JPH05327145A - Printed wiring board - Google Patents

Abstract

PURPOSE:To easily recognize the accurate position of an electronic parts on a printed wiring board which parts is mounted by using boder lines, by forming a two-dimensional lattice mosaic pattern corresponding with coordinate axes, which pattern is formed by recoating coating or multicolored coating of resist on the printed wiring board. CONSTITUTION:A printed wiring board is coated with resist forming a two-dimensional lattice mosaic pattern. For example, firstly the board 1 is coated with first resist 3a, and secondly is coated in checker with second resist 3b. By the multi-layered coating of the second resist 3b in checker, in the above manner, differences of the transparency and the lightness of the resist are generated between the part where the multi-layered coating is performed and the part where it is not performed, and clear boder lines can be formed. Hence the boder line of resist which is the nearest to a coordinate position signal written on the board periphery can be traced without error. Thereby uncertainty that the fulcrum on the parts position is obtained by the eye while tracing the coordinate axis is excluded, and the coordinate position can be quickly defined.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to the position designation of electronic components to be mounted.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view showing a side structure of a conventional printed wiring board, in which 1 is a substrate and 2 is a substrate 1.
Electronic components 3 mounted on the substrate 1 are resists applied to the surface of the substrate 1. The resist 3 is uniformly applied on the substrate 1 except the electrical connection points between the substrate 1 and the component 2 and the outer peripheral portion of the substrate 1.

FIG. 3 is a plan view of a conventional printed wiring board. In the figure, the same reference numerals as those in FIG. 2 indicate the same or corresponding portions, and 4 indicates the X axis (left and right in the drawing) marked on the outer peripheral portion of the substrate 1. Coordinate position symbols (assuming X, Y coordinates with the direction being the X axis) are also coordinate position symbols for the Y axis, and X axis coordinate position symbol 4 is the alphabet of A, B, C, ... so,
The Y-axis coordinate position symbol is indicated by numbers 01, 02, 03, .... Reference numerals 6a and 6b denote the type name display symbols of the silk-printed component, and 7 denotes the position origin of the electronic component 2b.

Next, the position designation of electronic components mounted on the printed wiring board will be described. For example, when assembling a printed wiring board, specify the mounting position of each electronic component, identify the electronic component when analyzing a failure, describe the component mounting position in the logical connection diagram, and make correspondence with the component on the board. Due to the necessity of, for example, the mounting position of each electronic component can be designated on the printed wiring board. For example, as shown in FIG. And the Y-axis coordinate position symbol 5 are marked as a scale, and the position of each electronic component 2 on the printed wiring board can be read by the X, Y coordinates as the intersection of the X-axis and the Y-axis.

[0005]

Since the conventional printed wiring board is constructed as described above, there is a problem that it is not possible to clearly specify the position of the electronic component to be mounted. That is, in the conventional printed wiring board, as described above, the coordinate position in the X direction of the electronic component is specified by the X-axis coordinate position symbol by following the X-axis that does not actually exist, which relates to the mounting position of the electronic component, Similarly, the coordinate position of the electronic component in the Y direction is specified, that is, the electronic component mounting position is designated by using the X and Y coordinate position symbols written on the outer peripheral portion of the substrate.

That is, even if a coordinate position symbol is written near the electronic components, a large number of electronic components are mounted in the internal area of the printed wiring board excluding the outer peripheral portion, and the components are placed near each electronic component. Since the model name display symbol of is displayed, even if the coordinate position symbol is displayed avoiding the electronic component or its type name symbol, it is difficult to recognize it as the coordinate position symbol. Is displayed. Therefore, in order to know the component position, the intersection point on the component position of the X-axis and the Y-axis that is not actually displayed toward the component is obtained from the coordinate position symbol of the outer peripheral portion, It is an intersection, and the judgment of the boundary becomes ambiguous.

