JPH1144511A - Method and device for detecting resin adhesion state - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a detection method for resin adhesion state which is capable of quantitatively detecting the thickness difference of resin layers formed on each of surfaces of base member consisting of fiber. SOLUTION: After photographing images corresponding to surface shapes of resin layers 3a and 3b from one side and the other side of a base member 1 with the first photographing means 13 and the second photographing means 14, the shape characteristic values of surface shape of resin layers are obtained from the light intensity of each photographed image with the first image processing means 15 and the second image processing means 16, respectively. Then by obtaining the difference of the obtained shape characteristic values using an operation/output means 17, the thickness difference of the resin layers 3a and 3b is detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting the state of adhesion of a resin, for example, during the production of a prepreg, and a detection apparatus used for the detection.

[0002]

2. Description of the Related Art Printed wiring boards used in electric and electronic equipment are made by impregnating a base material such as a glass cloth with a resin varnish such as an epoxy resin, and then heating and semi-curing as necessary. A resin-impregnated base material generally called a prepreg is manufactured, a required number of the resin-impregnated base materials are stacked, and a metal foil such as a copper foil is arranged and laminated on one or both sides thereof. Manufacture laminates. Then, the circuit is formed by etching the metal foil on the surface of the metal foil-clad laminate to form a circuit.

As a method of impregnating a resin varnish into a substrate when the resin-impregnated substrate is continuously manufactured, for example, a resin varnish 31 measured in a predetermined amount as shown in FIG. A method in which the resin varnish 31 is continuously supplied to one surface of the continuously supplied substrate 2 and then penetrated into and impregnated with the resin varnish 31 or a resin varnish as shown in FIG. After the base material 2 is continuously immersed in the impregnation tank 35 filled with 31 and immersed in the resin varnish 31, the base material 2 is drawn out of the impregnation tank 35, and then between the rolls 36 arranged at a predetermined interval. A method of adjusting the adhesion amount of the resin varnish 31 to a predetermined amount by sandwiching and squeezing is used.

The resin-impregnated base material thus obtained is supplied with a predetermined amount of the resin varnish 31 or is sandwiched between rolls 36 to adjust the amount of adhesion to a predetermined amount. Therefore, the impregnation amount of the resin varnish 31 when viewed over the entire thickness of the resin-impregnated base material becomes substantially constant, but as shown in FIG. 7A, the resin formed on the front and back surfaces of the base material 2 Layer 3
In some cases, there was a difference in thickness between a and 3b. A laminate manufactured using a resin-impregnated base material having a difference in thickness between the resin layers 3a and 3b formed on the front and back surfaces of the base material 2 is heated and pressed to manufacture the laminate. When done, the resin layer 3
a, 3b, a difference in the amount of heat shrinkage occurs, and warpage is likely to occur.
There has been a problem that it is difficult to respond to an automatic machine in a printed wiring board processing step, and a problem that reliability of circuit formation and component mounting is low.

For this reason, a method of visually inspecting the resin-impregnated base material by comparing the front and back surfaces of the resin-impregnated base material, and performing an inspection by touching the front and back surfaces of the resin-impregnated base material with a fingertip are performed. However, in the case of such a manual method, there is a problem that only a pass / fail judgment can be made and a quantitative inspection cannot be performed. Therefore, it is possible to quantitatively detect the difference in the thickness of the resin layer formed on each surface of the base material, it is possible to inspect the resin adhesion state by comparing with a predetermined reference value, etc. There is a need for a method for detecting the state of resin adhesion.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to impregnate a substrate made of fibers with a liquid thermosetting resin composition. A method for detecting the state of adhesion of a resin, wherein the difference between the thickness of the resin layer formed on each surface of the substrate and the resin-impregnated substrate having the resin layer formed on both surfaces of the substrate is detected. It is an object of the present invention to provide a method for detecting a resin adhesion state, which can quantitatively detect a difference in thickness of a resin layer formed on each surface of an impregnated base material.

Also, a resin-impregnated substrate detecting apparatus capable of quantitatively detecting a difference in thickness of a resin layer formed on each surface of the resin-impregnated substrate used in the method for detecting the resin adhesion state. Is to provide.

