JPH05335717A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPH05335717A JPH05335717A JP4141598A JP14159892A JPH05335717A JP H05335717 A JPH05335717 A JP H05335717A JP 4141598 A JP4141598 A JP 4141598A JP 14159892 A JP14159892 A JP 14159892A JP H05335717 A JPH05335717 A JP H05335717A
- Authority
- JP
- Japan
- Prior art keywords
- exposure
- wiring board
- layer material
- inner layer
- acquired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電気機器、電子機器、通
信機器、計算機器等に用いられる配線板の製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a wiring board used in electric equipment, electronic equipment, communication equipment, computing equipment and the like.
【0002】[0002]
【従来の技術】従来、配線板において、内層材の断線不
良が多発していた。この原因を調べてみると露光装置の
ガラス板とポリエステルフイルム又はアクリル板の間に
露光用フイルムを挟み、減圧して密着させて露光後、露
光装置を開ける際、静電気が発生し周囲の塵埃を吸引
し、そのままエッチング工程に入るのでパターン回路の
断線不良になることが判明した。2. Description of the Related Art Conventionally, in wiring boards, there have been many occurrences of disconnection defects in the inner layer material. When investigating the cause of this, the exposure film is sandwiched between the glass plate of the exposure device and the polyester film or acrylic plate, and the pressure is reduced to bring them into close contact.After exposure, when the exposure device is opened, static electricity is generated and dust around is sucked in. Since the etching process is directly performed, it has been found that the disconnection of the pattern circuit becomes defective.
【0003】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来のプリント配線板は断線不良が多いという欠
点があった。本発明は従来の技術における上述の問題点
に鑑みてなされたもので、その目的とするところは、断
線不良のない配線板の製造方法を提供することにある。As described in the prior art, the conventional printed wiring board has a drawback that there are many disconnection defects. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a method for manufacturing a wiring board free from disconnection defects.
【0004】[0004]
【課題を解決するための手段】本発明は、露光後、露光
面に露光用フイルム荷電イオンと逆のイオンを含む空気
を供給後、露光装置を開けることを特徴とする配線板の
製造方法のため、露光装置を開ける際の塵埃の吸引がな
く、上記目的を達成することができたもので、以下本発
明を詳細に説明する。According to the present invention, there is provided a method of manufacturing a wiring board, comprising the steps of: after exposure, after supplying air containing ions opposite to the exposure film charged ions to the exposure surface, the exposure device is opened. Therefore, it is possible to achieve the above object without sucking dust when opening the exposure apparatus. The present invention will be described in detail below.
【0005】本発明に用いる内層材、プリプレグ、外層
材に用いられる樹脂としては、エポキシ樹脂系、フェノ
ール樹脂系、不飽和ポリエステル樹脂系、ビニルエステ
ル樹脂系、ポリフェニレンオキサイド樹脂系、シリコン
樹脂系、ポリフェニレンサルファイド樹脂系、ポリエチ
レンテレフタレート樹脂系、ポリブチレンテレフタレー
ト樹脂系、ポリイミド樹脂系、ポリブタジエン樹脂系、
フッ素樹脂系等の単独、変性物、混合物のように樹脂全
般を用いることができ、必要に応じてタルク、クレー、
シリカ、炭酸カルシュウム、水酸化アルミニゥム等の無
機質粉末充填剤や、ガラス繊維、アスベスト繊維、パル
プ繊維、合成繊維、セラミック繊維等の繊維質充填剤を
含有させることができる。基材としては、ガラス、アス
ベスト等の無機質繊維やポリエステル、ポリアミド、ポ
リアクリル、ポリビニルアルコール、ポリイミド、フッ
素樹脂等の有機質繊維や木綿等の天然繊維の織布、不織
布、マット、紙等を用いることができる。金属箔として
は銅、アルミニュウム、真鍮、ニッケル、鉄等の単独、
合金、複合の金属箔を用いることができる。外層材とし
ては片面金属箔張積層板、両面金属箔張積層板、上記金
属箔等を用いることができる。かくして上記材料からな
る内層材、外層材の露光において露光後、露光面に露光
用フイルム荷電イオンと逆のイオンを含む空気を供給
後、露光装置を開けることにより塵埃の吸引をなくする
ことができるものである。露光装置、露光フイルムは限
定するものでなく、通常用いられるものをそのまま用い
ることができる。更に供給空気を加圧空気とすることに
より、より塵埃の吸引を防止することができる。Resins used for the inner layer material, prepreg and outer layer material used in the present invention include epoxy resin type, phenol resin type, unsaturated polyester resin type, vinyl ester resin type, polyphenylene oxide resin type, silicone resin type and polyphenylene type. Sulfide resin system, polyethylene terephthalate resin system, polybutylene terephthalate resin system, polyimide resin system, polybutadiene resin system,
A single resin such as a fluororesin type, a modified substance, or a general resin such as a mixture can be used, and if necessary, talc, clay,
Inorganic powder fillers such as silica, calcium carbonate and aluminum hydroxide, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be contained. As the substrate, use woven fabric, non-woven fabric, mat, paper, etc. of inorganic fibers such as glass and asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide, fluororesin and natural fibers such as cotton. You can As a metal foil, copper, aluminum, brass, nickel, iron etc. alone,
Alloys and composite metal foils can be used. As the outer layer material, a single-sided metal foil-clad laminate, a double-sided metal foil-clad laminate, the above metal foil or the like can be used. Thus, after exposure in the exposure of the inner layer material and the outer layer material made of the above materials, it is possible to eliminate suction of dust by opening the exposure device after supplying air containing ions opposite to the exposure film charged ions to the exposed surface. It is a thing. The exposure apparatus and the exposure film are not limited, and those normally used can be used as they are. Further, the supply air is pressurized air, so that the suction of dust can be further prevented.
