JPH04164392A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH04164392A JPH04164392A JP29236790A JP29236790A JPH04164392A JP H04164392 A JPH04164392 A JP H04164392A JP 29236790 A JP29236790 A JP 29236790A JP 29236790 A JP29236790 A JP 29236790A JP H04164392 A JPH04164392 A JP H04164392A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- layer pattern
- multilayer printed
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 238000007689 inspection Methods 0.000 abstract description 15
- 238000011179 visual inspection Methods 0.000 abstract description 3
- 238000004040 coloring Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 7
- 239000011162 core material Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 235000019557 luminance Nutrition 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に使用される多層プリント配線
板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer printed wiring board used in various electronic devices.
従来の技術
現在、電子機器の軽薄短小化に伴い、プリント配線板の
板厚の薄板化、パターンの高密度化が進みプリント配線
板の保証としての従来の拡大鏡等を使用する目視検査や
テスターによる導通チエツク等の方法ではその保証が困
難となシ、特に高密度実装に対応する多層プリント配線
板においては、その外層パターン検査において可視光の
反射を利用した外観検査装置を用いて行なうようになっ
てきている。Conventional technology Currently, as electronic devices become lighter, thinner, shorter, and smaller, printed wiring boards are becoming thinner and patterns are becoming more dense. It is difficult to guarantee this with methods such as continuity checks, especially for multilayer printed wiring boards that support high-density packaging. It has become to.
以下、第３図を参照しながら上記の外観検査装置をもち
いた多層プリント配線板の検査方法について説明する。Hereinafter, a method for inspecting a multilayer printed wiring board using the above-mentioned appearance inspection apparatus will be explained with reference to FIG.
第３図はソルダレジスト形成前の４層プリント配線板の
平面図で、上側よシ、多層パターン層１、絶縁層２を介
して内層パターン３、内層コア材４を介して内層パター
ン６、そして絶縁層６を介して裏面の外層パターン７を
積層形成した構成になっている。FIG. 3 is a plan view of the four-layer printed wiring board before forming the solder resist, showing the upper side, the multilayer pattern layer 1, the inner layer pattern 3 via the insulating layer 2, the inner layer pattern 6 via the inner layer core material 4, and the inner layer pattern 6 via the inner layer core material 4. It has a structure in which an outer layer pattern 7 on the back surface is laminated with an insulating layer 6 interposed therebetween.
上記絶縁層２，６は一般にガラス布にエポキシ樹脂等を
含浸させ、樹脂を半硬化の状態にしたものを内層パター
ン形成後の４履用プリント配線板に重ね合わせ、さらに
外側に銅はくを重ね合わせ積層することにより、一体成
型される。ソルダレジスト形成前に、外層パターンに可
視光である検査光８（以下、検査光８と記す。）を照射
し、その表面からの反射光を捕らえることによって外層
パターンの欠陥の有無を検査するものである。The insulating layers 2 and 6 are generally made by impregnating glass cloth with epoxy resin or the like, and then making the resin into a semi-cured state and overlaying it on the 4-seater printed wiring board after forming the inner layer pattern, and then coating the outside with copper foil. By overlapping and laminating, they are integrally molded. Before forming the solder resist, the outer layer pattern is inspected for defects by irradiating the outer layer pattern with visible light inspection light 8 (hereinafter referred to as inspection light 8) and capturing the reflected light from the surface. It is.
発明が解決しようとする課題
従来の方法で多層プリント配線板を検査する場合、外層
パターン部と非外層パターン部、すなわち絶縁層部とを
区分するために検査を行なう多層プリント配線板の表面
に検査光８を照射し、その反射光の輝度の分布図を作成
する。第４図ムのように輝度の分布が２つの領域に分離
された状態においては、この分離点の値（しきい値）を
正確に設定でき、しきい値よシ小さい輝度の領域には０
の値（外層パターン以外の部分）を、しきい値より大き
い領域には１の値（外層パターン部分）を対応させ画像
処理した２値画像で正確に検査が行なうことができる。Problems to be Solved by the Invention When inspecting a multilayer printed wiring board using a conventional method, an inspection is performed on the surface of the multilayer printed wiring board to distinguish between an outer layer pattern portion and a non-outer layer pattern portion, that is, an insulating layer portion. Light 8 is irradiated, and a distribution map of the brightness of the reflected light is created. When the luminance distribution is separated into two regions as shown in Figure 4, the value (threshold) of this separation point can be set accurately, and the region with luminance smaller than the threshold can be set to 0.
