂと配線層３１ａ及び３１ｂとがビア３５にて電気的に接続され、表面に着色モザイクパターンが形成された４層の着色プリント配線板３００を得た（図７（ｆ）参照）。   Finally, the plating resist patterns 43a and 43b are stripped with a special stripping solution, the plating base conductive layer under the plating resist patterns 43a and 43b is removed by quick etching, and wiring is performed on both sides of the double-sided white printed wiring board 100W. The layers 34a and 34b are formed, and the wiring layers 34a and 34b and the wiring layers 31a and 31b are electrically connected through the vias 35, and a four-layer colored printed wiring board 300 having a colored mosaic pattern formed on the surface is obtained. (See FIG. 7 (f)).

本発明の着色プリプレグの一実施例を示す模式構成断面図である。It is a typical composition sectional view showing one example of a coloring prepreg of the present invention. 本発明の着色プリント配線板の一実施例を示す模式構成断面図である。It is a typical composition sectional view showing one example of a coloring printed wiring board of the present invention. 本発明の着色プリント配線板の他の実施例を示す模式構成断面図である。It is a typical structure sectional view showing other examples of the coloring printed wiring board of the present invention. （ａ）は、本発明の着色プリント配線板の他の実施例を示す模式上面図である。（ｂ）は、本発明の着色プリント配線板の他の実施例を示す模式構成断面図である。(A) is a schematic top view which shows the other Example of the colored printed wiring board of this invention. (B) is a schematic cross-sectional view showing another embodiment of the colored printed wiring board of the present invention. （ａ）及び（ｅ）は、本発明の着色プリント配線板１００の製造方法の一例を示す模式構成断面図である。(A) And (e) is typical structure sectional drawing which shows an example of the manufacturing method of the colored printed wiring board 100 of this invention. （ａ）及び（ｆ）は、本発明の着色プリント配線板２００の製造方法の一例を示す模式構成断面図である。(A) And (f) is typical structure sectional drawing which shows an example of the manufacturing method of the colored printed wiring board 200 of this invention. （ａ）及び（ｆ）は、本発明の着色プリント配線板３００の製造方法の一例を示す模式構成断面図である。(A) And (f) is typical structure sectional drawing which shows an example of the manufacturing method of the colored printed wiring board 300 of this invention. （ａ）は、型抜き加工された着色プリプレグの一実施例を示す模式上面図である。（ｂ）は、着色モザイクプリプレグの一実施例を示す模式上面図である。（ｃ）は、着色モザイクプリプレグをＡ−Ａ’線で切断した模式構成断面図である。(A) is a schematic top view which shows one Example of the colored prepreg by which the die-cut process was carried out. (B) is a schematic top view which shows one Example of a colored mosaic prepreg. (C) is a schematic cross-sectional view of the colored mosaic prepreg cut along line A-A ′.

符号の説明Explanation of symbols

１０、……着色プリプレグ
１０ｗ……白色プリプレグ
１０Ｒ……赤色プリプレグ
１０Ｂ……青色プリプレグ
１０Ｙ……黄色プリプレグ
１０Ｄｗ……モザイクパターンが抜き加工された白色プリプレグ
１０ＭＹ……黄色モザイクパターン
１０ＭＲ……赤色モザイクパターン
１０ＭＢ……青色モザイクパターン
１０Ｒａ……赤色絶縁層
１０Ｂａ……青色絶縁層
１０Ｃ……着色モザイクプリプレグ
１０Ｃａ……着色モザイク絶縁層
１３……ビア用孔
３１……銅箔
３１ａ、３１ｂ、３２ａ、３２ｂ、３４ａ、３４ｂ……配線層
３２、３４……導体層
３３、３５……ビア
４１ａ、４１ｂ、４２ａ、４２ｂ、４３ａ、４３ｂ……レジストパターン
１００、２００、３００……着色プリント配線板
１００Ｗ……両面白色プリント配線板 10. Colored prepreg 10w …… White prepreg 10R …… Red prepreg 10B …… Blue prepreg 10Y …… Yellow prepreg 10Dw …… White prepreg 10MY from which a mosaic pattern has been cut out… Yellow mosaic pattern 10MR …… Red mosaic pattern 10 MB: Blue mosaic pattern 10 Ra: Red insulating layer 10 Ba: Blue insulating layer 10 C: Colored mosaic prepreg 10 Ca: Colored mosaic insulating layer 13: Via hole 31: Copper foils 31a, 31b, 32a, 32b, 34a, 34b ... wiring layers 32, 34 ... conductor layers 33, 35 ... vias 41a, 41b, 42a, 42b, 43a, 43b ... resist patterns 100, 200, 300 ... colored printed wiring boards 100W ... both sides White printed wiring board