[0008]

According to a first aspect of the present invention, there is provided a method for detecting a resin adhering state, comprising impregnating a substrate made of fibers with a liquid thermosetting resin composition, and applying the resin to both surfaces of the substrate. In the method of detecting the resin adhesion state of detecting the difference in thickness of the resin layer formed on each surface of the base material, the resin impregnated base material having the resin layer formed on the base material, The method of detecting the difference in thickness is such that an image corresponding to the surface shape of the resin layer is captured from one surface side and the other surface side of the base material, respectively, and the light amount of each captured image is
Calculate the shape characteristic value of the surface shape of the resin layer, and then detect the difference in the thickness of the resin layer by calculating the difference between the shape characteristic values on one surface side and the other surface side of the obtained base material. The method is characterized by:

According to a second aspect of the present invention, there is provided a method for detecting a resin adhesion state according to the first aspect, wherein an image corresponding to the surface shape of the resin layer is formed on one side of the base material. And the method of imaging from the other surface side, respectively, the light in the direction crossing obliquely to the virtual surface formed by connecting the center of the thickness of the substrate, one surface side of the substrate and the other This is a method of irradiating the surface of the resin layer from the surface side, and of the irradiated light, an image of light reflected on the surface of the resin layer is captured from one surface side and the other surface side of the base material, respectively. It is characterized by the following.

According to a third aspect of the present invention, there is provided a method for detecting a resin adhered state according to the second aspect, wherein the method for capturing an image of light reflected on the surface of the resin layer comprises the steps of: The method is characterized in that it is a method of imaging light that is specularly reflected at a portion parallel to the virtual surface on the surface of (1).

According to a fourth aspect of the present invention, there is provided a method of detecting a resin adhesion state according to the second or third aspect, wherein the surface of the resin layer is irradiated from one surface side of the base material. The direction of light to be emitted and the direction of light emitted from the other surface side of the base material to the surface of the resin layer are symmetrical directions with respect to the virtual plane.

According to a fifth aspect of the present invention, there is provided a method for detecting a resin adhesion state according to any one of the second to fourth aspects, wherein the light applied to the surface of the resin layer comprises: It is a parallel light.

According to a sixth aspect of the present invention, there is provided the resin adhesion state detecting method according to any one of the second to fifth aspects, wherein an image corresponding to the surface shape of the resin layer is formed. When imaging from one surface side of the base material, light irradiated from the other surface side of the base material is not irradiated, and when an image corresponding to the surface shape of the resin layer is imaged from the other surface side of the base material Is characterized in that light irradiated from one surface side of the substrate is not irradiated.

According to a seventh aspect of the present invention, there is provided a method for detecting a resin adhesion state according to any one of the first to sixth aspects, wherein an image is taken from the other surface side of the substrate. The surface position of the resin-impregnated base material is the same as the surface position opposite to the surface position of the resin-impregnated base material imaged from one side of the base material.

According to a eighth aspect of the present invention, there is provided a method for detecting a resin adhesion state according to any one of the first to seventh aspects, wherein an image corresponding to a surface shape of the resin layer is formed. The method of imaging from one surface side and the other surface side of the substrate, respectively, the image corresponding to the surface shape of the resin layer, after imaging from one surface side of the substrate, the other surface side of the substrate It is characterized in that it is a method of imaging from.

According to a ninth aspect of the present invention, there is provided a method for detecting a resin adhered state according to any one of the first to eighth aspects, wherein the shape characteristic value is obtained from the amount of light of a captured image. It is characterized in that the method for obtaining is a method using a total value of the light amounts of the captured images.

According to a tenth aspect of the present invention, there is provided a method for detecting a resin adhesion state according to any one of the first to eighth aspects, wherein the shape characteristic value is determined from the amount of light of a captured image. The method for obtaining the image is such that, after receiving a received image corresponding to a plurality of divided areas divided along the surface direction of the base material, the amount of light received for each of the divided areas is compared with a predetermined threshold to obtain a binary value. And then binarized 2
The method is characterized in that it is a method of calculating the number of divided areas of one of the value signals.

According to a eleventh aspect of the present invention, in the method of detecting a resin adhesion state according to any one of the first to tenth aspects, an image corresponding to the surface shape of the resin layer is formed. The method of obtaining the shape characteristic value of the surface shape of the resin layer from the amount of light of the captured image by capturing the image is performed by capturing an image corresponding to the surface shape of the resin layer a plurality of times, and obtaining the amount of light of the image captured a plurality of times. From the average value or the total value of the above.

According to a twelfth aspect of the present invention, there is provided a method for detecting a resin adhesion state according to any one of the first to eleventh aspects, wherein an image corresponding to a surface shape of the resin layer is formed. A method of obtaining a shape characteristic value of the surface shape of the resin layer from the amount of light of each of the imaged images by taking images from one surface side and the other surface side of the base material, respectively. After capturing the corresponding image from one surface side and the other surface side of the base material, respectively, it is a method of obtaining the shape characteristic value of the surface shape of the resin layer from the light amount of each captured image. Features.

