JPH0369191A - Multi-layer printed-circuit board with built-in electronic parts - Google Patents

Multi-layer printed-circuit board with built-in electronic parts

Info

Publication number
JPH0369191A
JPH0369191A JP1205906A JP20590689A JPH0369191A JP H0369191 A JPH0369191 A JP H0369191A JP 1205906 A JP1205906 A JP 1205906A JP 20590689 A JP20590689 A JP 20590689A JP H0369191 A JPH0369191 A JP H0369191A
Authority
JP
Japan
Prior art keywords
electronic parts
circuit board
electronic
built
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1205906A
Other languages
Japanese (ja)
Inventor
Katsuhiko Itagaki
克彦 板垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1205906A priority Critical patent/JPH0369191A/en
Publication of JPH0369191A publication Critical patent/JPH0369191A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To achieve super-high density of the entire electronic circuit by mounting an electronic parts on a copper wire which is formed on a substrate material, coating it with resin for forming an electronic parts embedded layer, and then performing lamination through an adhesive. CONSTITUTION:An electronic circuit is formed on an electronic parts embedded layer 1 by a copper wire 2 and a chip parts 3. Then, a resin 4 is injected into the entire surface to enable the thickness of the electronic parts embedded layer 1 to be uniform. Further, joining with an upper-part substrate material can be made by an adhesive 5.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子部品内蔵の多層プリント基板に関し、特に
プリント基板内部に電子部品を埋め込んだ多層プリント
基板に間する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a multilayer printed circuit board with built-in electronic components, and particularly to a multilayer printed circuit board in which electronic components are embedded inside the printed circuit board.

〔従来の技術〕[Conventional technology]

従来、プリント基板は写真製版技術により銅配線を高密
度化すると共に基板の多層化が進められてきたが、いず
れも配線のみの高密度化、高多層化に対応してきたに過
ぎなかった。
Conventionally, photolithography technology has been used to increase the density of copper wiring in printed circuit boards and to increase the number of layers in the board, but in both cases, only the wiring has become more dense and multilayered.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のプリント基板は、配線のみの高密度化、
高多層化への対応に留まっていたため、電子回路全体の
高密度化に対しては、いかにファインパターン化された
写真製版技術を駆使しても限界があるという欠点があっ
た。
The conventional printed circuit board mentioned above has only a high density of wiring,
Because they were limited to responding to high multilayers, there was a drawback that there was a limit to increasing the density of the entire electronic circuit, no matter how finely patterned the photolithography technology was used.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、基板材に形成された銅配線に電子部品を搭載
し、その上から樹脂で一面に被覆して電子部品埋め込み
層を形成し、この電子部品埋め込み層を接着剤を介して
積層した電子部品内蔵の多層プリント基板である。
In the present invention, electronic components are mounted on copper wiring formed on a substrate material, the electronic component embedding layer is formed by covering the entire surface with resin, and the electronic component embedding layer is laminated with an adhesive. It is a multilayer printed circuit board with built-in electronic components.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の第1の実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the invention.

本実施例では、電子部品埋め込み層1にチップ部品3を
埋め込んだ構成である。
In this embodiment, a chip component 3 is embedded in an electronic component embedding layer 1.

電子部品埋め込み層↓には、基板材6上に、銅配線2と
チップ部品3により電子回路が形成されている。電子部
品埋め込み層1の厚みを均一にするために樹脂4を一面
に注入する。さらに接着剤うにより上部基板材との接合
を図っている。
In the electronic component buried layer↓, an electronic circuit is formed on a substrate material 6 by copper wiring 2 and chip components 3. In order to make the thickness of the electronic component embedding layer 1 uniform, resin 4 is injected over the entire surface. Furthermore, adhesive is used to bond it to the upper substrate material.

この実施例では、表面実装部品7の他に電子部品埋め込
み層1を一層設けたことによって実装の高密度化を図っ
ている。
In this embodiment, an electronic component embedding layer 1 is provided in addition to the surface mount component 7, thereby achieving higher mounting density.

第2図は本発明の第2の実施例を示す断面図である。電
子部品埋め込み層8には、基板材6上に銅配線2と小型
パッケージ部品9及びフラットパッケージ部品10が埋
め込まれ、電子回路が形成されている。各電子回路は銅
スルーホール11により導通が取られている。
FIG. 2 is a sectional view showing a second embodiment of the invention. In the electronic component embedding layer 8, a copper wiring 2, a small package component 9, and a flat package component 10 are embedded on a substrate material 6 to form an electronic circuit. Each electronic circuit is electrically connected by a copper through hole 11.

