JPH05204162A - Production of printed circuit board - Google Patents

Abstract

PURPOSE:To eliminate the cutting of wires and defects in a circuit pattern by providing a pattern film with a grounding mechanism. CONSTITUTION:A grounding mechanism is disposed in the pattern film in a pattern exposing process for a printed circuit board. In this case, a dry film and the pattern film having the grounding mechanism are laminated on one side of an epoxy resin laminated board, fixed with a polyester fixing film, and exposed to light to print the pattern. The epoxy resin laminated board contains a glass cloth base and coated with copper on both surfaces. The same procedure is performed for the back surface of the board and then the board is ecthed to obtain an inner layer material having circuits on both surfaces. The top and back sides of the inner layer material are provided with each two sheets of glass-cloth-based epoxy resin prepreg, on which a laminated body having copper foil is disposed and integrated into one body. Then a circuit is formed on the outermost surface. Thereby, dust, foreign matter or the like hardly deposits on the fixing film, so that cutting of wires or defects due to dust or the like can be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used in electric equipment, electronic equipment, communication equipment, computing equipment and the like.

[0002]

2. Description of the Related Art Conventionally, in the pattern exposure process of a printed wiring board, the surface of the printed wiring board such as a metal foil-clad laminate is polished, washed and dried, and then a dry film or a resist coating process is carried out before the pattern film is mounted. Place it, and fix it with a fixing film such as polyethylene film, polyester film, polyacrylic film, etc. on the top of the frame frame of the exposure machine, expose it by vacuum adhesion and print the pattern film, but the fixing film due to static electricity generated during adsorption It was unavoidable that dust, foreign matter, etc. adhered to the wire, resulting in disconnection or loss of the circuit pattern.

[0003]

As described in the prior art, dust, foreign matter, etc. are liable to adhere to the fixing film, and the disconnection or loss of the circuit pattern due to this is unavoidable. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a method for manufacturing a printed wiring board having no circuit pattern disconnection or defect.

[0004]

The present invention achieves the above object because it is a method of manufacturing a printed wiring board, which is characterized in that a grounding mechanism is provided on the pattern film in the pattern exposure step of the printed wiring board. The present invention will be described in detail below.

As the printed wiring board used in the present invention,
Epoxy resin type, phenol resin type, unsaturated polyester resin type, silicone resin type, polyphenylene sulfide resin type, polyethylene terephthalate resin type, polybutylene terephthalate resin type, polyimide resin type, polybutadiene resin type, fluorine resin type, etc. A single resin, a modified product, a general resin such as a mixture can be used, and if necessary, an inorganic powder filler such as talc, clay, silica, calcium carbonate, and aluminum hydroxide,
Glass fiber, asbestos fiber, pulp fiber, synthetic fiber,
Fibrous fillers such as ceramic fibers can be included. As the base material, inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide and fluororesin, woven fabric such as natural fibers such as cotton, non-woven fabric, mat and paper can be used. It is a metal foil-clad laminate which can be used and which comprises a prepreg obtained by impregnating the above-mentioned resin with the above-mentioned base material and a metal foil provided and integrated. As the exposure device, all exposure devices such as a mercury lamp and an electrodeless lamp can be used. As the fixing film, general films such as polyethylene film, polyester film, polypropylene film, polyimide film, polyphenylene sulfide eyed film and the like can be used. As the grounding mechanism arranged on the pattern film, a commonly used grounding mechanism can be used as it is without any particular limitation.

The present invention will be described below based on examples.

[0007]

[Example] A dry film and a pattern film with an earth mechanism are overlaid on one side of a 0.8 mm-thick double-sided copper-clad glass cloth substrate epoxy resin laminated plate, fixed with a fixing polyester film, and exposed with an exposure machine. The pattern was printed. After performing the same treatment on the back surface side as well, etching treatment is performed to obtain an inner layer material having circuits on both sides, and two glass cloth base material epoxy resin prepregs each having a thickness of 0.1 mm are provided on the upper and lower surfaces of the inner layer material. Through a laminated body in which a copper foil having a thickness of 0.035 mm is arranged, and then a circuit is formed in the outermost layer.
A layer circuit printed wiring board was obtained.

[0008]

[Comparative Example] A four-layer circuit printed wiring board was obtained in the same manner as in Example except that a pattern film having no grounding mechanism was used.

The performance of the printed wiring boards of Examples and Comparative Examples is as shown in Table 1. The productivity of the exposure process is the ratio when the conventional value is 100.

[0010]

The present invention is constructed as described above.
In the method for manufacturing a printed wiring board having the structure described in the claims, there is an effect of reducing disconnection and loss of a circuit pattern and improving productivity.

Claims (1)

[Claims] 1. A method of manufacturing a printed wiring board, wherein a grounding mechanism is provided on the pattern film in the pattern exposure step of the printed wiring board.