According to a thirteenth aspect of the present invention, in the method for detecting a resin attached state according to any one of the first to twelfth aspects, the base material is a woven fabric. And

According to a fourteenth aspect of the present invention, there is provided a detection apparatus for detecting a resin adhesion state, which is used in the method for detecting a resin adhesion state according to any one of the first to thirteenth aspects.
On the surface of the resin-impregnated substrate, light in a direction intersecting obliquely to the virtual plane, the first light irradiation means for irradiating from one surface side of the substrate, and on the surface of the resin-impregnated substrate, The second light irradiating means for irradiating the light in the direction intersecting obliquely to the virtual surface from the other surface side of the base material, and the light irradiated by the first light irradiating means, of the resin layer, An image of light reflected on the surface, the first imaging means for imaging from one surface side of the base material, of the light irradiated by the second light irradiation means, the image of light reflected on the surface of the resin layer A second imaging unit that captures an image from the other surface side of the substrate, and an image captured by the first imaging unit, and input a shape characteristic value of a surface shape of the resin layer on one surface side of the substrate. The image captured by the first image processing means and the image captured by the second image capturing means is input to obtain the shape characteristics of the surface shape of the resin layer on the other surface side of the base material. The second image processing means for obtaining a value, and the shape characteristic values obtained by the first image processing means and the second image processing means are respectively inputted, and the shape characteristics on one surface side and the other surface side of the base material are input. Calculation / output means for calculating and outputting the difference between the values.

According to a fifteenth aspect of the present invention, in the resin adhering state detecting device according to the fourteenth aspect, light is emitted from the second light irradiation means on the surface of the resin impregnated base material. The irradiation position is the same position on the surface of the resin-impregnated substrate opposite to the position irradiated with light from the first light irradiation means.

According to a sixteenth aspect of the present invention, there is provided the resin adhesion state detecting device according to the fourteenth or fifteenth aspect, wherein the first imaging means and the second imaging means are made of a resin. It is formed so as to capture an image of light reflected on the surface of the resin layer while moving relatively to the impregnated base material.

According to the present invention, an image corresponding to the surface shape of the resin layer is captured, and a shape characteristic value corresponding to the surface shape of the resin layer is obtained from the amount of light of the captured image. Different numerical values are obtained depending on the size and number of the unevenness obtained, and the shape characteristic values obtained by imaging from one surface side and the other surface side of the base material are respectively detected using the difference. The difference between the thicknesses of the resin layers formed on the respective surfaces of the substrate can be quantitatively detected based on the magnitude of the difference.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for detecting a resin adhesion state according to the present invention will be described with reference to the drawings. FIG. 1 is a view for explaining an embodiment of a method for detecting a resin adhesion state according to the present invention. 2A and 2B are diagrams illustrating a case where the thickness of the resin layer is large, according to an embodiment of the method for detecting a resin adhesion state according to the present invention. FIG. 2A illustrates light reflection, and FIG. It is a figure showing the intensity | strength of. 3A and 3B are diagrams illustrating a case where the thickness of the resin layer is small, according to an embodiment of the method for detecting a resin adhesion state according to the present invention. FIG. 3A illustrates light reflection, and FIG. It is a figure showing the intensity | strength of. FIG. 4 is a view for explaining a modified example of one embodiment of the method for detecting a resin adhesion state according to the present invention, and FIG. 5 is another embodiment of the method for detecting a resin adhesion state according to the present invention. FIG. 6 is a view for explaining an embodiment, and FIG. 6 is a view for explaining still another embodiment of the method for detecting a resin adhesion state according to the present invention.

According to a first aspect of the present invention, there is provided a method for detecting a resin adhesion state, comprising impregnating a substrate made of fiber with a liquid thermosetting resin composition, and applying a resin to both surfaces of the substrate. This is a method for detecting a resin adhesion state in which a difference in thickness of a resin layer formed on each surface of a base material of a resin-impregnated base material having a layer formed thereon is detected.