この実施例では、−層のみではなく内部多層に電子部品
埋め込み層を設けると共に、小型パッケージ部品やフラ
ットパッケージ部品を埋め込んでいるため、電子回路全
体のより高密度化が図れるという利点がある。
In this embodiment, an electronic component embedding layer is provided not only in the negative layer but also in the internal multilayers, and small package components and flat package components are embedded, so there is an advantage that the entire electronic circuit can be made more dense.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、多層プリント基板の内部
層に電子部品を埋め込むことにより、従来の配線のみの
高密度化では対応できなかった電子回路全体の超高密度
fヒに対応できるという効果がある。
As explained above, the present invention has the advantage that by embedding electronic components in the internal layers of a multilayer printed circuit board, it is possible to cope with ultra-high densities of the entire electronic circuit, which could not be achieved with conventional high-density wiring alone. There is.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の第1の実施例の断面図、第2図は本発
明の第2の実施例の断面図である91・・・電子部品埋
め込み層、2・・・銅配線、3・・・チップ部品、4・
・・樹脂、5・・・接着剤、6・・・基板材、7・・・
表面実装部品、8・・・電子部品埋め込み層、9・・・
小型バラゲージ部品、10・・・フラットパッケージ部
品、工1・・・銅スルーホール。
FIG. 1 is a sectional view of a first embodiment of the present invention, and FIG. 2 is a sectional view of a second embodiment of the present invention. ...Chip parts, 4.
...Resin, 5...Adhesive, 6...Substrate material, 7...
Surface mount component, 8...Electronic component embedded layer, 9...
Small barrier gauge parts, 10...flat package parts, work 1...copper through holes.

Claims (1)

【特許請求の範囲】[Claims]  基板材に形成された銅配線に電子部品を搭載しその上
から樹脂で一面に被覆して電子部品埋め込み層を形成し
、この電子部品埋め込み層を接着剤を介して積層したこ
とを特徴とする電子部品内蔵の多層プリント基板。
It is characterized by mounting electronic components on copper wiring formed on a substrate material, covering the entire surface with resin to form an electronic component embedding layer, and laminating this electronic component embedding layer via an adhesive. Multilayer printed circuit board with built-in electronic components.
JP1205906A 1989-08-08 1989-08-08 Multi-layer printed-circuit board with built-in electronic parts Pending JPH0369191A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1205906A JPH0369191A (en) 1989-08-08 1989-08-08 Multi-layer printed-circuit board with built-in electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1205906A JPH0369191A (en) 1989-08-08 1989-08-08 Multi-layer printed-circuit board with built-in electronic parts

Publications (1)

Publication Number Publication Date
JPH0369191A true JPH0369191A (en) 1991-03-25

Family

ID=16514714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1205906A Pending JPH0369191A (en) 1989-08-08 1989-08-08 Multi-layer printed-circuit board with built-in electronic parts

Country Status (1)

Country Link
JP (1) JPH0369191A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
CN1072736C (en) * 1994-01-31 2001-10-10 松下电工株式会社 Method of coating a copper film on a ceramic substrate
US6525921B1 (en) 1999-11-12 2003-02-25 Matsushita Electric Industrial Co., Ltd Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
US6625037B2 (en) 1997-11-25 2003-09-23 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method manufacturing the same
US6734542B2 (en) 2000-12-27 2004-05-11 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
JP2007335675A (en) * 2006-06-15 2007-12-27 Fuji Electric Systems Co Ltd Power supply and method for manufacturing power supply
US7394663B2 (en) 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
JP2009071259A (en) * 2007-09-10 2009-04-02 Hynix Semiconductor Inc Semiconductor package and manufacturing method
US7566584B2 (en) 2005-05-23 2009-07-28 Seiko Epson Corporation Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
US7793411B2 (en) 2006-11-07 2010-09-14 Seiko Epson Corporation Method for manufacturing electronic substrate
WO2016129705A1 (en) * 2015-02-13 2016-08-18 パイクリスタル株式会社 Method for forming laminated circuit board, and laminated circuit board formed using same

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072736C (en) * 1994-01-31 2001-10-10 松下电工株式会社 Method of coating a copper film on a ceramic substrate
US5925403A (en) * 1994-01-31 1999-07-20 Matsushita Electric Works, Ltd. Method of coating a copper film on a ceramic substrate
US6625037B2 (en) 1997-11-25 2003-09-23 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method manufacturing the same
US7068519B2 (en) 1997-11-25 2006-06-27 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method manufacturing the same
US7013561B2 (en) 1999-11-12 2006-03-21 Matsushita Electric Industrial Co., Ltd. Method for producing a capacitor-embedded circuit board
US6525921B1 (en) 1999-11-12 2003-02-25 Matsushita Electric Industrial Co., Ltd Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
US7198996B2 (en) 2000-12-27 2007-04-03 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
US6939738B2 (en) 2000-12-27 2005-09-06 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
US6734542B2 (en) 2000-12-27 2004-05-11 Matsushita Electric Industrial Co., Ltd. Component built-in module and method for producing the same
US7394663B2 (en) 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US7566584B2 (en) 2005-05-23 2009-07-28 Seiko Epson Corporation Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
JP2007335675A (en) * 2006-06-15 2007-12-27 Fuji Electric Systems Co Ltd Power supply and method for manufacturing power supply
US7793411B2 (en) 2006-11-07 2010-09-14 Seiko Epson Corporation Method for manufacturing electronic substrate
JP2009071259A (en) * 2007-09-10 2009-04-02 Hynix Semiconductor Inc Semiconductor package and manufacturing method
JP2012231169A (en) * 2007-09-10 2012-11-22 Sk Hynix Inc Manufacturing method of semiconductor package
WO2016129705A1 (en) * 2015-02-13 2016-08-18 パイクリスタル株式会社 Method for forming laminated circuit board, and laminated circuit board formed using same
US11122693B2 (en) 2015-02-13 2021-09-14 Pi-Crystal Incorporation Method for forming laminated circuit board
US11985768B2 (en) 2015-02-13 2024-05-14 Pi-Crystal Incorporation Laminated circuit board

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