【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.
【0007】[0007]
【実施例1】厚さ0.6mmのガラス布基材両面銅張エ
ポキシ樹脂積層板の両面に回路形成して得た内層材を、
常法に従って露光後、露光面がプラスイオンに荷電して
いるので、マイナスイオンを荷電させた常圧の空気を露
光面に供給してから露光装置を開け、エッチング工程を
経て得た内層材の上下面に厚み0.1mmのエポキシ樹
脂含浸ガラス布プリプレグ2枚を介し、最外側に厚さ
0.035mmの銅箔を各々配設した積層体を成形圧力
40Kg/cm2 、165℃で90分間加熱加圧成形し
て4層配線板を得た。Example 1 An inner layer material obtained by forming a circuit on both sides of a double-sided copper-clad epoxy resin laminate having a glass cloth substrate having a thickness of 0.6 mm was prepared.
After exposure according to the usual method, the exposed surface is charged with positive ions, so the atmospheric pressure of negative ions is supplied to the exposed surface, the exposure device is opened, and the inner layer material obtained through the etching process is A laminate in which two 0.1 mm-thick epoxy resin-impregnated glass cloth prepregs are placed on the upper and lower surfaces and 0.035 mm-thick copper foils are respectively arranged on the outermost side is molded at a pressure of 40 Kg / cm 2 at 165 ° C. for 90 minutes. Heat and pressure molding was performed to obtain a 4-layer wiring board.
【0008】[0008]
【実施例2】供給空気圧を2Kg/cm2 にした以外は
実施例1と同様に処理して4層配線板を得た。Example 2 A four-layer wiring board was obtained in the same manner as in Example 1 except that the supply air pressure was changed to 2 kg / cm 2 .
【0009】[0009]
【比較例】露光後、露光装置をそのまま開けた以外は実
施例1と同様に処理して4層配線板を得た。実施例1と
2及び比較例の配線板の断線不良率は表1のようであ
る。Comparative Example After exposure, a four-layer wiring board was obtained in the same manner as in Example 1 except that the exposure apparatus was opened as it was. Table 1 shows the disconnection failure rates of the wiring boards of Examples 1 and 2 and Comparative Example.
【0010】[0010]
【表1】 [Table 1]
【0011】[0011]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する配線板の製造方
法から得られた配線板においては、断線不良が低下する
効果がある。The present invention is constructed as described above.
In the wiring board obtained by the method for manufacturing a wiring board having the structure described in the claims, there is an effect that the disconnection defect is reduced.
Claims (2)
オンと逆のイオンを含む空気を供給後、露光装置を開け
ることを特徴とする配線板の製造方法。1. A method of manufacturing a wiring board, which comprises exposing the exposed surface with air containing ions opposite to the exposed film charged ions and then opening the exposure device.
求項1記載の配線板の製造方法。2. The method for manufacturing a wiring board according to claim 1, wherein pressurized air is supplied.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4141598A JPH05335717A (en) | 1992-06-02 | 1992-06-02 | Manufacture of wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4141598A JPH05335717A (en) | 1992-06-02 | 1992-06-02 | Manufacture of wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05335717A true JPH05335717A (en) | 1993-12-17 |
Family
ID=15295738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4141598A Pending JPH05335717A (en) | 1992-06-02 | 1992-06-02 | Manufacture of wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05335717A (en) |
-
1992
- 1992-06-02 JP JP4141598A patent/JPH05335717A/en active Pending
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