JPH0369191A - Multi-layer printed-circuit board with built-in electronic parts - Google Patents
Multi-layer printed-circuit board with built-in electronic partsInfo
- Publication number
- JPH0369191A JPH0369191A JP1205906A JP20590689A JPH0369191A JP H0369191 A JPH0369191 A JP H0369191A JP 1205906 A JP1205906 A JP 1205906A JP 20590689 A JP20590689 A JP 20590689A JP H0369191 A JPH0369191 A JP H0369191A
- Authority
- JP
- Japan
- Prior art keywords
- electronic parts
- circuit board
- electronic
- built
- substrate material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子部品内蔵の多層プリント基板に関し、特に
プリント基板内部に電子部品を埋め込んだ多層プリント
基板に間する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer printed circuit board with built-in electronic components, and particularly to a multilayer printed circuit board in which electronic components are embedded inside the printed circuit board.
従来、プリント基板は写真製版技術により銅配線を高密
度化すると共に基板の多層化が進められてきたが、いず
れも配線のみの高密度化、高多層化に対応してきたに過
ぎなかった。Conventionally, photolithography technology has been used to increase the density of copper wiring in printed circuit boards and to increase the number of layers in the board, but in both cases, only the wiring has become more dense and multilayered.
上述した従来のプリント基板は、配線のみの高密度化、
高多層化への対応に留まっていたため、電子回路全体の
高密度化に対しては、いかにファインパターン化された
写真製版技術を駆使しても限界があるという欠点があっ
た。The conventional printed circuit board mentioned above has only a high density of wiring,
Because they were limited to responding to high multilayers, there was a drawback that there was a limit to increasing the density of the entire electronic circuit, no matter how finely patterned the photolithography technology was used.
本発明は、基板材に形成された銅配線に電子部品を搭載
し、その上から樹脂で一面に被覆して電子部品埋め込み
層を形成し、この電子部品埋め込み層を接着剤を介して
積層した電子部品内蔵の多層プリント基板である。In the present invention, electronic components are mounted on copper wiring formed on a substrate material, the electronic component embedding layer is formed by covering the entire surface with resin, and the electronic component embedding layer is laminated with an adhesive. It is a multilayer printed circuit board with built-in electronic components.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the invention.
本実施例では、電子部品埋め込み層１にチップ部品３を
埋め込んだ構成である。In this embodiment, a chip component 3 is embedded in an electronic component embedding layer 1.
電子部品埋め込み層↓には、基板材６上に、銅配線２と
チップ部品３により電子回路が形成されている。電子部
品埋め込み層１の厚みを均一にするために樹脂４を一面
に注入する。さらに接着剤うにより上部基板材との接合
を図っている。In the electronic component buried layer↓, an electronic circuit is formed on a substrate material 6 by copper wiring 2 and chip components 3. In order to make the thickness of the electronic component embedding layer 1 uniform, resin 4 is injected over the entire surface. Furthermore, adhesive is used to bond it to the upper substrate material.
この実施例では、表面実装部品７の他に電子部品埋め込
み層１を一層設けたことによって実装の高密度化を図っ
ている。In this embodiment, an electronic component embedding layer 1 is provided in addition to the surface mount component 7, thereby achieving higher mounting density.
第２図は本発明の第２の実施例を示す断面図である。電
子部品埋め込み層８には、基板材６上に銅配線２と小型
パッケージ部品９及びフラットパッケージ部品１０が埋
め込まれ、電子回路が形成されている。各電子回路は銅
スルーホール１１により導通が取られている。FIG. 2 is a sectional view showing a second embodiment of the invention. In the electronic component embedding layer 8, a copper wiring 2, a small package component 9, and a flat package component 10 are embedded on a substrate material 6 to form an electronic circuit. Each electronic circuit is electrically connected by a copper through hole 11.
この実施例では、−層のみではなく内部多層に電子部品
埋め込み層を設けると共に、小型パッケージ部品やフラ
ットパッケージ部品を埋め込んでいるため、電子回路全
体のより高密度化が図れるという利点がある。In this embodiment, an electronic component embedding layer is provided not only in the negative layer but also in the internal multilayers, and small package components and flat package components are embedded, so there is an advantage that the entire electronic circuit can be made more dense.
以上説明したように本発明は、多層プリント基板の内部
層に電子部品を埋め込むことにより、従来の配線のみの
高密度化では対応できなかった電子回路全体の超高密度
ｆヒに対応できるという効果がある。As explained above, the present invention has the advantage that by embedding electronic components in the internal layers of a multilayer printed circuit board, it is possible to cope with ultra-high densities of the entire electronic circuit, which could not be achieved with conventional high-density wiring alone. There is.
第１図は本発明の第１の実施例の断面図、第２図は本発
明の第２の実施例の断面図である９１・・・電子部品埋
め込み層、２・・・銅配線、３・・・チップ部品、４・
・・樹脂、５・・・接着剤、６・・・基板材、７・・・
表面実装部品、８・・・電子部品埋め込み層、９・・・
小型バラゲージ部品、１０・・・フラットパッケージ部
品、工１・・・銅スルーホール。FIG. 1 is a sectional view of a first embodiment of the present invention, and FIG. 2 is a sectional view of a second embodiment of the present invention. ...Chip parts, 4.