Further, when the size of the electronic component is larger than the scale of the coordinate position symbol and it straddles a plurality of regions, it is difficult to specify its position. In such a case, in order to uniquely determine the coordinate position, an agreement is generally set such that the region to which a specific part of the electronic component belongs is the coordinate of the component, and the position of the electronic component is determined according to this agreement. Specify. For example, the lower left part of an electronic component is defined as its specific part (called the position origin), and the position of the electronic component is specified depending on which coordinate position this position origin belongs to on the board. When it is located, it is difficult to judge because the boundary of the estimated region is ambiguous.

That is, referring to FIG. 3, the X and Y coordinate positions of the electronic component 2a are such that the X coordinate spans the scales "D" and "E" and the Y coordinate spans the scales "05" and "06". In this case, the electronic component 2a coordinate position is D0.
There are four regions, 5, D06, E05, and E06,
Furthermore, even if the position origin is set to the lower left, the position origin itself is located in the middle of the coordinate scale, so it is difficult to specify which region is D05 or E05. Similarly, the electronic component 2b has a position origin 7
Is located in the middle of the coordinate scale, it is difficult to specify which region is F06 or G06.

As prior arts applied for the purpose of solving this problem, there are the following two prior inventions.
The first invention is Japanese Patent Application Laid-Open No. Sho-6-
This is the invention disclosed in Japanese Patent Laid-Open No. 2-193291, "Method for writing coordinate axes of printed circuit board". This method displays a marking line drawn by silk printing on the surface of the printed circuit board in correspondence with the coordinate scale and prints it on the printed circuit board. It is characterized in that the mounting position of the mounted component of is read. However, in this method, when the part type name is displayed by silk printing, the coordinate notation line and the part type name display symbol overlap, which is rather difficult to understand. The second invention is the invention disclosed in Japanese Patent Application Laid-Open No. 59-181086, "Method for manufacturing printed circuit board", and this method is a method of replacing the coordinate display line with a small dot row opened in the resist. Is. However, when the dot rows are overlapped on the print pattern such as the copper foil, there is a portion which is not resisted in the print pattern, and there is a risk of short circuit.

The present invention has been made in order to solve such a problem, and because the board area is large, even if the distance between the coordinate position symbol and the mounted electronic component is large, or the size and shape of the electronic component are large. It is an object of the present invention to provide a printed wiring board that can clearly indicate the coordinate position of an electronic component to be mounted even if there are various types.

[0011]

In the printed wiring board according to the present invention, a resist is applied in a two-dimensional lattice mosaic pattern, and the application of the resist divides the substrate surface into several regions. is there. For example, if the width in the X-axis direction and the width in the Y-axis direction are the same for all the resisted regions, the resist applied on the substrate surface forms a checkered pattern.

[0012]

In the printed wiring board according to the present invention, the boundaries of the individual areas divided by the resist appear to divide the substrate surface into a grid pattern. Therefore, the boundary line of the resist closest to the coordinate position symbol written on the outer peripheral portion of the board can be traced without error, and the coordinate axis that does not actually exist can be traced as in the past, and the intersection point on the component position can be traced. The ambiguity of finding is eliminated, and the coordinate position on the substrate can be specified immediately.

[0013]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention, in which 1 is a substrate, 2 is an electronic component mounted on the substrate 1, and 3a is an electrical connection between the component 2 and the substrate 1 The first resist 3b applied to the substrate 1 is a second resist 3b overlaid on the first resist 3a, and 4 is the X-axis (the horizontal direction in the drawing is the X-axis) marked on the outer peripheral portion of the substrate 1. X and Y coordinate position symbols are assumed)
Is also a Y-axis coordinate position symbol, the X-axis coordinate position symbol 4 is an alphabet of A, B, C, ... And the Y-axis coordinate position symbol is a number of 01, 02, 03 ,. It is shown.