[0027] A detecting apparatus used in an embodiment of the method for detecting the resin adhesion state (claims 14 to 1 of the present invention).
One embodiment of the apparatus for detecting a resin adhesion state according to No. 6)
As shown in FIG. 1, a resin-impregnated substrate 1 supplied continuously
A first light irradiating means 11 for irradiating the surface of the substrate 2 with light from one surface side, and a second light irradiating the surface of the resin impregnated substrate 1 with light from the other surface side of the substrate 2 Light irradiation means 12;
First imaging means 13 for capturing an image corresponding to the surface shape of the resin layer 3a on one surface side of the base material 2 and an image corresponding to the surface shape of the resin layer 3b on the other surface side of the base material 2 An image captured by the second image capturing means 14 and the first image capturing means 13 for capturing an image is input, and the shape characteristic value of the surface shape of the resin layer 3a on one surface side of the base material 2 is calculated based on the light amount of the image. Of the resin layer 3b on the other surface side of the substrate 2 based on the amount of light of the image captured by the first image processing unit 15 and the second image capturing unit 14 for obtaining The second image processing means 16 for calculating the values, and the shape characteristic values obtained by the first image processing means 15 and the second image processing means 16 are input, respectively, to one side and the other side of the substrate 2. After determining the difference between the side shape feature values, the difference is compared with a predetermined reference value set in advance. Comprising an arithmetic and output means 17 for outputting the comparison result. In addition, the said resin impregnation base material 1
It is continuously supplied from a resin impregnating device (not shown).

Note that the first light irradiating means 11 is
a, the base material 2 of the portion where the difference in thickness is to be detected
A parallel light in a direction obliquely intersecting a virtual plane 5 formed by connecting the centers of the thicknesses of the layers is irradiated to a slightly wider range than the portion to be detected on the surface of the resin-impregnated base material 1. It is supposed to.

The second light irradiating means 12 is provided on the surface of the resin-impregnated substrate 1 at the same position on the opposite side of the position where the first light irradiating means 11 irradiates light. The light irradiating unit 11 irradiates parallel light in a direction symmetric with respect to the virtual plane 5 with respect to the direction of the light irradiated by the light irradiation unit 11. The light emitted from the first light irradiating means 11 and the second light irradiating means 12 to the surface of the resin layer is not limited to parallel light, but if it is parallel light, detection accuracy is improved. preferable.

The image picked up by the first image pickup means 13 is illuminated by the first light irradiating means 11, and then the image of the virtual surface of the resin layer 3 a on one side of the substrate 2 is formed. An image of light that is specularly reflected at a portion parallel to 5 is captured, and an image captured by the second imaging unit 14 is irradiated with light from the second light irradiating unit 12, and In the surface of the resin layer 3b on the other surface side, an image of light that is specularly reflected at a portion parallel to the virtual surface 5 is captured.

In general, when the thickness of the resin layers 3a and 3b formed on the surface of the base material 2 is large, the fibers of the base material 2 or the irregularities formed by weaving the fibers are absorbed and the resin layer 3a , 3b are substantially smoothed, and the resin layers 3a, 3b
The surface shape of b is a surface shape substantially parallel to the virtual surface 5. Therefore, as shown in FIG. 2A, when the thickness of the resin layer 3 is large and most of the surface of the resin layer 3 is parallel to the virtual surface 5, most of the irradiated light 8 is applied to the resin layer 3.
Reflected on the surface of the first imaging means or the second imaging means, and the image taken by the first imaging means or the second imaging means is schematically represented by the intensity of light. , Light 8
The entire portion corresponding to the surface of the resin-impregnated base material 1 where the is irradiated is a region of strong light, as shown in FIG.

However, as shown in FIG.
In the case where the thickness of the resin layer 3 formed on the surface of the resin layer 3 is small and the unevenness of the base material 2 affects the surface of the resin layer 3 and the surface is uneven, 8 reflected at a portion where the surface shape is a surface parallel to the virtual surface 5
Is reflected in the direction of the first imaging means or the second imaging means, but the light 8 reflected in the non-parallel portion does not reflect in the direction of the first imaging means or the second imaging means, When the image captured by the first imaging unit or the second imaging unit is schematically represented by the intensity of light, the surface shape of the resin layer 3 is parallel to the virtual surface 5 as shown in FIG. The portion corresponding to the surface position is a region of strong light, and the portion corresponding to a position that is not parallel is a region of weak light. Note that the vertical axis in FIGS. 2B and 3B represents the light intensity, with the upper side representing a high value and the lower side representing a low value. The horizontal axis is shown in FIG.
(A) or a position corresponding to the surface position of the resin-impregnated base material 1 in FIG.

Therefore, in the first image processing means and the second image processing means, as a method of obtaining the shape characteristic value of the surface shape of the resin layer 3 from the light quantity of the image, the light 8 reflected on the surface of the resin layer 3 is used. Of these, when using the total value of the amount of light 8 reaching the first image processing means or the second image processing means,
In the case of the resin-impregnated base material 1 in which the difference in thickness between the resin layers 3 formed on the front and back surfaces of the base material 2 is large, the value on the side with the thick resin layer 3 is large, The value on the side of the thinner surface becomes smaller. Then, the value of the difference between the shape characteristic values on the one surface side and the other surface side of the base material 2 obtained by the calculation / output means increases.