The inspection can be performed accurately using a binary image processed by associating a value of 1 (outer layer pattern part) with a value of 1 (outer layer pattern part) for an area larger than the threshold value.
しかし、多層プリント配線板のパターンの高密度化、薄
板化に伴って、外層パターンの下の従来の絶縁層２，６
を有する多層プリント配線板からの反射光には、第３図
に示すように外層パターン１からの反射光９と、外層パ
ター−７１の下の絶縁層２からの反射光１０と、内層パ
ターン３の表面からの反射光１１と、内層パターン６か
らの反射光１２と、裏面の外層パターン７からの反射光
１３がある。However, as the patterns of multilayer printed wiring boards become denser and thinner, the conventional insulating layers 2 and 6 under the outer layer pattern
As shown in FIG. 3, the reflected light from the multilayer printed wiring board includes reflected light 9 from the outer layer pattern 1, reflected light 10 from the insulating layer 2 under the outer layer pattern 71, and inner layer pattern 3. There are reflected light 11 from the front surface, reflected light 12 from the inner layer pattern 6, and reflected light 13 from the outer layer pattern 7 on the back surface.
以上このように必要とする反射光９及び反射光１０以外
に多数の反射レベルの異なる反射光が存在すると、輝度
分布が第４図Ｂに示すようになり、輝度の分離が明確で
なくなり、正確な検査ができないという問題があった。As described above, if there are many reflected lights with different reflection levels in addition to the necessary reflected lights 9 and 10, the luminance distribution will become as shown in Figure 4B, and the separation of luminances will not be clear and accurate There was a problem in that it was not possible to carry out thorough inspections.
本発明は、このような問題を解決するもので、従来の外
観検査装置を用いて信頼性の高い外層パターンの検査を
可能にする外層プリント配線板を提供することを目的と
する。The present invention solves these problems, and aims to provide an outer layer printed wiring board that allows highly reliable outer layer pattern inspection using a conventional visual inspection device.
課題を解決するための手段
本発明は上記の課題を解決するために、少なくとも片側
に外層パターンの下の絶縁層を不透明に着色したもので
ある。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention is such that the insulating layer under the outer layer pattern is colored opaque on at least one side.
作用
本発明は上記構成により、多層プリント配線板の外層パ
ターンの下の絶縁層が不透明となり、検査光が外層パタ
ーンの下の絶縁層を透過して内層パターンや裏面の外層
パターンへ達することがなくなり、反射光は検査対象の
外層パターンと外層、シ
パターンの下の絶縁層の表面からもののみになり正確な
検査をすることが可能となる。Effect of the present invention With the above structure, the insulating layer under the outer layer pattern of the multilayer printed wiring board becomes opaque, and the inspection light does not pass through the insulating layer below the outer layer pattern and reach the inner layer pattern or the outer layer pattern on the back side. The reflected light comes only from the outer layer pattern to be inspected and the surface of the insulating layer below the outer layer and the outer layer, making it possible to perform accurate inspection.
実施例
以下、本発明の一実施例について第１図及び第２図を参
照しながら説明する。第１図は本発明の一実施例による
多！１７７１７°リント配線板を示す図であり、第２図
はそれに用いるプリプレグの製造工程の一例を示す図で
ある。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 shows a multi-function device according to one embodiment of the present invention. FIG. 2 is a diagram showing a 17717° lint wiring board, and FIG. 2 is a diagram showing an example of a manufacturing process of a prepreg used therein.