In this embodiment, the first resist 3a is first applied on the substrate 1, and then the second resist 3b is applied in a checkered pattern. By overlapping the resist 3b in a checkerboard pattern in this manner, the transparency and the lightness of the resist differ between the overlapped portion and the non-overcoated portion, and a clear boundary line can be formed. It should be noted that in FIG. 1, the part type designation symbols are not shown, and neither the resist 3a nor the resist 3b is applied to the electrical connection point between the substrate 1 and the electronic component 2, but this is also shown. It is omitted in 1.

When it is desired to know the position coordinates of the electronic component 2 on the substrate 1 thus constructed, both ends of the resist region occupied by the position origin of the electronic component 2 in the Y-axis direction (resist 3
Two boundary lines of a or both ends of the resist 3b) are traced toward the outer peripheral portion of the substrate 1. Since the boundary line is a straight line and reaches the outer peripheral portion of the substrate 1 without interruption, the boundary line can be easily traced and the substrate surrounded by the extension lines of the two boundary lines traced. The X-axis coordinate position symbol E on the outer peripheral portion of can be easily read. Similarly, the Y-axis coordinate position symbol 06 can be easily read by tracing the two boundary lines at both ends in the Y-axis direction. In this way, it can be read that the position coordinate of the electronic component 2 is E06. On the contrary, when the component position is known from the coordinate position symbol, it is possible to easily find the region where the X axis and the Y axis intersect by tracing two boundary lines that are close to the coordinate scale.

Example 2. In the first embodiment, an example in which the same color resist is used for both the first resist 3a and the second resist 3b is shown. However, different color resists are used for the first resist 3a and the second resist 3b. Due to
The boundary line can be made clearer. The other configurations are the same as those in the first embodiment.

Example 1 above. Example 2. In the above, the case where the intervals of the boundary lines are all the same is shown, but the intervals of the boundary lines do not have to be equal intervals, and may be matched to the size of the mounted component. Further, the pattern forming the boundary line is not limited to the checkered pattern, and may be a two-dimensional lattice mosaic pattern. Further, in the second embodiment, the second resist 3b having a different color is overcoated on the first resist 3a to form a checkered pattern. Alternatively, the three-dimensional lattice mosaic pattern may be alternately coated and formed.

[0018]

As described above, according to the present invention, the resist on the printed wiring board is overcoated or color-coded to form a two-dimensional lattice mosaic pattern corresponding to the coordinate axes, and the boundary line is used. It is possible to easily know the exact position of the mounted electronic component on the substrate.

Further, since the position area on the substrate can be made clear, it is possible to employ a narrow graduation interval, and it is possible to freely decide the graduation interval according to the size of the mounted component.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a conventional printed wiring board.

FIG. 3 is a plan view of a conventional printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 3a First resist 3b Second resist 4 X-axis coordinate position symbol 5 Y-axis coordinate position symbol

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[Procedure amendment]

[Submission date] September 2, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

[0012]

In the printed wiring board according to the present invention, the boundaries of the individual areas divided by the resist appear to divide the substrate surface into a grid pattern. Therefore, the boundary line of the resist closest to the coordinate position symbol written on the outer peripheral portion of the board can be traced without error, and the coordinate axis that does not actually exist can be traced as in the past, and the intersection point on the component position can be traced. The ambiguity of finding is eliminated, and the coordinate position on the board can be specified immediately.

Claims (2)

[Claims] 1. In a printed wiring board on which a resist is applied on a substrate and electronic parts are mounted, the first resist applied on the substrate is partially overcoated with the second resist. 2. A printed wiring board, wherein a two-dimensional lattice mosaic pattern corresponding to the coordinate position symbols attached to the outer peripheral portion of the substrate is formed. 2. A printed wiring board on which a resist is applied on a substrate and electronic components are mounted, wherein a resist of a first color applied on the substrate is partially coated with a resist of a second color different from this color. Overcoating, or by separately coating the resist of the first color and the resist of the second color, a two-dimensional lattice mosaic pattern corresponding to the coordinate position symbol attached to the outer peripheral portion of the substrate by the resist is formed. A printed wiring board characterized by being formed.