However, when the difference between the thicknesses of the front and back resin layers 3 is small, the values of the shape characteristic values obtained by the first image processing means and the second image processing means are almost the same, and the calculation / output means The value of the difference between the shape characteristic values on the one surface side and the other surface side of the base material 2 to be obtained is small.

Therefore, there is a correlation between the difference between the thickness of the resin layer 3 formed on each surface of the base material and the difference between the shape characteristic values, and the thickness of the resin layer 3 formed on each surface of the base material is reduced. The difference can be detected using the shape feature value.

As described above, since the detection can be performed based on the surface shape of the resin layer 3, an effect that the detection is possible regardless of whether the resin layer 3 is transparent or opaque can be obtained. Further, in the case of the conventional manual detection, there is a problem that the standard varies from person to person, and in the case of a moving resin-impregnated base material, there is a problem that it is difficult. However, such a problem hardly occurs. Become.

When an image corresponding to the surface shape of the resin layer is picked up by the first image pickup means, the light irradiated from the second light irradiation means is not irradiated, and the image corresponding to the surface shape of the resin layer is not irradiated. When the image is captured by the second imaging means, it is preferable that the light irradiated from the first light irradiation means be non-irradiated, so that a decrease in detection accuracy caused by light transmitted from the opposite surface is prevented. In this case, for example, an image corresponding to the surface shape of the resin layer is imaged by the first imaging means from one surface side of the base material, and then imaged by the second imaging means from the other surface side of the base material. In this way, the images are taken at different timings. In such a case, the hardware portion of the first image processing unit and the second image processing unit are common, and if the image processing is performed at a shifted timing, the hardware portion of the detection device can be downsized. It is preferable.

Further, an image corresponding to the surface shape of the resin layer is picked up a plurality of times, and a shape characteristic value of the surface shape of the resin layer is obtained from an average value or a total value of the light amounts of the plurality of picked up images. May be. It is preferable that the captured image is an image captured at the same position because the detection accuracy is improved. Also,
The first imaging means and the second imaging means are formed to move relatively to the resin-impregnated base material, and the first imaging means and the second imaging means are moved, for example, in the width direction of the base material. It is preferable to take an image of the light reflected on the surface of the resin layer a plurality of times while moving it, since detection in consideration of in-plane variation of the resin-impregnated base material becomes possible.

In the first image processing means and the second image processing means, the shape characteristic value of the surface shape of the resin layer 3 is obtained from the light quantity of the image. The method is not limited to the method using the total value of the amount of light 8 that reaches the first image processing unit or the second image processing unit out of the light 8. After receiving the light corresponding to the plurality of divided areas, the amount of light received for each of the divided areas is compared with a predetermined threshold value, binarized, and then binarized.
A method may be used in which the number of divided areas of one of the value signals is obtained.

FIG. 4 shows a specific method for obtaining the number of divided areas of one of the binary signals.
As shown in (a), a plurality of divided areas 21 obtained by dividing an image (light intensity schematically represented) taken by the first imaging means or the second imaging means along the surface direction of the base material. , 21
, And then, as shown in FIG. 4 (b), the total amount of light reaching each of the divided areas 21, 21,.
Next, as shown in FIG. 4C, each of the divided areas 21, 21,...
For example, binarization processing is performed on 0 and 1, and the number of partitioned areas 21, 21,... In this case,
For example, when dust adheres to the surface of the resin layer 3, the distribution area 21 to which the dust adheres has the same value, and the distribution state is likely to be different from that of the surrounding division area 21. Therefore, this distribution state is detected using software. If it is formed as possible, it is possible to detect such adhesion of dust, and the detection accuracy is improved.

As a method for obtaining the shape characteristic value of the surface shape of the resin layer using the total value of the amount of light reaching the first image processing means or the second image processing means, the total value is used as it is. It may be used as a shape feature value, or may be converted into a plurality of values by a predetermined multi-step threshold value and used as a shape feature value.