Claims (5)

シート状のガラスクロスに着色熱硬化性樹脂を含浸したことを特徴とする着色プリプレグ。   A colored prepreg obtained by impregnating a sheet-shaped glass cloth with a colored thermosetting resin. 前記着色熱硬化性樹脂は熱硬化性樹脂に対して３〜２０重量部の着色顔料を添加したことを特徴とする請求項１に記載の着色プリプレグ。   2. The colored prepreg according to claim 1, wherein 3 to 20 parts by weight of a coloring pigment is added to the colored thermosetting resin relative to the thermosetting resin. 請求項１または２に記載の着色プリプレグの片面もしくは両面に配線層を形成したことを特徴とする着色プリント配線板。   A colored printed wiring board, wherein a wiring layer is formed on one side or both sides of the colored prepreg according to claim 1. 請求項３に記載の着色プリント配線板の片面もしくは両面に請求項１または２に記載の着色プリプレグを積層し、配線層を形成したことを特徴とする着色プリント配線板。   A colored printed wiring board, wherein the colored prepreg according to claim 1 or 2 is laminated on one side or both sides of the colored printed wiring board according to claim 3 to form a wiring layer. 請求項３に記載の着色プリント配線板の片面もしくは両面に請求項１または２に記載の着色プリプレグを任意の形状に加工して、着色モザイクパターンを形成した着色モザイクプリプレグを積層し、配線層を形成したことを特徴とする着色プリント配線板。   The colored prepreg according to claim 1 or 2 is processed into an arbitrary shape on one side or both sides of the colored printed wiring board according to claim 3, and a colored mosaic prepreg formed with a colored mosaic pattern is laminated to form a wiring layer. A colored printed wiring board characterized by being formed.
JP2005088102A 2005-03-25 2005-03-25 Colored printed wiring board using colored prepreg and method for producing the same Expired - Fee Related JP4826115B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077763A (en) * 2011-09-30 2013-04-25 Toppan Printing Co Ltd Printed wiring board

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230126A (en) * 1985-07-31 1987-02-09 Fujikura Rubber Ltd Colored prepreg and prepreg for producing colored fiber-reinforced plastic product
JPH04164392A (en) * 1990-10-29 1992-06-10 Matsushita Electric Ind Co Ltd Multilayer printed wiring board
JPH0539372A (en) * 1991-08-08 1993-02-19 Fujitsu Ltd Prepreg for estimating laminating press condition and method for estimating laminating press condition using the prepreg
JPH05327145A (en) * 1992-05-19 1993-12-10 Mitsubishi Electric Corp Printed wiring board
JP2003060321A (en) * 2001-08-10 2003-02-28 Risho Kogyo Co Ltd White laminated board used as printed wiring board
JP2004087550A (en) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd Printed wiring board
JP2004342871A (en) * 2003-05-16 2004-12-02 Nec Toppan Circuit Solutions Inc Multilayer printed wiring board and its manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230126A (en) * 1985-07-31 1987-02-09 Fujikura Rubber Ltd Colored prepreg and prepreg for producing colored fiber-reinforced plastic product
JPH04164392A (en) * 1990-10-29 1992-06-10 Matsushita Electric Ind Co Ltd Multilayer printed wiring board
JPH0539372A (en) * 1991-08-08 1993-02-19 Fujitsu Ltd Prepreg for estimating laminating press condition and method for estimating laminating press condition using the prepreg
JPH05327145A (en) * 1992-05-19 1993-12-10 Mitsubishi Electric Corp Printed wiring board
JP2003060321A (en) * 2001-08-10 2003-02-28 Risho Kogyo Co Ltd White laminated board used as printed wiring board
JP2004087550A (en) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd Printed wiring board
JP2004342871A (en) * 2003-05-16 2004-12-02 Nec Toppan Circuit Solutions Inc Multilayer printed wiring board and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077763A (en) * 2011-09-30 2013-04-25 Toppan Printing Co Ltd Printed wiring board

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