まず、第２図において、多層プリント配線板の積層に用
いられる不透明に着色したガラス布エポキシ樹脂プリプ
レグの製造工程は、ガラス布のもどとなるガラス糸を製
造する紡糸工程と、そのガラス糸の織り工程と、織シ上
けられたガラス布の余分な油分を取り除く脱油工程と、
ガラヌ繊維と含浸させるエポキシ樹脂との接着性の向上
と積層板の曲は強度を向上させるためのアミノ−シラン
。First, in Figure 2, the manufacturing process of opaquely colored glass fabric epoxy resin prepreg used for laminating multilayer printed wiring boards consists of a spinning process to produce glass threads that become the base of the glass fabric, and a weaving process of the glass threads. process, and a deoiling process to remove excess oil from the woven glass cloth.
Amino-silane to improve the adhesion between the galanic fibers and the epoxy resin impregnated and the bending of the laminate to improve the strength.
エポキシ−シランなどの表面処理剤を使用した表面処理
工程と、さらにこのガラス布にシアニンブラック（住友
化学社１りの顔料を０．１〜２０ウ工イトパー七ント混
合して不透明に着色したエポキシ樹脂をガラス布に含浸
させ乾燥させる工程とから構成している。A surface treatment process using a surface treatment agent such as epoxy-silane, and an opaque epoxy coloring process using a surface treatment agent such as epoxy silane, and a mixture of 0.1 to 20 parts cyanine black (a pigment manufactured by Sumitomo Chemical Co., Ltd. It consists of the steps of impregnating glass cloth with resin and drying it.
ここで、第１図に示す外層パターンの下の絶縁層を不透
明に着色した４層プリント配線板の製造方法について説
明する。Here, a method for manufacturing a four-layer printed wiring board in which the insulating layer below the outer layer pattern shown in FIG. 1 is colored opaque will be described.
すなわち、４層プリント配線板の銅張積層板からなる内
層コア材２１に内層パターン２２を形成する工程と、上
記の方法で作製した着色された２枚のプリプレグによシ
、内層パターンを形成した内層コア材２１をはさみ、さ
らにプリプレグの外側に２枚の銅はくではさむように積
層する工程と、その積層した４履用プリント配線板を熱
プレス機により、内層コア材、プリプレグ、銅はくを一
体に成型する工程と、その後、外層の銅はくに外層パタ
ーン２３．２４を形成する工程によシ、第１図の４層プ
リント配線板は作製される。なお、第１図において、２
６はプリプレグによシ構成した絶縁層である。That is, a process of forming an inner layer pattern 22 on an inner layer core material 21 made of a copper-clad laminate of a four-layer printed wiring board, and forming an inner layer pattern on two sheets of colored prepreg produced by the above method. A process of sandwiching the inner layer core material 21 and then sandwiching it between two copper foils on the outside of the prepreg, and then stacking the laminated four-socket printed wiring board with a heat press machine to form the inner layer core material, the prepreg, and the copper foil. The four-layer printed wiring board shown in FIG. 1 is fabricated by a step of integrally molding the two layers, and then a step of forming outer layer patterns 23 and 24 on the outer copper foil. In addition, in Figure 1, 2
6 is an insulating layer made of prepreg.
以上により、４層プリント配線板に不透明に着色された
絶縁層２６を外層パターン２３の下に設けることができ
る。この多層フリント配線板では検査光２６が不透明に
着色した絶縁層２６によって遮断され、内層パターン２
２や裏面の外層パターン２４に影響されることなく外層
パターン２３からの反射光２７および着色した絶縁層２
６からの反射光２８のみとなり、反射光の輝度の分布は
第４図ムのように作成でき、正確な２値画像が作成可能
となる。 ゛
なお、本発明の一実施例では、着色されたプリプレグの
製造において使用した顔料の色は黒（シアニンブラック
）であったが、これに限るものではなく、また多層プリ
ント配線板を４層プリント配線板としたが３層以上のプ
リント配線板あれば同様め効果を得ることができるとい
うことは言うまでもない。As described above, the opaquely colored insulating layer 26 can be provided under the outer layer pattern 23 on the four-layer printed wiring board. In this multilayer flint wiring board, the inspection light 26 is blocked by the opaquely colored insulating layer 26, and the inner layer pattern 2
The reflected light 27 from the outer layer pattern 23 and the colored insulating layer 2 are not affected by the outer layer pattern 24 on the back surface.