Further, in the above embodiment, the images picked up by the first image pickup means and the second image pickup means correspond to the image of light which is specularly reflected at a portion of the surface of the resin layer parallel to the virtual plane. Although the method of capturing an image has been described, the method is not limited to this method, and an image of light reflected by a portion other than the portion parallel to the virtual surface may be captured. In this case, when the thickness of the resin layer formed on the surface of the base material is large and the surface shape of the resin layer is a plane parallel to the virtual surface, the intensity of the received light is low, When the thickness of the resin layer formed on the surface of the resin layer is small and light is scattered in various directions on the surface of the resin layer, the intensity of the received light increases, and the thickness of the resin layer increases due to a difference in shape characteristic value. The difference can be detected. Note that, in the case of a method of capturing an image of light that is specularly reflected at a portion parallel to the virtual surface, when the thickness of the resin layer is large, an image of particularly strong light is captured, and when the thickness of the resin layer is small, The image of weak light is captured, so the difference in light amount corresponding to the case where the resin layer is thick and the case where the resin layer is thin is large, and the difference in the shape characteristic value is also large, enabling detection with particularly excellent sensitivity Becomes

Also, in the above embodiment, the direction of the light radiated from the first light irradiating means to the surface of the resin layer and the direction of the light radiated from the second light irradiating means to the surface of the resin layer are as described above. Although a method that is a direction symmetric with respect to the virtual plane has been described, the present invention is not limited to this method, and if a difference in shape feature value caused by a difference in light angle is formed so as to be convertible, it is not symmetric. May be. In addition, it is preferable that the angle at which the light intersects the virtual plane be within a range of 25 to 65 degrees, since detection with particularly excellent accuracy can be performed.

In the surface of the resin-impregnated substrate, the position irradiated with light from the second light irradiating means is the same as the position opposite to the position irradiated with light from the first light irradiating means. There is no limitation, and when the in-plane variation of the thickness of the resin layer is small, the position may be slightly shifted as shown in FIG.

In the above embodiment, the method for detecting the difference in the thickness of the resin layer of the resin-impregnated substrate continuously supplied from the resin-impregnation apparatus has been described. After cutting to the size to be performed, detection may be performed. In this case, for example, as shown in FIG. 6, the resin-impregnated base material 1 is loaded on the loading means 18 having an opening and detected.

The substrate used for producing the resin-impregnated substrate is as follows:
The base material is made of fiber, and for example, a woven fabric (cloth) or nonwoven fabric (paper) using fibers such as glass fiber, aramid fiber, polyester fiber, and nylon fiber can be used. The use of a woven fabric is preferable because a printed wiring board having excellent dimensional stability can be obtained. Use of inorganic fibers such as glass cloth is preferable because a printed wiring board having excellent heat resistance and moisture resistance can be obtained. The woven fabric is
It is formed by weaving fibers into a cloth.
After the fiber is cut into an appropriate length, the fiber is formed into a paper by applying a temperature and a pressure as necessary, and then forming a paper together with a binder as necessary.

The substrate made of the fibers has irregularities on the surface because the fibers are exposed on the surface of the substrate. Further, the woven fabric has irregularities due to weaving in addition to irregularities due to the fibers, so that the irregularities are particularly large, and the detection method described above is particularly excellent in detection sensitivity and is preferable.

The fiber used may be a fiber composed of a yarn in which a plurality of filaments are converged by using a binder as necessary, or a fiber composed of a single filament. The thickness of the fiber is 0.5 to 2
000 denier is generally used.

The thermosetting resin composition used for producing the resin-impregnated base material is not particularly limited, and may be an epoxy resin type, a phenol resin type, a polyimide resin type, an unsaturated polyester resin type, or a polyphenylene ether. A thermosetting resin composition in general can be used, such as a resin alone, a modified product, and a mixture.

The thermosetting resin composition contains a thermosetting resin as an essential component and, if necessary, a curing agent, a curing accelerator, an inorganic filler, a solvent and the like for the thermosetting resin. be able to. A thermosetting resin having a low self-curing property, such as an epoxy resin, generally needs to contain a curing agent or the like for curing the resin. In addition, when the thermosetting resin is an epoxy resin type, a printed wiring board having an excellent balance between electrical properties and adhesiveness can be obtained, which is preferable.

The method for producing the resin-impregnated substrate by impregnating the substrate with the thermosetting resin composition is not particularly limited. For example, a resin varnish obtained by adjusting the viscosity of the thermosetting resin composition with a solvent is used. To impregnate or impregnate the substrate, or apply a liquid or thermofusible liquid thermosetting resin composition at room temperature to one surface of the substrate, and then reduce the viscosity by heating. Impregnate. In addition, the difference in thickness of the resin layer formed on each surface of the base material detected as described above is fed back to an apparatus for impregnating the base material with the thermosetting resin composition, and the heating temperature and the like are controlled. Such a formation is preferable because it is possible to obtain a resin-impregnated base material having a small difference in thickness of the resin layer formed on each surface of the base material.