...Resin, 5...Adhesive, 6...Substrate material, 7...
Surface mount component, 8...Electronic component embedded layer, 9...
Small barrier gauge parts, 10...flat package parts, work 1...copper through holes.
Claims (1)
から樹脂で一面に被覆して電子部品埋め込み層を形成し
、この電子部品埋め込み層を接着剤を介して積層したこ
とを特徴とする電子部品内蔵の多層プリント基板。It is characterized by mounting electronic components on copper wiring formed on a substrate material, covering the entire surface with resin to form an electronic component embedding layer, and laminating this electronic component embedding layer via an adhesive. Multilayer printed circuit board with built-in electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1205906A JPH0369191A (en) | 1989-08-08 | 1989-08-08 | Multi-layer printed-circuit board with built-in electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1205906A JPH0369191A (en) | 1989-08-08 | 1989-08-08 | Multi-layer printed-circuit board with built-in electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0369191A true JPH0369191A (en) | 1991-03-25 |
Family
ID=16514714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1205906A Pending JPH0369191A (en) | 1989-08-08 | 1989-08-08 | Multi-layer printed-circuit board with built-in electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0369191A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5925403A (en) * | 1994-01-31 | 1999-07-20 | Matsushita Electric Works, Ltd. | Method of coating a copper film on a ceramic substrate |
| CN1072736C (en) * | 1994-01-31 | 2001-10-10 | 松下电工株式会社 | Method of coating a copper film on a ceramic substrate |
| US6525921B1 (en) | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| US6625037B2 (en) | 1997-11-25 | 2003-09-23 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method manufacturing the same |
| US6734542B2 (en) | 2000-12-27 | 2004-05-11 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
| JP2007335675A (en) * | 2006-06-15 | 2007-12-27 | Fuji Electric Systems Co Ltd | Power supply and method for manufacturing power supply |
| US7394663B2 (en) | 2003-02-18 | 2008-07-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component built-in module and method of manufacturing the same |
| JP2009071259A (en) * | 2007-09-10 | 2009-04-02 | Hynix Semiconductor Inc | Semiconductor package and manufacturing method |
| US7566584B2 (en) | 2005-05-23 | 2009-07-28 | Seiko Epson Corporation | Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
| US7793411B2 (en) | 2006-11-07 | 2010-09-14 | Seiko Epson Corporation | Method for manufacturing electronic substrate |
| WO2016129705A1 (en) * | 2015-02-13 | 2016-08-18 | パイクリスタル株式会社 | Method for forming laminated circuit board, and laminated circuit board formed using same |
-
1989
- 1989-08-08 JP JP1205906A patent/JPH0369191A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1072736C (en) * | 1994-01-31 | 2001-10-10 | 松下电工株式会社 | Method of coating a copper film on a ceramic substrate |
| US5925403A (en) * | 1994-01-31 | 1999-07-20 | Matsushita Electric Works, Ltd. | Method of coating a copper film on a ceramic substrate |
| US6625037B2 (en) | 1997-11-25 | 2003-09-23 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method manufacturing the same |
| US7068519B2 (en) | 1997-11-25 | 2006-06-27 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method manufacturing the same |
| US7013561B2 (en) | 1999-11-12 | 2006-03-21 | Matsushita Electric Industrial Co., Ltd. | Method for producing a capacitor-embedded circuit board |
| US6525921B1 (en) | 1999-11-12 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| US7198996B2 (en) | 2000-12-27 | 2007-04-03 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
| US6939738B2 (en) | 2000-12-27 | 2005-09-06 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
| US6734542B2 (en) | 2000-12-27 | 2004-05-11 | Matsushita Electric Industrial Co., Ltd. | Component built-in module and method for producing the same |
| US7394663B2 (en) | 2003-02-18 | 2008-07-01 | Matsushita Electric Industrial Co., Ltd. | Electronic component built-in module and method of manufacturing the same |
| US7566584B2 (en) | 2005-05-23 | 2009-07-28 | Seiko Epson Corporation | Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method |
| JP2007335675A (en) * | 2006-06-15 | 2007-12-27 | Fuji Electric Systems Co Ltd | Power supply and method for manufacturing power supply |
| US7793411B2 (en) | 2006-11-07 | 2010-09-14 | Seiko Epson Corporation | Method for manufacturing electronic substrate |
| JP2009071259A (en) * | 2007-09-10 | 2009-04-02 | Hynix Semiconductor Inc | Semiconductor package and manufacturing method |
| JP2012231169A (en) * | 2007-09-10 | 2012-11-22 | Sk Hynix Inc | Manufacturing method of semiconductor package |
| WO2016129705A1 (en) * | 2015-02-13 | 2016-08-18 | パイクリスタル株式会社 | Method for forming laminated circuit board, and laminated circuit board formed using same |
| US11122693B2 (en) | 2015-02-13 | 2021-09-14 | Pi-Crystal Incorporation | Method for forming laminated circuit board |
| US11985768B2 (en) | 2015-02-13 | 2024-05-14 | Pi-Crystal Incorporation | Laminated circuit board |
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