Only the reflected light 28 from 6 is generated, and the luminance distribution of the reflected light can be created as shown in Fig. 4, making it possible to create an accurate binary image.゛Although in one embodiment of the present invention, the color of the pigment used in producing the colored prepreg was black (cyanine black), the color is not limited to this, and the multilayer printed wiring board may be printed with four layers. Although a wiring board is used, it goes without saying that a similar effect can be obtained by using a printed wiring board with three or more layers.
発明の効果
以上のように本発明によれば、多層プリント配線板の外
層パターンの下の絶縁層が不透明になシ、内層パターン
や裏面の外層パターンの影響がなくなり正確な外観検査
が可能となる。特に小型軽量な電子機器に使用される外
層パターンの下の絶縁層が薄くなる薄形の多層プリント
配線板の外観検査に対しては最も有効なものである。Effects of the Invention As described above, according to the present invention, the insulating layer under the outer layer pattern of a multilayer printed wiring board becomes opaque, and the influence of the inner layer pattern and the outer layer pattern on the back side is eliminated, making accurate appearance inspection possible. . In particular, it is most effective for visual inspection of thin multilayer printed wiring boards in which the insulating layer under the outer layer pattern is thin, which is used in small and lightweight electronic devices.
第１図は本発明の一実施例の多層プリント配線板の検査
の状況を示す断面図、第２図は本発明の一実施例に使用
するプリプレグの製造工程の一例を示す流れ図、第３図
は従来の多層プリント配線板の検査の状況を示す断面図
、第４図ム、Ｂは検査光の多層プリント配線板からの反
射光の分布図である。
２１・・・・・・内層コア材、２２°°°°°°内層パ
ターン、２３．２４・・・・・・外層パターン、２５・
・・・・・絶縁層。
代理人の氏名 弁理士 小鍜治 明 ほか２名第２図
°ｌ
第４図FIG. 1 is a sectional view showing the inspection status of a multilayer printed wiring board according to an embodiment of the present invention, FIG. 2 is a flowchart showing an example of the prepreg manufacturing process used in an embodiment of the present invention, and FIG. 4 is a sectional view showing the state of inspection of a conventional multilayer printed wiring board, and FIG. 4B is a distribution diagram of reflected light from the multilayer printed wiring board of the inspection light. 21... Inner layer core material, 22°°°°°° Inner layer pattern, 23.24... Outer layer pattern, 25.
...Insulating layer. Name of agent: Patent attorney Akira Okaji and two others Figure 2°l Figure 4
Claims (1)
ターンを形成する導体層下の絶縁層を不透明に着色した
ことを特徴とする多層プリント配線板。1. A multilayer printed wiring board having three or more conductor layers, and characterized in that an insulating layer under the conductor layer forming an outer layer pattern on at least one side is colored opaque.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29236790A JPH04164392A (en) | 1990-10-29 | 1990-10-29 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29236790A JPH04164392A (en) | 1990-10-29 | 1990-10-29 | Multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04164392A true JPH04164392A (en) | 1992-06-10 |
Family
ID=17780887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29236790A Pending JPH04164392A (en) | 1990-10-29 | 1990-10-29 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04164392A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0620703A1 (en) * | 1993-04-12 | 1994-10-19 | Ibiden Co, Ltd. | Resin compositions and printed circuit boards using the same |
| JP2006269893A (en) * | 2005-03-25 | 2006-10-05 | Toppan Printing Co Ltd | Colored prepreg and colored printed wiring board using the same |
| JP2007266195A (en) * | 2006-03-28 | 2007-10-11 | Dainippon Printing Co Ltd | Multilayer printed-wiring board and manufacturing method therefor |
-
1990
- 1990-10-29 JP JP29236790A patent/JPH04164392A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0620703A1 (en) * | 1993-04-12 | 1994-10-19 | Ibiden Co, Ltd. | Resin compositions and printed circuit boards using the same |
| JP2006269893A (en) * | 2005-03-25 | 2006-10-05 | Toppan Printing Co Ltd | Colored prepreg and colored printed wiring board using the same |
| JP2007266195A (en) * | 2006-03-28 | 2007-10-11 | Dainippon Printing Co Ltd | Multilayer printed-wiring board and manufacturing method therefor |
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