The difference in the thickness of the resin layer may be detected when the thermosetting resin composition is in a liquid state. However, after the thermosetting resin composition is impregnated and heated, the thermosetting resin is heated. It is realistic to perform detection after the composition has been semi-cured to be in the B-stage state, since the thickness of the resin layer is less likely to fluctuate.

The amount of the thermosetting resin composition to be impregnated into the substrate is not particularly limited as long as the resin layer is impregnated to the extent that the resin layer is formed on both surfaces of the substrate. The thermosetting resin composition is impregnated so as to be 40 to 70 parts by weight with respect to the total of 100 parts by weight of the composition and the base material.

Next, claim 14 to claim 16 of the present invention.
The apparatus for detecting a resin-impregnated substrate according to the above is described. Since the apparatus for detecting a resin-impregnated base material according to claims 14 to 16 of the present invention is configured as described above, when detection is performed as described above, each surface of the resin-impregnated base material is detected. It is possible to quantitatively detect the difference in thickness of the resin layer formed on the substrate.

[0055]

According to the first to thirteenth aspects of the present invention, in the method for detecting a resin adhesion state, an image corresponding to a surface shape of a resin layer is formed on one side and the other side of a base material, respectively. The image is taken, the shape characteristic values of the surface shape of the resin layer are respectively obtained, and then detected using the difference between the obtained shape characteristic values, the resin layer formed on each surface of the resin-impregnated base material is detected. The difference in thickness can be quantitatively detected.

By using the resin-impregnated substrate detecting device according to the fourteenth to sixteenth aspects of the present invention, the difference in the thickness of the resin layer formed on each surface of the resin-impregnated substrate is quantitatively detected. It becomes possible.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an embodiment of a method for detecting a resin adhesion state according to the present invention.

FIGS. 2A and 2B are diagrams illustrating a case where a resin layer is thick in one embodiment of a method for detecting a resin adhesion state according to the present invention, wherein FIG. 2A illustrates light reflection, and FIG. It is a figure showing the intensity of light.

3A and 3B are diagrams illustrating a case where the thickness of a resin layer is small, according to an embodiment of the method for detecting a resin adhesion state according to the present invention. FIG. 3A illustrates light reflection, and FIG. It is a figure showing the intensity of light.

FIG. 4 is a diagram illustrating a modification of the embodiment of the method for detecting a resin adhesion state according to the present invention.

FIG. 5 is a diagram illustrating another embodiment of the method for detecting a resin adhesion state according to the present invention.

FIG. 6 is a diagram illustrating still another embodiment of the method for detecting a resin adhesion state according to the present invention.

FIG. 7 is a diagram illustrating a method for producing a resin-impregnated base material.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin impregnated base material 2 Base material 3, 3a, 3b Resin layer 5 Virtual surface 8 Light 11 First light irradiation means 12 Second light irradiation means 13 First imaging means 14 Second imaging means 15 First Image processing means 16 Second image processing means 17 Calculation / output means 21 Partition area 22 Threshold value 31 Resin varnish 35 Impregnation tank 36 Roll

Claims (16)

[Claims] 1. A resin-impregnated base material in which a liquid thermosetting resin composition is impregnated into a base material made of fibers, and a resin layer is formed on both surfaces of the base material. In the method of detecting the resin adhesion state to detect the difference in the thickness of the resin layer, the method of detecting the difference in the thickness of the resin layer formed on each surface of the substrate, the image corresponding to the surface shape of the resin layer,
Image is taken from one surface side and the other surface side of the base material, and the shape characteristic value of the surface shape of the resin layer is obtained from the amount of light of each of the imaged images. A method for detecting a difference in thickness of the resin layer by calculating a difference between shape characteristic values on the surface side and the other surface side. 2. A method of imaging an image corresponding to the surface shape of a resin layer from one surface side and the other surface side of a base material, respectively, is a virtual plane formed by connecting centers of thickness of the base material. The substrate is irradiated with light in a direction obliquely intersecting with the surface of the resin layer from one surface side and the other surface side of the substrate, and of the irradiated light, the light reflected on the surface of the resin layer The method of detecting a resin adhesion state according to claim 1, wherein the method is a method of imaging the image of (1) from one surface side and the other surface side of the base material, respectively. 3. The method of imaging an image of light reflected on the surface of the resin layer is a method of imaging light regularly reflected on a portion of the surface of the resin layer parallel to the virtual plane. The method for detecting a resin adhesion state according to claim 2. 4. The direction of light irradiating the surface of the resin layer from one side of the substrate and the direction of light irradiating the surface of the resin layer from the other side of the substrate are different from each other with respect to the virtual plane. 4. The method according to claim 2, wherein the directions are symmetrical. 5. The method according to claim 2, wherein the light applied to the surface of the resin layer is parallel light. 6. When capturing an image corresponding to the surface shape of the resin layer from one surface side of the base material, light irradiated from the other surface side of the base material is not irradiated, and the surface shape of the resin layer is not changed. 6. The method according to claim 2, wherein when a corresponding image is taken from the other surface side of the base material, light emitted from one surface side of the base material is not irradiated. The method for detecting a resin adhesion state described in the above. 7. The surface position of the resin-impregnated base material imaged from the other surface side of the base material is the same as the surface position opposite to the surface position of the resin-impregnated base material imaged from one surface side of the base material. The method for detecting a resin adhesion state according to any one of claims 1 to 6, wherein: 8. A method of imaging an image corresponding to the surface shape of a resin layer from one surface side and the other surface side of a base material, respectively, the method comprising: The method for detecting a resin adhering state according to any one of claims 1 to 7, wherein the method is a method of taking an image from the other side of the base material after taking an image from the surface side. 9. The method according to claim 1, wherein the method of obtaining the shape feature value from the light quantity of the captured image is a method using a total value of the light quantity of the captured image. Method for detecting the resin adhesion state. 10. A method for obtaining a shape feature value from a light quantity of a captured image includes: receiving light corresponding to a plurality of partitioned areas obtained by dividing a captured image along a surface direction of a base material; The received light amount is compared with a predetermined threshold value, and 2
The resin according to any one of claims 1 to 8, wherein the method is a method of performing a binarization process, and then calculating the number of divided regions of any one of the binarized binary signals. How to detect the state of adhesion. 11. A method of capturing an image corresponding to the surface shape of a resin layer and obtaining a shape characteristic value of the surface shape of the resin layer from the amount of light of the captured image is performed by an image corresponding to the surface shape of the resin layer. 11. A method in which a plurality of images are captured a plurality of times, and a shape characteristic value of a surface shape of the resin layer is obtained from an average value or a total value of light amounts of the plurality of captured images. The method for detecting a resin adhesion state according to any one of the above. 12. An image corresponding to the surface shape of the resin layer,
The method of imaging from the one surface side and the other surface side of the base material, and obtaining the shape characteristic value of the surface shape of the resin layer from the light amount of each image captured corresponds to the surface shape of the resin layer. The image to be formed is captured from one surface side and the other surface side of the base material, respectively, and then the shape characteristic value of the surface shape of the resin layer is obtained from the light amount of each captured image. Claim 1
The method for detecting a resin adhesion state according to any one of claims 1 to 11. 13. The base material is a woven fabric,
The method for detecting a resin adhesion state according to claim 1. 14. A detection device for use in the method for detecting a resin adhesion state according to claim 1, wherein the detection device intersects a surface of the resin-impregnated base material in an oblique direction with respect to the virtual plane. The first light irradiation means for irradiating the light in the direction to be applied from one surface side of the base material, and the light in the direction intersecting obliquely to the virtual surface on the surface of the resin-impregnated base material, The second light irradiating means for irradiating from the other surface side of the substrate, and of the light irradiating from the first light irradiating means, an image of light reflected on the surface of the resin layer is captured from one surface side of the base material First image capturing means, and of the light irradiated by the second light irradiating means, an image of light reflected on the surface of the resin layer, a second image capturing means for capturing an image from the other surface side of the base material, An image captured by the first imaging unit is input, and a shape characteristic value of a surface shape of the resin layer on one surface side of the base material is obtained. One image processing means, an image captured by the second imaging means, and a second image processing means for obtaining a shape characteristic value of a surface shape of the resin layer on the other surface side of the base material; Calculation / output means for inputting the shape characteristic values obtained by the image processing means and the second image processing means, calculating and outputting the difference between the shape characteristic values on one surface side and the other surface side of the base material, A detection device for detecting a resin adhesion state. 15. A position on the surface of the resin-impregnated substrate irradiated with light from the second light irradiating means is irradiated with light from the first light irradiating means on the surface of the resin-impregnated substrate. The resin adhesion state detecting device according to claim 14, wherein the position is the same position on the opposite surface. 16. The first imaging means and the second imaging means are formed so as to capture an image of light reflected on the surface of the resin layer while moving relatively to the resin-impregnated base material. The resin detection state detecting device according to claim 14 or 15, wherein: